Patents by Inventor Kai Chan

Kai Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250246463
    Abstract: An analysis method and an analysis device for a semiconductor manufacturing process are provided. The analysis method of the semiconductor manufacturing process includes the following steps. A semiconductor machine log file is loaded. A plurality of machine action events are defined from the semiconductor manufacturing machine log file. A wafer moving path map is generated according to a wafer moving information file. A plurality of account point information are bound to each of the machine action events according to the wafer moving path map. A wafer movement tracking graph is generated according to the machine action events that have been bound to account information.
    Type: Application
    Filed: March 11, 2024
    Publication date: July 31, 2025
    Inventors: Chuang-Tse WANG, Kuang-Hsien TSENG, Chun-Kai CHAN, Chen-Chuan YU, Po-Sheng LEE
  • Patent number: 12369000
    Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: July 22, 2025
    Assignee: Transducer Star Technology INC.
    Inventors: Yu-Chen Chen, Chun-Kai Chan, Hsu-Hsiang Cheng, Ming-Ching Cheng
  • Publication number: 20250203776
    Abstract: A substrate structure includes a substrate and a vertical conductive connector. The substrate includes a material with a heat resistance temperature of 300° C. or greater. The vertical conductive connector penetrates through the substrate. The vertical conductive connector has a bonding structure extending toward the substrate. A manufacturing method of the substrate structure is also provided.
    Type: Application
    Filed: April 30, 2024
    Publication date: June 19, 2025
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Chih-Kai Chan, Hsuan-Chung Chan, Shih-Lian Cheng
  • Publication number: 20250177573
    Abstract: The present invention relates to an agent that increases expression of IRAK-M and/or activity of IRAK-M for use in a method of treatment or prophylaxis of macular degeneration in a subject. The agent may be one or more of a small molecule, a nucleic acid, a vector virion, a polypeptide, a nucleic acid system, a viral vector system, or a pharmaceutical composition.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 5, 2025
    Applicant: The University of Bristol
    Inventors: Ying Kai Chan, Andrew Dick, Jian Liu
  • Publication number: 20250174295
    Abstract: A memory device test system includes a memory device, a tester, a system board, and an interface card. The tester generates a first control signal corresponding to a test being performed to the memory device. The system board is coupled to the tester and generates, in response to the first control signal, a second control signal to the memory device. The interface card is coupled to the tester, the system board, and the memory device and transmits to the memory device, in response to a switch signal received from the tester, a power signal from the tester through a first conductive path or from the system board through a second conductive path. The memory device generates, in response to the power signal and the second control signal, an output signal corresponding to the test to the tester.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 29, 2025
    Inventors: Yi-Kai HUANG, Hung-Kai CHAN, Ting Hsuan LIN
  • Publication number: 20250169038
    Abstract: Embodiments presented herein include systems and methods for cooling a device, such as a computing system for an autonomous vehicle. In one or more embodiments, a linear drive actuator may be employed to circulate cooling fluid (or coolant) to the computing system. Unlike typical hydraulic or linear actuators, embodiments herein are capable of consistent directional circulation of the fluid while the actuator is moving in both forward and backward directions. Using a linear actuator not only uses fewer parts as compared to current cooling systems, but such embodiments have additional benefits. A linear actuator cooling system can use a smaller motor than traditional pump cooling systems, has more control relative to rate and pressure, produces less noise, produces fewer vibrations, and has a longer lifespan. Embodiments may also be configured to facilitate circulation of the coolant even in the event of a controller or motor actuator malfunction.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 22, 2025
    Applicant: Apollo Autonomous Driving USA LLC
    Inventors: Baoping YUAN, Kenneth Yu-Kai CHAN, Yongqiang WANG, Hang ZHAO, Yaoming SHEN
  • Publication number: 20250114856
    Abstract: A method for controlling a power beam process includes carrying out a plurality of test power beam processes using a power beam on one or more test components and determining a plurality of power distributions corresponding to the plurality of test power beam processes. The method includes determining a plurality of beam parameters, generating derived features based on the plurality of beam parameters, and determining a plurality of process characteristics of each test power beam process. The method further includes generating a comprehensive dataset, dividing the comprehensive dataset into a test dataset and a training dataset, and determining a plurality of key discriminative features from the plurality of derived features of a set of training power distributions of the training dataset.
    Type: Application
    Filed: September 6, 2024
    Publication date: April 10, 2025
    Applicant: ROLLS-ROYCE plc
    Inventors: Alistair J E SMITH, Kee Khoon Lee, Henry KASIM, Teck Kai CHAN
  • Publication number: 20250096145
    Abstract: An electronic packaging structure including a first circuit structure and a second circuit structure is provided. An electronic component is disposed between the first circuit structure and the second circuit structure. At least one of the first circuit structure and the second circuit structure (for example, the second circuit structure) has a cavity. The electronic component is embedded in the cavity, and may be encapsulated between the first circuit structure and the second circuit structure.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Chun-Hsien Chien
  • Patent number: 12178634
    Abstract: Sounds produced by internal organs of the body can be used to monitor health conditions related to, for example, the heart and lungs. The present disclosure includes an electronic stethoscope that may be positioned by a user on locations of the body to record sounds from organs. The present disclosure also includes visual algorithms to guide positioning of the electronic stethoscope and audio diagnostic algorithms for providing analysis of recorded sounds.
    Type: Grant
    Filed: April 11, 2024
    Date of Patent: December 31, 2024
    Assignee: Korion Health Inc.
    Inventors: Galen Charles Pershing Kirkpatrick, Anna Li, Thomas Hastings Greer, IV, Akshaya Poorani Anand, Nicholas Chen, Eunice Chee-Kay Chan
  • Publication number: 20240414850
    Abstract: A circuit board structure includes a core layer, at least one electroplating metal layer, at least one dielectric layer and at least one conductive metal layer. The core layer includes at least one dielectric portion and at least one metal portion. The electroplating metal layer is disposed on at least one of a first surface and a second surface of the core layer, exposing a portion of at least one of the first surface and the second surface and at least connecting the at least one metal part. The dielectric layer is disposed on at least one of the first surface and the second surface and on the electroplating metal layer. The dielectric layer has at least one opening exposing a portion of the electroplating metal layer. The conductive metal layer is disposed in the opening of the dielectric layer and is correspondingly connected to the electroplating metal layer.
    Type: Application
    Filed: January 4, 2024
    Publication date: December 12, 2024
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Shih-Lian Cheng
  • Publication number: 20240384295
    Abstract: Provided herein, in some embodiments, are recombinant viral genomes comprising an inhibitory oligonucleotide that reduces inflammation for use, for example, in gene therapy.
    Type: Application
    Filed: April 8, 2024
    Publication date: November 21, 2024
    Applicant: President and Fellows of Harvard College
    Inventors: Ying Kai Chan, George M. Church
  • Publication number: 20240252139
    Abstract: Sounds produced by internal organs of the body can be used to monitor health conditions related to, for example, the heart and lungs. The present disclosure includes an electronic stethoscope that may be positioned by a user on locations of the body to record sounds from organs. The present disclosure also includes visual algorithms to guide positioning of the electronic stethoscope and audio diagnostic algorithms for providing analysis of recorded sounds.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 1, 2024
    Inventors: Galen Charles Pershing Kirkpatrick, Anna Li, Thomas Hastings Greer, IV, Akshaya Poorani Anand, Nicholas Chen, Eunice Chee-Kay Chan
  • Patent number: 12045396
    Abstract: A floated button and a vehicle screen assembly are provided. The vehicle screen assembly includes a display and the floated button. The floated button includes an adapter board electrically connect to a controller and a power source of the vehicle screen assembly through signal cables; a fixed base includes a receiving space, the adapter board is received in the receiving space, and the fixed base is connected to a rotation motor holder of the vehicle screen assembly; a button supporter arranged on the fixed base; and a button module arranged on the button supporter and floated on a side of the display. The button module includes a plurality of buttons arranged along a broadside extending direction. The buttons are electrically connected to the adapter board, and each of the buttons is configured to transmit corresponding button data to the controller through the adapter board when the button is triggered.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: July 23, 2024
    Assignees: Futaijing Precision Electronics (Yantai) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Chao-Kai Chan
  • Publication number: 20240236582
    Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.
    Type: Application
    Filed: April 28, 2023
    Publication date: July 11, 2024
    Inventors: YU-CHEN CHEN, CHUN-KAI CHAN, HSU-HSIANG CHENG, MING-CHING CHENG
  • Publication number: 20240224804
    Abstract: A sampling front-end for analog to digital converter is presented that shares a high speed N-bit ADC at front-end and interleaves the pipelined residue amplification with shared amplifier, which achieves high speed, low power and compact area with high density capacitive DAC structure.
    Type: Application
    Filed: January 3, 2023
    Publication date: July 4, 2024
    Inventors: Jhih-Jhe WANG, Sung-Cheng LO, Chun-Kai CHAN, Cheng-Syun LI, Ming-Ching CHENG, Yu-Chen CHEN, Hsu-Hsiang CHENG
  • Patent number: 11981911
    Abstract: Provided herein, in some embodiments, are recombinant viral genomes comprising an inhibitory oligonucleotide that reduces inflammation for use, for example, in gene therapy.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: May 14, 2024
    Assignee: President and Fellows of Harvard College
    Inventors: Ying Kai Chan, George M. Church
  • Publication number: 20240137709
    Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.
    Type: Application
    Filed: April 27, 2023
    Publication date: April 25, 2024
    Inventors: YU-CHEN CHEN, CHUN-KAI CHAN, HSU-HSIANG CHENG, MING-CHING CHENG
  • Patent number: 11947868
    Abstract: A method for muting and unmuting a microphone is provided. The method includes providing a processor, receiving an input microphone signal, measuring the input microphone signal for a loudness level at a sampling rate, calculating a mute threshold level, checking if the loudness level is higher than or equal to the mute threshold level, and resetting a mute delay timer upon determining that the loudness level is higher than or equal to the mute threshold level and obtaining the input microphone signal, or checking if the mute delay timer is running upon determining that the loudness level is not higher than or equal to the mute threshold level and attenuating the input microphone signal if the mute delay timer is not running or obtaining the input microphone signal if the mute delay timer is still running, and writing the input microphone signal or attenuated input microphone signal to an output buffer.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: April 2, 2024
    Assignee: CREATIVE TECHNOLOGY LTD.
    Inventors: Kee Seng Tan, Luen Kai Chan, Ariel Arellano De Castro
  • Publication number: 20240105200
    Abstract: A method for selective noise suppression in an audio playback is provided. The method includes providing a processor, obtaining a microphone state and a playback device state with the processor from an operating system, determining the audio playback is communication audio based on the microphone state and the playback device state, and enabling applying noise suppression to the audio playback if the audio playback is communication audio, is not music and noise is present, or otherwise disabling applying noise suppression to the audio playback.
    Type: Application
    Filed: August 25, 2023
    Publication date: March 28, 2024
    Applicant: Creative Technology Ltd
    Inventors: Kee Seng TAN, Luen Kai CHAN, Ariel Arellano DE CASTRO
  • Publication number: 20240088033
    Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Kai Chan, Chung-Hao Tsai, Chuei-Tang WANG, Wei-Ting Chen