Patents by Inventor Kai-Chieh Liang
Kai-Chieh Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240347666Abstract: An optoelectronic device includes a substrate, a sensing element, a light emitting element, a first dam, and a second dam. The sensing element and the light emitting element are disposed on the substrate. The first dam is disposed on the substrate and covers a side of the sensing element. The second dam is disposed on the first dam. The first dam and the second dam are located between the sensing element and the light emitting element.Type: ApplicationFiled: April 12, 2024Publication date: October 17, 2024Inventors: CHEN-HSIU LIN, Kai-Chieh Liang
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Publication number: 20240234649Abstract: A light emitting device includes a substrate, a wall, at least one light emitting chip, a protection layer, and a reflection layer. The substrate has a mounting surface. The wall is disposed on the mounting surface and has an inner side surface. An accommodation space is defined by the inner side surface and the mounting surface. The light emitting chip has a top light emitting surface and a side light emitting surface, and is disposed in the accommodation space and on the mounting surface. The protection layer is disposed on the top light emitting surface and the side light emitting surface. A gap is formed between the protection layer and the wall. The reflection layer is disposed in the accommodation space and between the inner side surface and the side light emitting surface. The reflection layer is filled in the gap and contacts the mounting surface.Type: ApplicationFiled: January 5, 2024Publication date: July 11, 2024Inventors: MIAO-SAN CHIEN, Kai-Chieh Liang, KUO-MING CHIU
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Publication number: 20240136479Abstract: A light emitting device includes a substrate, a wall, at least one light emitting chip, a protection layer, and a reflection layer. The substrate has a mounting surface. The wall is disposed on the mounting surface and has an inner side surface. An accommodation space is defined by the inner side surface and the mounting surface. The light emitting chip has a top light emitting surface and a side light emitting surface, and is disposed in the accommodation space and on the mounting surface. The protection layer is disposed on the top light emitting surface and the side light emitting surface. A gap is formed between the protection layer and the wall. The reflection layer is disposed in the accommodation space and between the inner side surface and the side light emitting surface. The reflection layer is filled in the gap and contacts the mounting surface.Type: ApplicationFiled: January 5, 2024Publication date: April 25, 2024Inventors: MIAO-SAN CHIEN, Kai-Chieh Liang, KUO-MING CHIU
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Patent number: 11916155Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.Type: GrantFiled: May 21, 2021Date of Patent: February 27, 2024Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Chien-Hsiu Huang, Bo-Jhih Chen, Kuo-Ming Chiu, Meng-Sung Chou, Wei-Te Cheng, Kai-Chieh Liang, Yun-Ta Chen, Yu-Han Wang
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Publication number: 20230261156Abstract: A semiconductor assembly includes a substrate, a retaining wall, a light emitting unit, and a reflective layer. The substrate has a mounting surface. The retaining wall is disposed on the mounting surface and has an inner surface. An accommodation space is defined by the inner surface and the mounting surface. The light emitting unit is disposed in the accommodation space and disposed on the mounting surface. The light emitting unit has an upper light emitting surface and a side light emitting surface. The reflective resin layer is disposed in the accommodation space and disposed between the inner surface and the side light emitting surface. The reflective resin layer contains a based resin, a UV absorber, and reflective particles.Type: ApplicationFiled: February 13, 2023Publication date: August 17, 2023Inventors: MIAO-SAN CHIEN, Kai-Chieh Liang, Wei-Te Cheng, KUO-MING CHIU
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Patent number: 11685306Abstract: A light emitting device including a lighting unit and a conversion material is disclosed. The conversion material is configured to convert a part of the invisible light emitted from the lighting unit into a visible light, which indicates that the lighting unit is in operation. The spectral energy of visible light is less than 20% of the spectral energy measured within a wavelength range of 200 nm to 380 nm.Type: GrantFiled: January 25, 2022Date of Patent: June 27, 2023Assignee: LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Te Cheng, Kai-Chieh Liang, Kuo-Ming Chiu, Fang-Jung Sun, Chun-Chieh Chang, Yi-Fei Lee
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Publication number: 20230038896Abstract: A method of manufacturing the light emitting package structure is provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.Type: ApplicationFiled: October 21, 2022Publication date: February 9, 2023Inventors: Wei-Te Cheng, KUO-MING CHIU, Kai-Chieh Liang, Jie-Ting Tsai
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Patent number: 11522109Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.Type: GrantFiled: November 13, 2019Date of Patent: December 6, 2022Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Te Cheng, Kuo-Ming Chiu, Kai-Chieh Liang, Jie-Ting Tsai
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Patent number: 11522108Abstract: A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.Type: GrantFiled: February 15, 2022Date of Patent: December 6, 2022Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Te Cheng, Kuo-Ming Chiu, Meng-Sung Chou, Kai-Chieh Liang, Jie-Ting Tsai
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Publication number: 20220384521Abstract: Structures and formation methods of a semiconductor structure are provided. The semiconductor structure includes an insulating layer covering a device region and an alignment mark region of a semiconductor substrate. A conductive feature is formed in the insulating layer and corresponds to the device region. An alignment mark structure is formed in the first insulating layer and corresponds to the alignment mark region. The alignment mark structure includes a first conductive layer, a second conductive layer covering the first conductive layer, and a first magnetic tunnel junction (MTJ) stack layer covering the second conductive layer. The first conductive layer and the conductive feature are made of the same material.Type: ApplicationFiled: May 26, 2021Publication date: December 1, 2022Inventors: Wei-De HO, Lan-Hsin CHIANG, Chien-Hua HUANG, Chung-Te LIN, Yung-Yu WANG, Sheng-Yuan CHANG, Kai-Chieh LIANG
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Patent number: 11489079Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.Type: GrantFiled: May 19, 2021Date of Patent: November 1, 2022Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Te Cheng, Kai-Chieh Liang, Jie-Ting Tsai, Bo-Jhih Chen, Zi-Jun Lin, Kuo-Ming Chiu
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Patent number: 11462524Abstract: A light emitting structure includes a substrate, at least one light emitting chip disposed on the substrate and, a side wall disposed on the substrate and surrounding the at least one light emitting chip, a cover disposed on the side wall, an anti-reflective coating disposed on the cover, and a protective layer disposed on outside of the cover, wherein the cover, the side wall and the substrate define an enclosed space for accommodating the at least one light emitting chip.Type: GrantFiled: June 12, 2020Date of Patent: October 4, 2022Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Jie-Ting Tsai, Kuo-Ming Chiu, Wei-Te Cheng, Kai-Chieh Liang
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Publication number: 20220243897Abstract: A light emitting device including a lighting unit and a conversion material is disclosed. The conversion material is configured to convert a part of the invisible light emitted from the lighting unit into a visible light, which indicates that the lighting unit is in operation. The spectral energy of visible light is less than 20% of the spectral energy measured within a wavelength range of 200 nm to 380 nm.Type: ApplicationFiled: January 25, 2022Publication date: August 4, 2022Inventors: Wei-Te CHENG, Kai-Chieh LIANG, Kuo-Ming CHIU, Fang-Jung SUN, Chun-Chieh CHANG, Yi-Fei LEE
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Publication number: 20220173278Abstract: A package structure is provided. The package structure includes a substrate, a pair of electrodes, a lighting unit, a wall, and a package compound. The pair of electrodes and the wall are disposed on the substrate, and the wall and the substrate jointly define an accommodating space. The lighting unit is disposed in the accommodating space. The package compound is disposed in the accommodating space such that a top end of the package compound has a W-shaped cross section and the lighting unit is embedded in the package compound.Type: ApplicationFiled: February 15, 2022Publication date: June 2, 2022Inventors: WEI-TE CHENG, KUO-MING CHIU, MENG-SUNG CHOU, KAI-CHIEH LIANG, Jie-Ting Tsai
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Patent number: 11264370Abstract: A light-emitting diode (LED) package structure includes a substrate, an LED, a side wall, an encapsulant, and a waterproof protective coating. The LED is disposed on the substrate, the side wall defines a through hole and is disposed on the substrate, and the LED is accommodated in the through hole. The encapsulant is filled in the through hole and covers the LED. A heterojunction is disposed between the encapsulant and the side wall, and the waterproof protective coating seals the heterojunction. Furthermore, the encapsulant includes a first fluoropolymer, the waterproof protective coating includes a second fluoropolymer, and the light transmittance of the first fluoropolymer is greater than that of the second fluoropolymer.Type: GrantFiled: June 11, 2020Date of Patent: March 1, 2022Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Te Cheng, Kuo-Ming Chiu, Kai-Chieh Liang, Jie-Ting Tsai
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Publication number: 20210367086Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.Type: ApplicationFiled: May 21, 2021Publication date: November 25, 2021Inventors: CHIEN-HSIU HUANG, BO-JHIH CHEN, KUO-MING CHIU, MENG-SUNG CHOU, Wei-Te Cheng, Kai-Chieh Liang, YUN-TA CHEN, YU-HAN WANG
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Publication number: 20210367085Abstract: An optical sensor structure is provided. The optical sensor structure includes a substrate, a light sensing unit, a peripheral wall, and a reflective layer. The substrate includes a plurality of metal pads. The light sensing unit is disposed on the substrate and electrically connected to the plurality of metal pads. The peripheral wall is disposed on the substrate, and the peripheral wall and the substrate define an accommodating space. The metal pads and the light sensing unit are positioned in the accommodating space. The reflective layer is disposed in the accommodating space and surrounds the light sensing unit.Type: ApplicationFiled: May 19, 2021Publication date: November 25, 2021Inventors: Wei-Te Cheng, Kai-Chieh Liang, Jie-Ting Tsai, BO-JHIH CHEN, ZI-JUN LIN, KUO-MING CHIU
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Publication number: 20210226097Abstract: A package structure and a method for manufacturing the same are provided. The package structure includes a substrate, a wall, a photonic device, an inner covering layer, and an outer covering layer. The wall is disposed on the substrate, and a space is formed between the substrate and the wall. The photonic device is accommodated in the space and disposed on the substrate. The photonic device includes a p-contact and an n-contact, and a gap is defined between the p-contact and the n-contact. The inner covering layer is disposed in the gap between the p-contact and the n-contact. The outer covering layer is covered on an upper surface of the substrate, an inner surface of the wall, and an outer surface of the photonic device.Type: ApplicationFiled: January 19, 2021Publication date: July 22, 2021Inventors: Kai-Chieh Liang, KUO-MING CHIU, Wei-Te Cheng, Jie-Ting Tsai
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Publication number: 20210159367Abstract: A package structure is provided. The package structure includes a substrate, an electrode layer, a lighting unit, a wall, and a package compound. The substrate and the wall that is disposed on the substrate jointly define an accommodating space. The lighting unit in the accommodating space and is electrically connected to the electrode layer disposed on the substrate. The package compound covers the electrode layer, and the lighting unit. The package compound includes an attaching portion disposed on a top surface of the lighting unit and a surrounding portion that is arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.Type: ApplicationFiled: January 5, 2021Publication date: May 27, 2021Inventors: WEI-TE CHENG, KUO-MING CHIU, MENG-SUNG CHOU, KAI-CHIEH LIANG, Jie-Ting Tsai
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Patent number: 10916685Abstract: An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.Type: GrantFiled: June 14, 2018Date of Patent: February 9, 2021Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATIONInventors: Wei-Te Cheng, Kuo-Ming Chiu, Meng-Sung Chou, Kai-Chieh Liang