Patents by Inventor Kai Fu
Kai Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12118942Abstract: A display panel including a pixel driving circuit including a driving transistor, a first transistor having a gate electrode connected to a first gate line and a first electrode connected to a gate electrode of the driving transistor, and a second transistor having a gate electrode connected to a second gate line, a first electrode connected to the gate electrode of the driving transistor, and a second electrode connected to a second electrode of the driving transistor, the driving transistor is a P type transistor, and the first transistor and the second transistor are N type transistors, wherein the display panel further includes: a base substrate, a first conductive layer, a third conductive layer, and a first conducting part.Type: GrantFiled: September 29, 2023Date of Patent: October 15, 2024Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Huaping Sun, Erlong Song, Qiang Fu, Kai Zhang, Dongjie Wu
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Publication number: 20240321817Abstract: An embodiment method of forming a hybrid bond between a first semiconductor device component and a second semiconductor device component may include forming the first semiconductor device component including a first electrical bonding structure formed within a first dielectric material; forming the second semiconductor device component including a second electrical bonding structure formed within a second dielectric material; placing the first semiconductor device component and the second semiconductor device component together such that the first electrical bonding structure is in contact with the second electrical bonding structure; performing a first annealing process that forms a direct metal-to-metal bond between the first electrical bonding structure and the second electrical bonding structure; and performing a second annealing process that forms a direct dielectric-to-dielectric bond between the first dielectric material and the second dielectric material.Type: ApplicationFiled: March 23, 2023Publication date: September 26, 2024Inventors: Chin-Fu Kao, Amram Eitan, Kai-Hsiang Yang, Ju-Pin Sun
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Patent number: 12094956Abstract: A method for fabricating semiconductor device includes: forming a first semiconductor layer and an insulating layer on a substrate; removing the insulating layer and the first semiconductor layer to form openings; forming a second semiconductor layer in the openings; and patterning the second semiconductor layer, the insulating layer, and the first semiconductor layer to form fin-shaped structures.Type: GrantFiled: June 6, 2023Date of Patent: September 17, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chin-Hung Chen, Ssu-I Fu, Chih-Kai Hsu, Chia-Jung Hsu, Yu-Hsiang Lin
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Patent number: 12090503Abstract: A semiconductor process system includes a semiconductor process chamber having an interior volume. A pump extracts gases from the semiconductor process chamber via an outlet channel communicably coupled to the semiconductor process chamber. The system includes a plurality of fluid nozzles configured to prevent the backflow of particles from the outlet channel to interior volume by generating a fluid barrier within the outlet channel responsive to the pump ceasing to function.Type: GrantFiled: July 31, 2023Date of Patent: September 17, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kai-Chin Wei, Che-fu Chen
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Patent number: 12094783Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a fin-shaped structure thereon; forming a single diffusion break (SDB) structure in the substrate to divide the fin-shaped structure into a first portion and a second portion; forming a first gate structure on the SDB structure; forming an interlayer dielectric (ILD) layer around the first gate structure; transforming the first gate structure into a first metal gate; removing the first metal gate to form a first recess; and forming a dielectric layer in the first recess.Type: GrantFiled: June 14, 2023Date of Patent: September 17, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen, Yu-Hsiang Lin
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Publication number: 20240298158Abstract: Embodiments of the present disclosure relate to a method, a device, a storage medium, and a computer program product for short-range wireless communication. The method includes: A receiving device receives a data frame from a sending device; generates a feedback frame for the data frame, where the feedback frame includes an encoded access code of the data frame, and the encoded access code indicates whether the data frame is correctly received; and sends the feedback frame to the receiving device.Type: ApplicationFiled: April 25, 2024Publication date: September 5, 2024Inventors: Gengshi WU, Kai FU, Zhan YU, Zichen XIE
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Publication number: 20240294088Abstract: Customer-centric dynamic charging station assessment is provided. A charger request is received from a vehicle, the charger request including an identifier of a sender of the charger request and a location of the vehicle. One or more charging stations in proximity to the location of the vehicle are identified. For each identified charging station, a user-specific charger score is computed using a plurality of charging station scores for the charging station weighted according to user weights corresponding to the identifier. A charger recommendation is sent to the vehicle responsive to the charger request, the charger recommendation including, for each of the one or more charging stations, a location of the charging station and the user-specific charger score corresponding to the charging station.Type: ApplicationFiled: March 3, 2023Publication date: September 5, 2024Inventors: Kai WU, Dominique MEROUX, Chen ZHANG, Yan FU, Geofrey SATTERFIELD
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Publication number: 20240289899Abstract: Provided is a method for shale gas production prediction, including: acquiring real shale gas production data, and determining a target production decline curve model according to the real shale gas production data; setting a time step for production prediction, and obtaining a linear production decline curve by performing production prediction by using the target production decline curve model based on the time step; determining target shale gas production residuals according to the linear production decline curve and the real shale gas production data, inputting the target shale gas production residuals to a long short-term memory, and obtaining a residual prediction result by performing production prediction according to the long short-term memory and the time step; and determining a target production prediction result of shale gas well to be subjected to production prediction based on the linear production decline curve and the residual prediction result.Type: ApplicationFiled: January 30, 2024Publication date: August 29, 2024Applicant: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)Inventors: Hai SUN, Fei LUO, Dongyan FAN, Lei ZHANG, Jun YAO, Shuaishi FU, Kai ZHANG, Yongfei YANG
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Patent number: 12074070Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, a first isolation structure on the SDB structure, a shallow trench isolation (STI) adjacent to the SDB structure, and a second isolation structure on the STI. Preferably, the first isolation structure further includes a cap layer on the SDB structure and a dielectric layer on the cap layer.Type: GrantFiled: June 14, 2023Date of Patent: August 27, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chih-Kai Hsu, Ssu-I Fu, Chun-Ya Chiu, Chi-Ting Wu, Chin-Hung Chen, Yu-Hsiang Lin
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Patent number: 12068309Abstract: A method for fabricating a semiconductor device includes first providing a substrate having a high-voltage (HV) region, a medium-voltage (MV) region, and a low-voltage (LV) region, forming a HV device on the HV region, and forming a LV device on the LV region. Preferably, the HV device includes a first base on the substrate, a first gate dielectric layer on the first base, and a first gate electrode on the first gate dielectric layer. The LV device includes a fin-shaped structure on the substrate, and a second gate electrode on the fin-shaped structure, in which a top surface of the first gate dielectric layer is lower than a top surface of the fin-shaped structure.Type: GrantFiled: January 27, 2022Date of Patent: August 20, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Chih-Kai Hsu, Ssu-I Fu, Yu-Hsiang Lin, Chien-Ting Lin, Chia-Jung Hsu, Chun-Ya Chiu, Chin-Hung Chen
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Publication number: 20240260882Abstract: An electrocardiogram analysis method and apparatus, an electronic device and a storage medium are provided. In the method, at least one electrocardiogram data segment to be analyzed of a target user is input into a first electrocardiogram analysis model for analysis, so as to generate heart disease diagnosis result information of the target user; and optionally, when the heart disease diagnosis result information indicates that the probability of the target user suffering from a specific heart disease is relatively low, that is, when the electrocardiogram data segment to be analyzed is an electrocardiogram that looks relatively normal, whether the target user suffers in a paroxysmal manner from the heart disease is further determined. That is, the probability of the target user having the symptom corresponding to the heart disease in the future is predicted to provide early warning information for a future physical health condition of the target user.Type: ApplicationFiled: June 13, 2022Publication date: August 8, 2024Applicant: Hefei Heart Voice Health Technology Co., Ltd.Inventors: Shijia GENG, Shenda HONG, Guodong WEI, Kai WANG, Deyun ZHANG, Zhaoji FU, Rongbo ZHOU, Jie YU, Yanqi E, Xinyu QI
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Publication number: 20240258266Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.Type: ApplicationFiled: April 8, 2024Publication date: August 1, 2024Inventors: Kai Jun Zhan, Chin-Fu Kao, Kuang-Chun Lee, Ming-Da Cheng, Chen-Shien Chen
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Publication number: 20240257732Abstract: A pixel driving circuit includes a driving circuit, a first reset circuit, and a second reset circuit. The driving circuit is coupled to a first node and a second node, and is configured to output a driving current according to a voltage difference between the first node and the second node. The first reset circuit is coupled to the first node, a first initial signal terminal and a first reset signal terminal, and is configured to transmit a signal of the first initial signal terminal to the first node in response to a signal of the first reset signal terminal. The second reset circuit is coupled to the second node and a first power terminal, and is configured to transmit a signal of the first power supply terminal to the second node in response to a control signal.Type: ApplicationFiled: July 30, 2021Publication date: August 1, 2024Inventors: Huaping SUN, Kai ZHANG, Erlong SONG, Qiang FU, Xingrui CAI
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Publication number: 20240241328Abstract: The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.Type: ApplicationFiled: March 27, 2024Publication date: July 18, 2024Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.Inventors: Honghao ZHANG, Benzheng DONG, Yifan XIE, Kai LIU, Qinhao FU, Dan LI, Tengfei WANG
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Publication number: 20240195527Abstract: Methods, devices, and computer-readable storage media are disclosed. In an example method, segmentation of to-be-encoded information bits of a length N into respective quantities of different types of segments is performed. The different types of segments are among (b?a+1) types of segments that correspond to (b?a+1) different segment code lengths. The (b?a+1) types of segments comprise a minimum-length segment that has the minimum segment code length of 2{circumflex over (?)}a and a maximum-length segment that has the maximum segment code length of 2{circumflex over (?)}b. The respective quantities of the different types of segments are determined based on the length N and a code rate in an orderly manner, wherein the orderly manner comprises firstly determining a quantity of the maximum-length segments and lastly determining a quantity of the minimum-length segments. Polar code encoding is performed on the respective quantities of the different types of segments of the to-be-encoded information bits.Type: ApplicationFiled: December 29, 2023Publication date: June 13, 2024Inventors: Shengchen DAI, Jiajie TONG, Zhan YU, Kai FU, Rong LI, Jun WANG
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Publication number: 20240109337Abstract: A label printing and attaching system includes a label printing device and a label attaching device. The label printing device has an ink tape supply mechanism for supplying an ink tape with a label pattern. A label tape supply mechanism of the label printing device is adapted to supply a label tape that includes a carrier tape and blank label paper adhered to the carrier tape. The label printing device further includes a heat transfer machine adapted to heat transfer the label pattern on the ink tape onto the blank label paper of the label tape to obtain a desired label. The label attaching device has a label picker adapted to pick up the label with the printed label pattern from the label tape, and a moving device adapted to move the label picker to place the picked label with the printed label pattern onto a product.Type: ApplicationFiled: September 28, 2023Publication date: April 4, 2024Applicants: Tyco Electronics (Dongguan) Ltd., TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co., Ltd.Inventors: Zongjie (Jason) Tao, Hongzhou (Andy) Shen, Dandan (Emily) Zhang, Roberto Francisco-Yi Lu, Guoqiang Liu, Ziqiang Xiong, Kai Fu, Xueyun Zhu, Yi Li, Xuyan Yu
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Publication number: 20240089156Abstract: This application provides a short-range wireless communication method and a related device. The method includes: generating a transmission frame. The transmission frame includes a frame header and a data domain, phase shift keying modulation is used for the frame header, and quadrature amplitude modulation or phase shift keying modulation is used for the data domain. The method includes sending the transmission frame. In this application, the phase shift keying modulation is used for the frame header of the transmission frame, and the phase shift keying modulation or the quadrature amplitude modulation with a same bandwidth is used for the data domain.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Heng ZHANG, Kai FU, Zhiping LI, Zhan YU
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Patent number: 11883503Abstract: Provided are compositions and methods for treating cancer comprising the use of a immunoconjugate in combination with a cytotoxic agent or cytotoxic therapy. The immunoconjugate in combination with a cytotoxic agent or cytotoxic therapy shows synergistic effects in cancer treatment.Type: GrantFiled: September 21, 2018Date of Patent: January 30, 2024Assignee: DINGFU BIOTARGET CO., LTD.Inventors: Ting Xu, Yan Luan, Shilong Fu, Songbing Qin, Jian Ding, Kai Fu
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Patent number: 11884644Abstract: Disclosed is a method for synthesizing (S)-nicotine and an intermediate thereof, which belongs to the field of synthesizing a heterocyclic compound. A chiral amino group is introduced into 4-hydroxy-1-(3-pyridyl)-1-butanone by transaminase chiral catalysis in the presence of an amino donor to obtain (S)-4-amino-4-(3-pyridyl)-1-butanol. An N-methylation reaction is performed on (S)-4-amino-4-(3-pyridyl)-1-butanol with a methylating agent to obtain (S)-4-(methylamino)-4-(3-pyridyl)-1-butanol. The intermediate is reacted with an acylating agent or a halogenating agent to convert an alcoholic hydroxyl group into a sulfonate group or a halogen. Finally, a ring closure reaction is performed to obtain (S)-nicotine in an alkaline condition. The raw materials are cheap and readily available, the reaction conditions are mild, the operation is simple, and the cost is low.Type: GrantFiled: September 1, 2023Date of Patent: January 30, 2024Assignee: Shandong Jincheng Pharmaceutical Chemical Co., Ltd.Inventors: Kai Fu, Jiaquan Li, Peng Wang, Qinyuan Ma, Xicheng Zhang, Gengxiu Zheng, Ruihua Hu
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Patent number: 11888614Abstract: A method includes determining, based on a length of to-be-encoded information bits and a code rate, a code length N after encoding; determining, based on N, a minimum segment code length and a maximum segment code length, a reserved segment quantity of each type of segments in segments of b?a+1 types of segment code lengths and a reserved code length corresponding to N, where the minimum segment code length is 2{circumflex over (?)}a, and the maximum segment code length is 2{circumflex over (?)}b; determining a segment quantity of each type of segments based on N, the reserved code length, a segment code length of each type of segments, and the reserved segment quantity, where N corresponds to S segments, and a segment code length of an ith segment in the S segments is greater than or equal to a segment code length of an (i+1)th segment in the S segments.Type: GrantFiled: March 25, 2022Date of Patent: January 30, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Shengchen Dai, Jiajie Tong, Zhan Yu, Kai Fu, Rong Li, Jun Wang