Patents by Inventor Kai-Chiang Hsu

Kai-Chiang Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240063163
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • Semiconductor package structure and method of manufacturing the same
    Patent number: 11804461
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: October 31, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Ping Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210407951
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Ping TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • Semiconductor package structure and method of manufacturing the same
    Patent number: 11121111
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: September 14, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Pin Tsai, Ming-Chi Liu, Yu-Ting Lu, Kai-Chiang Hsu, Che-Ting Liu
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210074664
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • Image processing apparatus
    Patent number: 7978927
    Abstract: The invention discloses an image processing apparatus for adjusting lightness of an input image. The image processing apparatus includes a first processing module, a second processing module, a third processing module, and a fourth processing module. The first processing module is used for generating a lightness histogram with reference to the input image and determining a maximum lightness and an average lightness according to the lightness histogram. The second processing module is used for determining a first gain and a second gain according to the maximum lightness and a look-up table. The third processing module is used for selecting a lightness adjusting curve according to the average lightness. The fourth processing module is used for generating an output lightness corresponding to the input image.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: July 12, 2011
    Assignee: Marketech International Corp.
    Inventors: Hsu-Pin Kao, Yi-Chia Shan, Hsu-Chia Kao, Kai-Chiang Hsu
  • IMAGE PROCESSING APPARATUS
    Publication number: 20080219551
    Abstract: The invention discloses an image processing apparatus for adjusting lightness of an input image. The image processing apparatus includes a first processing module, a second processing module, a third processing module, and a fourth processing module. The first processing module is used for generating a lightness histogram with reference to the input image and determining a maximum lightness and an average lightness according to the lightness histogram. The second processing module is used for determining a first gain and a second gain according to the maximum lightness and a look-up table. The third processing module is used for selecting a lightness adjusting curve according to the average lightness. The fourth processing module is used for generating an output lightness corresponding to the input image.
    Type: Application
    Filed: March 6, 2008
    Publication date: September 11, 2008
    Inventors: Hsu-Pin KAO, Yi-Chia Shan, Hsu-Chia Kao, Kai-Chiang Hsu