Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.

Abstract: A semiconductor structure includes a first dielectric layer, a first die, a second die, a first molding, and a second molding. The first die is disposed under the first dielectric layer, and has a first surface facing the first dielectric layer and a second surface opposite to the first surface. The second die is disposed over the first dielectric layer, and has a third surface facing the first dielectric layer and a fourth surface opposite to the third surface. The first molding encapsulates the first die. The second molding is disposed over the first die and the first dielectric layer. The first surface of the first die and the third surface of the second die are in contact with the first dielectric layer. The fourth surface of the second die is partially exposed through the second molding and partially covered by the second molding.

Abstract: A data transmission system is disclosed. The data transmission system includes at least one signal processing device, at least one conversion device, at least one antenna device, and at least one flexible printed circuit board. The at least one signal processing device is configured to generate or receive at least one data. The at least one conversion device is configured to transform between the at least one data and an optical signal. The at least one antenna device is configured to obtain the at least one data according to the optical signal, and configured to receive or transmit the at least one data wirelessly. The at least one flexible printed circuit board includes at least one conductive layer and at least one optical waveguide layer. The at least one optical waveguide layer is configured to transmit the optical signal.

Abstract: A package structure includes a first and a second conductive feature structures, a die, an insulator, an encapsulant, an adhesive layer, and a first through via. The die is located between the first conductive feature structure and the second conductive feature structure. The die is electrically connected to the second conductive feature structure. The insulator is disposed between the die and the first conductive feature structure. The insulator has a bottom surface in physical contact with a polymer layer of the first conductive feature structure. The encapsulant is located between the first conductive feature structure and the second conductive feature structure. The encapsulant is disposed on the insulator and laterally encapsulates the die and the insulator. The adhesive layer is disposed between the die and the insulator. The first through via extends through the encapsulant to connect to the first conductive feature structure and the second conductive feature structure.

Abstract: A method of manufacturing a semiconductor device includes providing a carrier, disposing a first pad on the carrier, forming a post on the first pad, and disposing a joint adjacent to the post and the first pad to form a first entire contact interface between the first pad and the joint and a second entire contact interface between the first pad and the post. The first entire contact interface and the second entire contact interface are flat surfaces.

Abstract: A data processing circuit and a fault-mitigating method are provided. A first data is written into a memory. A computed result is determined according to one or more adjacent bits of the first data at faulty bits. According to the computed result, new values are determined. The new values replace the values of the first data at the faulty bits to form a second data. The first data includes multiple bits. The first data is image-related data, weights used by a multiply-accumulate (MAC) for extracting features of images, and/or values used by an activation calculation. The adjacent bits are adjacent to the faulty bits. The computed result is obtained through computing the values of the first data at non-faulty bits of the memory. Accordingly, an influence of a memory fault is reduced.

Abstract: A memory apparatus and a data rearrangement method for computing in memory (CIM) are provided. The method includes determining whether first sequence data has two target bits that are both of a first value, inserting a non-target bit of a second value between the two target bits that are both of the first value and adjacent to each other to generate second sequence data, and receiving the second sequence data through memory cells in a memory to perform a multiply-accumulate (MAC) operation on the second sequence data. Each bit in the first sequence data is the first value or the second value. One of the two target bits is located adjacent to the other one of the two target bits in the first sequence data. The two target bits and the non-target bit are located in the first sequence data. Accordingly, the error rate is decreased.

Abstract: A simplification device and a simplification method for neural network model are provided. The simplification method may simplify an original trained neural network model to a simplified trained neural network model, wherein the simplified trained neural network model includes at most two linear operation layers. The simplification method includes: converting the original trained neural network model into an original mathematical function; performing an iterative analysis operation on the original mathematical function to simplify the original mathematical function to a simplified mathematical function, wherein the simplified mathematical function has a new weight; computing the new weight by using multiple original weights of the original trained neural network model; and converting the simplified mathematical function to the simplified trained neural network model.

Abstract: Provided is a package structure and a method of forming the same. The package structure includes a semiconductor package, a stacked patch antenna structure, and a plurality of conductive connectors. The semiconductor package includes a die. The stacked patch antenna structure is disposed on the semiconductor package, and separated from the semiconductor package by an air cavity. The plurality of conductive connectors is disposed in the air cavity between the semiconductor package and the stacked patch antenna structure to connect the semiconductor package and the stacked patch antenna structure.

Abstract: A method of manufacturing a semiconductor structure includes following operations. A first die is provided. A first molding is formed to encapsulate the first die. A second die is disposed over the first molding. A mold chase is disposed over the second die and the first molding. The mold chase includes a protrusion protruded from the mold chase towards the first molding. A molding material is disposed between the mold chase and the first molding. A second molding is formed to surround the second die. The second die is at least partially covered by the second molding. The disposing of the mold chase includes surrounding the protrusion of the mold chase by the molding material.

Abstract: An integrated circuit assembly may be formed with a bridge incorporated into at least one level structure of the integrated circuit assembly, which electrically interconnects at least two integrated circuit devices in another level structure of the integrated circuit assembly. In one example, the integrated circuit assembly may include a first level structure that comprises at least a first integrated circuit device and a second integrated circuit device, and a second level structure comprising at least one integrated circuit device electrically attached to the first integrated circuit device of the first level structure and the bridge forming an electrical attachment between the first integrated circuit device of the first level structure and the second integrated circuit device of the first level structure.

Abstract: An integrated circuit assembly may be formed having a first level structure that comprises a monolithic substrate with a first reticle zone including integrated circuitry and a second reticle zone including integrated circuitry, and a second level structure comprising at least one integrated circuit device electrically attached to the integrated circuitry of the first reticle zone of the first level structure and a bridge electrically attaching the integrated circuitry of the first reticle zone of the first level structure and the integrated circuitry of the second reticle zone of the first level structure.

Abstract: A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

Abstract: A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

Abstract: An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, an insulation encapsulation, and at least one first through interlayer via. The first redistribution structure includes a dielectric layer, a feed line at least partially disposed on the dielectric layer and a signal enhancement layer covering the feed line, wherein the signal enhancement layer has a lower dissipation factor (Df) and/or a lower permittivity (Dk) than the dielectric layer. The die is disposed on the first redistribution structure. The insulation encapsulation encapsulates the die. The at least one first TIV is embedded in the insulation encapsulation and the signal enhancement layer.

Abstract: A semiconductor package and a manufacturing method thereof are provided. A package substrate of a device includes a functional circuit structure in a central region of the package substrate and a seal ring structure in a peripheral region of the package substrate and electrically isolated from the functional circuit structure. The seal ring structure includes a via pattern including outer discrete features arranged in an outer loop and inner discrete features arranged in an inner loop between the outer loop and the functional circuit structure. In a top view, ends of adjacent two of the inner discrete features are spaced apart from each other by a non-zero distance, and one of the outer discrete features overlaps the non-zero distance.

Abstract: A semiconductor package and a manufacturing method are provided. The manufacturing method includes: forming a through via structure and a dipole structure over a carrier, wherein the through via structure and the dipole structure respectively include an insulating core and a conductive layer covering the insulating core; attaching a semiconductor die onto the carrier, wherein the through via structure and the dipole structure are located aside the semiconductor die; laterally encapsulating the though via structure, the dipole structure and the semiconductor die with an encapsulant; and removing the carrier.

Abstract: A package component, a semiconductor package and a manufacturing method thereof are provided. The package component for electrically coupling a semiconductor die includes a functional circuit structure and a seal ring structure embedded in an insulating layer. The semiconductor die disposed on the package component is electrically coupled to the functional circuit structure. The seal ring structure is electrically isolated from the functional circuit structure, the seal ring structure includes a stack of alternating interconnect layers and via patterns, the via pattern at each level of the stack includes first features spaced apart from one another and arranged at neighboring corners of the insulating layer, and the first features are offset lengthwise relative to each other to overlap therewith, and the first features are spaced apart widthwise relative to each other.