Patents by Inventor Kai Chan
Kai Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250246463Abstract: An analysis method and an analysis device for a semiconductor manufacturing process are provided. The analysis method of the semiconductor manufacturing process includes the following steps. A semiconductor machine log file is loaded. A plurality of machine action events are defined from the semiconductor manufacturing machine log file. A wafer moving path map is generated according to a wafer moving information file. A plurality of account point information are bound to each of the machine action events according to the wafer moving path map. A wafer movement tracking graph is generated according to the machine action events that have been bound to account information.Type: ApplicationFiled: March 11, 2024Publication date: July 31, 2025Inventors: Chuang-Tse WANG, Kuang-Hsien TSENG, Chun-Kai CHAN, Chen-Chuan YU, Po-Sheng LEE
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Patent number: 12369000Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.Type: GrantFiled: April 28, 2023Date of Patent: July 22, 2025Assignee: Transducer Star Technology INC.Inventors: Yu-Chen Chen, Chun-Kai Chan, Hsu-Hsiang Cheng, Ming-Ching Cheng
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Publication number: 20250203776Abstract: A substrate structure includes a substrate and a vertical conductive connector. The substrate includes a material with a heat resistance temperature of 300° C. or greater. The vertical conductive connector penetrates through the substrate. The vertical conductive connector has a bonding structure extending toward the substrate. A manufacturing method of the substrate structure is also provided.Type: ApplicationFiled: April 30, 2024Publication date: June 19, 2025Applicant: Unimicron Technology Corp.Inventors: Chin-Sheng Wang, Chih-Kai Chan, Hsuan-Chung Chan, Shih-Lian Cheng
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Publication number: 20250177573Abstract: The present invention relates to an agent that increases expression of IRAK-M and/or activity of IRAK-M for use in a method of treatment or prophylaxis of macular degeneration in a subject. The agent may be one or more of a small molecule, a nucleic acid, a vector virion, a polypeptide, a nucleic acid system, a viral vector system, or a pharmaceutical composition.Type: ApplicationFiled: November 18, 2022Publication date: June 5, 2025Applicant: The University of BristolInventors: Ying Kai Chan, Andrew Dick, Jian Liu
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Publication number: 20250174295Abstract: A memory device test system includes a memory device, a tester, a system board, and an interface card. The tester generates a first control signal corresponding to a test being performed to the memory device. The system board is coupled to the tester and generates, in response to the first control signal, a second control signal to the memory device. The interface card is coupled to the tester, the system board, and the memory device and transmits to the memory device, in response to a switch signal received from the tester, a power signal from the tester through a first conductive path or from the system board through a second conductive path. The memory device generates, in response to the power signal and the second control signal, an output signal corresponding to the test to the tester.Type: ApplicationFiled: November 28, 2023Publication date: May 29, 2025Inventors: Yi-Kai HUANG, Hung-Kai CHAN, Ting Hsuan LIN
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Publication number: 20250169038Abstract: Embodiments presented herein include systems and methods for cooling a device, such as a computing system for an autonomous vehicle. In one or more embodiments, a linear drive actuator may be employed to circulate cooling fluid (or coolant) to the computing system. Unlike typical hydraulic or linear actuators, embodiments herein are capable of consistent directional circulation of the fluid while the actuator is moving in both forward and backward directions. Using a linear actuator not only uses fewer parts as compared to current cooling systems, but such embodiments have additional benefits. A linear actuator cooling system can use a smaller motor than traditional pump cooling systems, has more control relative to rate and pressure, produces less noise, produces fewer vibrations, and has a longer lifespan. Embodiments may also be configured to facilitate circulation of the coolant even in the event of a controller or motor actuator malfunction.Type: ApplicationFiled: November 17, 2023Publication date: May 22, 2025Applicant: Apollo Autonomous Driving USA LLCInventors: Baoping YUAN, Kenneth Yu-Kai CHAN, Yongqiang WANG, Hang ZHAO, Yaoming SHEN
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Publication number: 20250114856Abstract: A method for controlling a power beam process includes carrying out a plurality of test power beam processes using a power beam on one or more test components and determining a plurality of power distributions corresponding to the plurality of test power beam processes. The method includes determining a plurality of beam parameters, generating derived features based on the plurality of beam parameters, and determining a plurality of process characteristics of each test power beam process. The method further includes generating a comprehensive dataset, dividing the comprehensive dataset into a test dataset and a training dataset, and determining a plurality of key discriminative features from the plurality of derived features of a set of training power distributions of the training dataset.Type: ApplicationFiled: September 6, 2024Publication date: April 10, 2025Applicant: ROLLS-ROYCE plcInventors: Alistair J E SMITH, Kee Khoon Lee, Henry KASIM, Teck Kai CHAN
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Publication number: 20250096145Abstract: An electronic packaging structure including a first circuit structure and a second circuit structure is provided. An electronic component is disposed between the first circuit structure and the second circuit structure. At least one of the first circuit structure and the second circuit structure (for example, the second circuit structure) has a cavity. The electronic component is embedded in the cavity, and may be encapsulated between the first circuit structure and the second circuit structure.Type: ApplicationFiled: December 2, 2024Publication date: March 20, 2025Applicant: Unimicron Technology Corp.Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Chun-Hsien Chien
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Patent number: 12178634Abstract: Sounds produced by internal organs of the body can be used to monitor health conditions related to, for example, the heart and lungs. The present disclosure includes an electronic stethoscope that may be positioned by a user on locations of the body to record sounds from organs. The present disclosure also includes visual algorithms to guide positioning of the electronic stethoscope and audio diagnostic algorithms for providing analysis of recorded sounds.Type: GrantFiled: April 11, 2024Date of Patent: December 31, 2024Assignee: Korion Health Inc.Inventors: Galen Charles Pershing Kirkpatrick, Anna Li, Thomas Hastings Greer, IV, Akshaya Poorani Anand, Nicholas Chen, Eunice Chee-Kay Chan
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Publication number: 20240414850Abstract: A circuit board structure includes a core layer, at least one electroplating metal layer, at least one dielectric layer and at least one conductive metal layer. The core layer includes at least one dielectric portion and at least one metal portion. The electroplating metal layer is disposed on at least one of a first surface and a second surface of the core layer, exposing a portion of at least one of the first surface and the second surface and at least connecting the at least one metal part. The dielectric layer is disposed on at least one of the first surface and the second surface and on the electroplating metal layer. The dielectric layer has at least one opening exposing a portion of the electroplating metal layer. The conductive metal layer is disposed in the opening of the dielectric layer and is correspondingly connected to the electroplating metal layer.Type: ApplicationFiled: January 4, 2024Publication date: December 12, 2024Applicant: Unimicron Technology Corp.Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Shih-Lian Cheng
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Publication number: 20240384295Abstract: Provided herein, in some embodiments, are recombinant viral genomes comprising an inhibitory oligonucleotide that reduces inflammation for use, for example, in gene therapy.Type: ApplicationFiled: April 8, 2024Publication date: November 21, 2024Applicant: President and Fellows of Harvard CollegeInventors: Ying Kai Chan, George M. Church
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Publication number: 20240252139Abstract: Sounds produced by internal organs of the body can be used to monitor health conditions related to, for example, the heart and lungs. The present disclosure includes an electronic stethoscope that may be positioned by a user on locations of the body to record sounds from organs. The present disclosure also includes visual algorithms to guide positioning of the electronic stethoscope and audio diagnostic algorithms for providing analysis of recorded sounds.Type: ApplicationFiled: April 11, 2024Publication date: August 1, 2024Inventors: Galen Charles Pershing Kirkpatrick, Anna Li, Thomas Hastings Greer, IV, Akshaya Poorani Anand, Nicholas Chen, Eunice Chee-Kay Chan
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Patent number: 12045396Abstract: A floated button and a vehicle screen assembly are provided. The vehicle screen assembly includes a display and the floated button. The floated button includes an adapter board electrically connect to a controller and a power source of the vehicle screen assembly through signal cables; a fixed base includes a receiving space, the adapter board is received in the receiving space, and the fixed base is connected to a rotation motor holder of the vehicle screen assembly; a button supporter arranged on the fixed base; and a button module arranged on the button supporter and floated on a side of the display. The button module includes a plurality of buttons arranged along a broadside extending direction. The buttons are electrically connected to the adapter board, and each of the buttons is configured to transmit corresponding button data to the controller through the adapter board when the button is triggered.Type: GrantFiled: August 10, 2023Date of Patent: July 23, 2024Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.Inventor: Chao-Kai Chan
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Publication number: 20240236582Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.Type: ApplicationFiled: April 28, 2023Publication date: July 11, 2024Inventors: YU-CHEN CHEN, CHUN-KAI CHAN, HSU-HSIANG CHENG, MING-CHING CHENG
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Publication number: 20240224804Abstract: A sampling front-end for analog to digital converter is presented that shares a high speed N-bit ADC at front-end and interleaves the pipelined residue amplification with shared amplifier, which achieves high speed, low power and compact area with high density capacitive DAC structure.Type: ApplicationFiled: January 3, 2023Publication date: July 4, 2024Inventors: Jhih-Jhe WANG, Sung-Cheng LO, Chun-Kai CHAN, Cheng-Syun LI, Ming-Ching CHENG, Yu-Chen CHEN, Hsu-Hsiang CHENG
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Patent number: 11981911Abstract: Provided herein, in some embodiments, are recombinant viral genomes comprising an inhibitory oligonucleotide that reduces inflammation for use, for example, in gene therapy.Type: GrantFiled: November 8, 2018Date of Patent: May 14, 2024Assignee: President and Fellows of Harvard CollegeInventors: Ying Kai Chan, George M. Church
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Publication number: 20240137709Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.Type: ApplicationFiled: April 27, 2023Publication date: April 25, 2024Inventors: YU-CHEN CHEN, CHUN-KAI CHAN, HSU-HSIANG CHENG, MING-CHING CHENG
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Patent number: 11947868Abstract: A method for muting and unmuting a microphone is provided. The method includes providing a processor, receiving an input microphone signal, measuring the input microphone signal for a loudness level at a sampling rate, calculating a mute threshold level, checking if the loudness level is higher than or equal to the mute threshold level, and resetting a mute delay timer upon determining that the loudness level is higher than or equal to the mute threshold level and obtaining the input microphone signal, or checking if the mute delay timer is running upon determining that the loudness level is not higher than or equal to the mute threshold level and attenuating the input microphone signal if the mute delay timer is not running or obtaining the input microphone signal if the mute delay timer is still running, and writing the input microphone signal or attenuated input microphone signal to an output buffer.Type: GrantFiled: December 28, 2021Date of Patent: April 2, 2024Assignee: CREATIVE TECHNOLOGY LTD.Inventors: Kee Seng Tan, Luen Kai Chan, Ariel Arellano De Castro
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Publication number: 20240105200Abstract: A method for selective noise suppression in an audio playback is provided. The method includes providing a processor, obtaining a microphone state and a playback device state with the processor from an operating system, determining the audio playback is communication audio based on the microphone state and the playback device state, and enabling applying noise suppression to the audio playback if the audio playback is communication audio, is not music and noise is present, or otherwise disabling applying noise suppression to the audio playback.Type: ApplicationFiled: August 25, 2023Publication date: March 28, 2024Applicant: Creative Technology LtdInventors: Kee Seng TAN, Luen Kai CHAN, Ariel Arellano DE CASTRO
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Publication number: 20240088033Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.Type: ApplicationFiled: March 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chao-Kai Chan, Chung-Hao Tsai, Chuei-Tang WANG, Wei-Ting Chen