Abstract: A method of managing an exercise routine of a person, involves providing at least one earbud, the at least one earbud capable of playing an audio file to the person wearing the at least one earbud, the at least one earbud comprising sensors for monitoring physiological data of the person, and based on the physiological data of the person, the at least one earbud providing audio feedback of target exercise parameters, rates, or both target exercise parameters and rates, to help the person optimize physical activity of the person. An apparatus includes a signal processor connected to the at least one earbud, wherein said apparatus is configured to perform the method.

Abstract: A method and system include receiving data associated with one or more tasks; determining an image associated with each of the one or more tasks; presenting each of the images on a display; receiving a selection of one of the images; translating the selected image from a first portion of the display associated with a list of unassigned images associated with tasks to a second portion of the display associated with a timeline. Numerous other aspects are provided.

Abstract: A fluid pump includes a chamber and a plunger extending into the chamber and supported for sliding movement on a suction stroke to introduce fluid into the chamber and on a discharge stroke to force fluid out of the chamber. A driver slides the pumping member in opposite directions. A seal ring is located between the chamber and the pumping member and permits the sliding movement of the pumping member. The seal ring has an outer annular portion having a generally flat cross-section, clamped in a wall of the chamber and an inner annular portion having a bulbous cross-section and in sliding sealing engagement with the pumping member.

Abstract: A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which is internally prestressed and is adhesive on both faces, between the rear face of the semiconductor chip and a chip connecting surface on a circuit mount.

Abstract: A semiconductor package comprises a substrate which includes a plurality of conducting traces and upper contact areas on its upper surface and a second plurality of lower conductive traces and external contact areas on its bottom surface and external conducting members attached to the external contact areas. The semiconductor package also includes a semiconductor die comprising an active surface with a plurality of die contact pads, electrically connected to the contact areas of the substrate by conducting members. A support layer between the conducting members on the active surface of the semiconductor die covers at least the base portion of the conducting members. A method relates to the production of the semiconductor package.

Abstract: A personal audio player has a housing, an audio output device in the housing and an audio player in the housing and coupled with the output device for storing and playing audio files. A plurality of different display panels are located on the housing. Each display panel is controlled to have a unique presentation format for presenting different information to a user. A user interface on the housing has a plurality of different illumination colors corresponding to different operation modes of the audio player. A lyrics processor outputs lyric text to one of the display panels in synchronisation with playing of a corresponding audio file.

Abstract: A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one embodiment, the panel includes a composite board with semiconductor chips arranged in rows and columns in a corresponding plastic package molding compound with a plurality of semiconductor component positions. The thickness of the plastic package molding compound corresponds to the thickness of the semiconductor chips so that a coplanar upper side and a coplanar rear side are formed on the composite board. Located on the coplanar rear side of the composite board is a plastic layer whose coefficient of thermal expansion corresponds to the coefficient of thermal expansion of the composite board. Located on the coplanar upper side of the composite board is a wiring structure which has corresponding external contacts.

Abstract: An organic extract of a Chinese herbal medicine Geum Japonicum thunb var. has been identified that displayed potent stimulatory effects on rapid agiogenesis (<24 h), myogenesis and blocking fibrosis in traumatized skeletal muscles. The extract has displayed potent dual effects on angiogenesis and myogenesis in damaged skeletal muscles leading to complete skeletal muscle healing in rabbit and rat animal models. The extract of the present invention can be developed into an effective therapeutic drug for the treatment of skeletal muscle trauma, soft tissue healing including burn, skin wound and operation cut, and bone fracture and defect healings.