Abstract: A magnetic media tester comprising a Laser Doppler Vibrometer (LDV) head; and a magnetic read head; the LDV head and the magnetic read head being configured for obtaining correlatable data of a region on a magnetic disk.

Abstract: An apparatus and method of testing a magnetic medium at temperatures of interest is disclosed. Properties of the magnetic medium are determined by focusing light from a source of polarized light on a magnetic surface of the magnetic medium; measuring polarization of resulting reflected light due to the magneto-optical Kerr effect, using, for example a measuring subsystem; and varying the light source to heat the magnetic material where incident to pre-defined temperatures, thereby allowing determination of the magnetic properties using the magneto-optical Kerr effect at said pre-defined temperatures.

Abstract: A method and apparatus for testing a magnetic medium. The method comprises applying a magnetic field of a time-varying strength; directing a polarized optical beam towards a portion of the medium that is in the magnetic field, wherein the optical beam is reflected by a surface of the medium at a point of incidence in the magnetic field; moving the medium relative to the optical beam so as to cause the point of incidence to repeatedly traverse each of a plurality of sectors along a track on the surface; obtaining a series of Kerr signal measurements of the reflected optical beam; grouping measurements into ensembles such that the measurements in an individual ensemble are those obtained while the point of incidence was in a corresponding one of the sectors; and determining at least one magnetic property of at least one of the sectors from the measurements in the corresponding ensemble.

Abstract: A magnetic media tester comprising a Laser Doppler Vibrometer (LDV) head; and a magnetic read head; the LDV head and the magnetic read head being configured for obtaining correlatable data of a region on a magnetic disk.

Abstract: A method and apparatus for testing a magnetic medium. The method comprises applying a magnetic field of a time-varying strength; directing a polarized optical beam towards a portion of the medium that is in the magnetic field, wherein the optical beam is reflected by a surface of the medium at a point of incidence in the magnetic field; moving the medium relative to the optical beam so as to cause the point of incidence to repeatedly traverse each of a plurality of sectors along a track on the surface; obtaining a series of Kerr signal measurements of the reflected optical beam; grouping measurements into ensembles such that the measurements in an individual ensemble are those obtained while the point of incidence was in a corresponding one of the sectors; and determining at least one magnetic property of at least one of the sectors from the measurements in the corresponding ensemble.

Abstract: The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.

Abstract: The invention relates to a method and apparatus for cutting a substrate using laser irradiation. A laser beam is scanned over a substrate. The beam ablates a first layer of the substrate. The beam is then refocused onto the newly revealed second layer and a further pass is performed. The process is repeated until complete separation occurs. The method and apparatus are particularly suitable for singulation of IC packages.

Abstract: A method and apparatus are provided for cutting a substrate using dual laser irradiation. Two lasers are provided, one focussed on a first substrate layer and one on a second layer so as to ablate the said layers. The wavelength and other parameters of the lasers are selected so as to correspond with the layer material to be ablated. The invention is particularly suitable for the singulation of IC packages.