Patents by Inventor Kai F Ng

Kai F Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electromagnetic interference containment structures
    Patent number: 8172469
    Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: May 8, 2012
    Assignee: Finisar Corporation
    Inventors: Chris Togami, Gary Dean Sasser, Kai F Ng
  • ELECTROMAGNETIC INTEFERENCE CONTAINMENT STRUCTURES
    Publication number: 20110064365
    Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    Type: Application
    Filed: November 22, 2010
    Publication date: March 17, 2011
    Inventors: Chris Togami, Gary Dean Sasser, Kai F. Ng
  • Electromagnetic interference containment structures
    Patent number: 7837399
    Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: November 23, 2010
    Assignee: Finisar Corporation
    Inventors: Chris Togami, Gary Dean Sasser, Kai F Ng
  • ELECTROMAGNETIC INTEFERENCE CONTAINMENT STRUCTURES
    Publication number: 20090175582
    Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.
    Type: Application
    Filed: January 5, 2009
    Publication date: July 9, 2009
    Applicant: FINISAR CORPORATION
    Inventors: Chris Togami, Gary Dean Sasser, Kai F. Ng