Abstract: A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

Abstract: A probe structure is provided, including two probe heads for electrically contacting with the two objects, respectively, an elastic buffer portion forming a hollow space therein, a conductive portion being disposed within the hollow space and thereby being surrounded by the elastic buffer portion, and having two ends respectively electrically being connected to the two probe heads. When the two probe heads do not contact with the two objects electrically, the conductive portion is linearly extended between the two probe heads.

Abstract: A flat signal transfer structure of a probe card device includes a transfer plate and a retaining cover. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a receiving slot recessed from the first surface and a plurality of signal circuits each having a signal contact arranged at a bottom of the receiving slot. A portion of the transfer plate arranged around and adjacent to the receiving slot is defined as a supporting portion. The retaining cover has a plurality of thru-holes and is disposed on the supporting portion. The retaining cover and the receiving slot of the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: A probe component and a probe structure thereof are provided. The probe structure includes a first contacting segment, a first connecting segment, a second connecting segment and a second contacting segment. The first contacting segment has an abutting portion and a first end portion connected to the abutting portion. The first connecting segment is connected to the first contacting segment. The second connecting segment is connected to the first connecting segment. The second contacting segment is connected to the second connecting segment and has a second end portion.

Abstract: The present disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a first base part, a second base part, a connecting part, and a contacting part. The first base part includes a first contacting segment and a first connecting segment. The first contacting segment includes a first abutting portion and a first side end portion connected to the first abutting portion. The second base part includes a second contacting segment, a second connecting segment, and a passive component disposed between the second contacting segment and the second connecting segment. The second contacting segment includes a second abutting portion and a second side end portion connected to the second abutting portion. The first connecting segment and the second connecting segment are connected to the connection part. The contacting portion is connected to the connection part.

Abstract: A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

Abstract: A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.

Abstract: A probe structure is provided, including two probe heads for electrically contacting with the two objects, respectively, an elastic buffer portion forming a hollow space therein, a conductive portion being disposed within the hollow space and thereby being surrounded by the elastic buffer portion, and having two ends respectively electrically being connected to the two probe heads. When the two probe heads do not contact with the two objects electrically, the conductive portion is linearly extended between the two probe heads.

Abstract: A circuit board with via capacitor structure is introduced herein, including a base, a deposition layer, disposed on the base, having at least a via in the deposition layer, at least a thin film capacitor, each thin film capacitor disposed in each via, each thin film capacitor having a body, a second terminal, and a first terminal, the second terminal and the first terminal located on two opposite sides of the body; at least a first electrode, each first electrode electrically connected to the first terminal of each thin film capacitor; and at least a second electrode, each second electrode electrically connected to the second terminal of each thin film capacitor.

Abstract: A stack type test interface board assembly is provided herein, which comprises: a space transform board having a narrow pitch transform board and a wide pitch transform board, a plurality of first connection nodes disposed on a side of the narrow pitch transform board to be electrically connected to a finished or semi-finished semiconductor product, a plurality of second connection nodes disposed on a side of the wide pitch transform board, and a printed circuit board where a side thereof is electrically connected to the plurality of the second connection nodes. The narrow pitch transform board and the wide pitch transform board are assembled in perpendicular stack into the space transform board. A pitch between each two of the plurality of the first connection nodes is smaller than a pitch between each two of the plurality of the second connection nodes.

Abstract: Disclosed is a multilayer interposer with high bonding strength, which is used in wafer testing. The multilayer interposer with high bonding strength comprises a plurality of thin-film layer structures overlapping sequentially. One of the thin-film layer structures comprises at least one first conductive blind via. An interconnection layer electrically connected to the first conductive blind via is configured on the surface of the one of the thin-film layer structures, and the interconnection layer comprises at least one head portion. Another one of the thin-film layer structures comprises at least one second conductive blind via. The bottom of the second conductive blind via contacts both of the corresponding head portion and part of the surface of the one of the thin-film layer structures. Thereby, the bonding strength between layers can be dramatically increased, and the resistance to the thermal shock can be also increased.

Abstract: A fine pitch interposer structure includes a Multi-core base substrate and a plurality of buildup laminates. A surface of each Multi-core base substrate has a first circuit layer, and a second circuit layer which is electrically connected to the first circuit layer. The buildup laminates are stacked on the surface of the Multi-core base substrate. Each buildup laminate includes a photosensitive dielectric layer, and a plurality of blind vias with a pre-determined interval therebetween which are correspondingly arranged on each of the plurality of vias formed on the photosensitive dielectric layer. The blind vias are electrically connected to the first circuit layer. At least one blind via of one buildup laminate is superimposed on another blind via of another buildup laminate.