Patents by Inventor Kai Heinlein

Kai Heinlein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Biaxial measuring device and method for determining normal and shear stress-correlated material parameters
    Patent number: 9958365
    Abstract: A method for determining material parameters includes applying a character grid over a planar sample, clamping the planar sample in a frame in accordance with directions of orthotropy of the planar sample; collecting a first set of data that describes a first position of the character grid; applying predetermined normal and shear stresses to the planar sample thereby bringing the planar sample into a deformed state and changing the position of the character grid; collecting a second set of data that describes a second position of the character grid, determining a relative position change of the character grid by correlating the collected first set of data and the second set of data; determining a relative displacement and a current distortion state of the planar sample; determining a deformation equilibrium of the deformed state of the planar sample; and calculating the material parameters from the deformation equilibrium.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: May 1, 2018
    Assignee: KARLSRUHER INSTITUT FUER TECHNOLOGIE
    Inventors: Kai Heinlein, Arnold Mager, Rosemarie Wagner
  • BIAXIAL MEASURING DEVICE AND METHOD FOR DETERMINING NORMAL AND SHEAR STRESS-CORRELATED MATERIAL PARAMETERS
    Publication number: 20170268970
    Abstract: A method for determining material parameters includes applying a character grid over a planar sample, clamping the planar sample in a frame in accordance with directions of orthotropy of the planar sample; collecting a first set of data that describes a first position of the character grid; applying predetermined normal and shear stresses to the planar sample thereby bringing the planar sample into a deformed state and changing the position of the character grid; collecting a second set of data that describes a second position of the character grid, determining a relative position change of the character grid by correlating the collected first set of data and the second set of data; determining a relative displacement and a current distortion state of the planar sample; determining a deformation equilibrium of the deformed state of the planar sample; and calculating the material parameters from the deformation equilibrium.
    Type: Application
    Filed: July 24, 2015
    Publication date: September 21, 2017
    Inventors: Kai Heinlein, Arnold Mager, Rosemarie Wagner