Patents by Inventor Kai-Chao Yang

Kai-Chao Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973021
    Abstract: A semiconductor device includes a first metal layer, a second metal layer, and an inter-metal dielectric layer disposed between the first metal layer and the second metal layer. The inter-metal dielectric layer includes: a first dielectric layer disposed on the first metal layer and in direct contact with the first metal layer, wherein the first dielectric layer has a stress value less than 0; a second dielectric layer disposed on the first dielectric layer, wherein the second dielectric layer has a stress value greater than 0; and a third dielectric layer disposed on the second dielectric layer, wherein the third dielectric layer has a stress value less than 0. A thickness of the third dielectric layer is greater than a thickness of the second dielectric layer, and the thickness of the second dielectric layer is greater than a thickness of the first dielectric layer.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: April 30, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Kai-Chun Chen, Shih-Ming Tseng, Hsing-Chao Liu, Hsiao-Ying Yang
  • Publication number: 20220012046
    Abstract: An OS-independent peripheral plug-and-play and driver update method for embedded system and firmware data transmission method for embedded system platform is provided. The method includes: determining whether a peripheral device is connected to the embedded system host; when the peripheral device is connected to the embedded system host, acquire the ID of the peripheral device; connecting to a firmware server; according to the ID, acquiring a driver; packing the driver into a firmware and transmitting to the embedded system host; and performing a firmware update.
    Type: Application
    Filed: November 25, 2020
    Publication date: January 13, 2022
    Inventors: Kung-Wang LEE, Kai-Chao YANG
  • Publication number: 20150168185
    Abstract: A re-modularized sensing device is disclosed, which is especially for a sensing system having a power unit, a sensing unit, a processing unit, and a transceiver unit is disclosed. The power unit provides electricity for the modularized sensing device. The sensing unit derives at least one environmental data. The processing unit has a sensing device processing application program for calculating the environmental data and generating a first outcome. The transceiver unit transfers the first outcome and a first signal to the host. And one or more modules are formed by the sensing unit, the processing unit, and the power unit, and each module is individually removable and replaceable. And an initialization method of the sensing system using the re-modularized sensing device is also disclosed.
    Type: Application
    Filed: July 9, 2014
    Publication date: June 18, 2015
    Inventors: Chun-Ming HUANG, Chien-Ming Wu, Chih-Chyau Yang, Kai-Chao Yang, Shao-Min Wen, Yi-Jun Liu
  • Publication number: 20120102254
    Abstract: The present invention discloses a virtualized peripheral hardware platform system. The virtualized peripheral hardware platform system includes a first hardware platform and a software platform, which is executed in a second hardware platform. The first hardware platform is in signal communication with the second hardware platform. The software platform not only simulates the operation of the peripheral device of the first hardware platform but also simulates input signals of virtual peripheral devices and then transmits the input signals to the first hardware platform to conduct further calculations. Furthermore, the input/output (I/O) interface of the second hardware platform can be simulated as the I/O interface of the first hardware platform, so as to decrease the number of the I/O interface which the first hardware platform needed and downsize the first hardware platform.
    Type: Application
    Filed: December 7, 2010
    Publication date: April 26, 2012
    Applicant: National Chip Implementation Center National Applied Research Laboratories.
    Inventors: Chun-Ming Huang, Chin-Long Wey, Hui-Ming Lin, Chien-Ming Wu, Kai-Chao Yang, Yu-Tsang Chang