Abstract: In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conductively connected to a segment of the metallic conductor, the thermal conduction cross section of the at least one connecting web being designed to be so small that when the contact segment is intensely heated, the connecting web has a throttling effect on the heat flow to the segment of the conductor.

Abstract: In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conductively connected to a segment of the metallic conductor, the thermal conduction cross section of the at least one connecting web being designed to be so small that when the contact segment is intensely heated, the connecting web has a throttling effect on the heat flow to the segment of the conductor.

Abstract: A housing for an electrical device is proposed that contains electrical or electronic components and that is capable of being submersed in a liquid medium. A pressure-equalization element (2) is present on the housing (1), by means of Which compensation of the pressure inside the housing (1) with the outside pressure can be obtained. The outside pressure is delivered to the pressure-equalization element (2) via a submersible bulb (5) that is also submersed in the liquid medium, and the enclosed air volume of which has an active connection with the outside of the pressure-equalization element (2). The volume of air in the submersible bulb (5) is dimensioned so that it is greater than the volume of air to be tracked given a specified temperature decrease in the housing (1).