Patents by Inventor Kai C. Ng

Kai C. Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die-up integrated circuit package with grounded stiffener
    Patent number: 7573131
    Abstract: A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate by wire bonding through an open slot in the stiffener. The die is not wire bonded to the stiffener. Solder balls are attached on a bottom side of the substrate and electrically connected to ground bond fingers of the substrate, and also are directly attached to solderable pads on the bottom side of the stiffener through open holes or plated through-holes on the substrate, so as to have the stiffener function as a ground plane and as a heat sink for power dissipation.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: August 11, 2009
    Assignee: Compass Technology Co., Ltd.
    Inventors: Cheng Qiang Cui, Kai C. Ng, Chee Wah Cheung
  • Die-up integrated circuit package with grounded stiffener
    Publication number: 20080099898
    Abstract: A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate by wire bonding through an open slot in the stiffener. The die is not wire bonded to the stiffener. Solder balls are attached on a bottom side of the substrate and electrically connected to ground bond fingers of the substrate, and also are directly attached to solderable pads on the bottom side of the stiffener through open holes or plated through-holes on the substrate, so as to have the stiffener function as a ground plane and as a heat sink for power dissipation.
    Type: Application
    Filed: October 27, 2006
    Publication date: May 1, 2008
    Inventors: Cheng Qiang Cui, Kai C. Ng, Chee Wah Cheung