Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.

Abstract: A collapsible tube squeezing device includes a tubular member and a rotary member. A tubular wall of the tubular member has a slit which extends in an axial direction through two opened ends. The rotary member has a tubular shaft rotatably disposed in the tubular wall about an axis, a handle connected to a shaft end for a manual rotational operation, and a centered member connected to an opposite shaft end, and configured to be kept and centered along the axis. A shaft wall of the tubular shaft is coaxial with and spaced apart from the tubular wall, and has a slot for a sealed end of a collapsible tube to be inserted thereinto.

Abstract: A collapsible tube squeezing device includes a tubular member and a rotary member. A tubular wall of the tubular member has a slit which extends in an axial direction through two opened ends. The rotary member has a tubular shaft rotatably disposed in the tubular wall about an axis, a handle connected to a shaft end for a manual rotational operation, and a centered member connected to an opposite shaft end, and configured to be kept and centered along the axis. A shaft wall of the tubular shaft is coaxial with and spaced apart from the tubular wall, and has a slot for a sealed end of a collapsible tube to be inserted thereinto.