Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device, including a reaction chamber having a gas inlet for receiving a gas flow, a pedestal in the reaction chamber configured to support a substrate, and a first gas distribution plate (GDP) in the reaction chamber and between the gas inlet and the pedestal, wherein the first GDP is configured to include a plurality of concentric regions arranged along a radial direction, and a plurality of first holes arranged in the concentric regions of the first GDP, an open ratio of the first GDP in an outer concentric region is greater than that in an inner concentric region proximal to the outer concentric region to redistribute the gas flow.

Abstract: An apparatus for inspecting a wafer process chamber is disclosed. In one example, the apparatus includes: a sensor, a processor, and a lifetime predictor. The sensor captures information about at least one hardware part of the wafer process chamber. The processor processes the information to determine a hardware condition of the at least one hardware part. The lifetime predictor predicts an expected lifetime left for the at least one hardware part based on the hardware condition.

Abstract: An electrical connector includes an insulating housing, a plurality of conductive terminals fastened to the insulating housing, and a shielding element surrounding the insulating housing. The insulating housing has at least one docking surface. Each of the plurality of the conductive terminals has an extending portion. A surface of the extending portion of each of the plurality of the conductive terminals forms an insulation layer. The shielding element has a base body. At least one portion of a front surface of the base body protrudes frontward to form at least one sealing board attached to a rear of the at least one docking surface. The insulation layer of the extending portion of each of the plurality of the conductive terminals is exposed to the at least one docking surface, and is adjacent to and projects beyond a front surface of the at least one sealing board.

Abstract: The semiconductor device structures are provided. The semiconductor device structure includes a gate stack structure formed on a substrate and an isolation structure formed in the substrate. The semiconductor device structure further includes a source/drain stressor structure formed between the gate stack structure and the isolation structure and a metal silicide layer formed on the source/drain stressor structure. A portion of the metal silicide layer is below a top surface of the isolation structure.

Abstract: A receptacle connector includes an insulating housing, a plurality of conductive terminals fastened to the insulating housing, and a shielding element surrounding the insulating housing. The insulating housing has at least one docking surface. A portion of the at least one docking surface protrudes outward to form a protruding portion. Front ends of the conductive terminals are exposed to a front of the at least one docking surface. At least one portion of a front surface of the base body protrudes frontward to form at least one sealing board. A front end of the at least one sealing board opens a locking groove. The at least one sealing board is attached to a substantial middle of the insulating housing. The protruding portion is received in the locking groove and seals up the front end of the at least one sealing board. The protruding portion helps to reduce metal chips from being produced during interconnection of the receptacle connector with a plug connector.

Abstract: A receptacle connector includes an insulating housing, a plurality of terminals fastened to the insulating housing, a clamping element and two pairs of reinforcing blocks. A middle of a front surface of the insulating housing is recessed inward to form an insertion space. Two opposite sides of the insulating housing define two clamping grooves. The clamping element has a fixing board fastened to the insulating housing. Two opposite sides of the fixing board are bent frontward to form two clamping arms. Tail ends of the two clamping arms are connected with two clamping portions. The two pairs of reinforcing blocks are fastened in top walls and bottom walls of the two clamping grooves, respectively.

Abstract: A waterproof connector includes an insulating housing, a terminal assembly, a cover, a clamping part and a filler. The insulating housing has an inserting chamber, a mounting slot, a plurality of terminal grooves, an installing slot and a pair of clamping slots. The terminal assembly includes a plurality of terminals and a mounting lump molded outside the terminals. The mounting lump is mounted in the mounting slot of the insulating housing. The terminals are mounted in the terminal grooves of the insulating housing. The cover attaches on the bottom face of the insulating housing and the mounting lump. The clamping part is fixed in the installing slot of the insulating housing and tails of the clamping part project inward into the inserting chamber of the insulating housing. The filler is integratedly filled in the installing slot of the insulating housing. The waterproof connector greatly improves the waterproof effect.

Abstract: A receptacle connector assembly includes a plurality of receptacle connectors stacked up and down and fastened together. The receptacle connector includes a first terminal module, two second terminal modules, two middle shielding plates, two docking modules, and a shielding shell surrounding the first terminal module, the second terminal modules, the middle shielding plates and the docking modules. The first terminal module includes a first base block which has a first fastening portion. Two side surfaces of the first fastening portion protrude upward and outward to form two flanks. Each of the second terminal modules has a second base block. Each of the middle shielding plates is mounted between one of the flanks and the corresponding second base block. The two docking modules are mounted to the first terminal module, the two middle shielding plates and the two second terminal modules.

Abstract: A receptacle connector assembly includes a plurality of receptacle connectors stacked up and down and fastened together. The receptacle connector includes a first terminal module, two second terminal modules, two middle shielding plates, two docking modules, and a shielding shell surrounding the first terminal module, the second terminal modules, the middle shielding plates and the docking modules. The first terminal module includes a first base block which has a first fastening portion. Two side surfaces of the first fastening portion protrude upward and outward to form two flanks Each of the second terminal modules has a second base block. Each of the middle shielding plates is mounted between one of the flanks and the corresponding second base block. The two docking modules are mounted to the first terminal module, the two middle shielding plates and the two second terminal modules.

Abstract: The semiconductor device structures are provided. The semiconductor device structure includes a gate stack structure formed on a substrate and an isolation structure formed in the substrate. The semiconductor device structure further includes a source/drain stressor structure formed between the gate stack structure and the isolation structure and a metal silicide layer formed on the source/drain stressor structure. A portion of the metal silicide layer is below a top surface of the isolation structure.

Abstract: An electronic device includes a housing having a top wall, and a microphone module mounted in the housing. The microphone module includes a mounting seat having two oppositely spaced-apart upright suspension surfaces extending transversely from the top wall. A buffer member includes a main body disposed between and spaced apart from the suspension surfaces, and two suspension bumps protruding from the main body toward and abutting respectively and tightly against the suspension surfaces. The main body has an inner portion defining an accommodating space. A microphone body is disposed in the accommodating space.

Abstract: A card connector includes a first housing, terminals and a second housing. The first housing has a base portion, a front surface of the base portion forms a protruded portion, a rear surface of the base portion forms an extending portion. A front surface of the protruded portion forms an inserting chamber extended to the extending portion. The rear surface of the base portion defines a fixing cavity located below the extending portion. Terminal grooves are defined in a top wall of the fixing cavity and a bottom surface of the extending portion and communicates with the inserting chamber and the fixing cavity. The terminals include first terminals and second terminals integratedly molded in the second housing. The second housing with the first terminals and the second terminals are fixed in the fixing cavity. The first terminals and the second terminals pass through the terminal grooves and extending into the inserting chamber.

Abstract: Methods for forming a semiconductor device structure are provided. The method includes providing a substrate and forming an isolation structure in the substrate. The method also includes forming a gate stack structure on the substrate and etching a portion of the substrate to form a recess in the substrate, and the recess is adjacent to the gate stack structure. The method includes forming a stressor layer in the recess, and a portion of the stressor layer is grown along the (311) and (111) crystal orientations.

Abstract: A connector includes an insulating housing, a signal contact set, a ground contact and a fixing pin. A containing slot is formed on the insulating housing and the insulating housing has an engaging structure located inside the containing slot. The signal contact set is installed inside the insulating housing. The ground contact is installed inside the insulating housing and opposite to the signal contact set. The fixing pin is installed inside the insulating housing and located between the signal contact set and the ground contact. The fixing pin includes a main body, a latching portion and an embedding portion. The main body is installed inside the containing slot. The latching portion protrudes from the main body and is for latching the engaging structure. The embedding portion extends from the main body and is for embedding into a mating hole on a circuit board.

Abstract: A water-proof connector includes a housing, a plurality of terminals and a waterproof component. The housing has a base portion, a center of a top face of the base portion defines a cavity, a bottom of the cavity defines a plurality of terminal grooves extending frontward and rearward and penetrating a rear face of the base portion. The plurality of terminals are assembled in the terminal grooves of the housing. The waterproof component includes an insulation cover board, a sealing element. The insulation cover board is assembled in the cavity, the sealing element is secondary molded in a rear end of the cavity of the housing and on a rear end of the insulation cover board.

Abstract: A card connector for receiving an electrical card therein includes an insulating housing, a plurality of electrical contacts, a plastic sheet, a shielding shell and a heat activated film. The insulating housing has a bottom wall, a rear wall and two side walls which together form an inserting chamber. The electrical contacts are fixed in the bottom wall of the insulating housing. The plastic sheet is pasted on a bottom of the insulating housing. The shielding shell covers on the insulating housing. The heat activated film is welded between the shielding shell and the rear wall and the side walls of the insulating housing.

Abstract: An improved semiconductor device is provided whereby the semiconductor device is defined by a layered structure comprising a first dielectric layer, a data storage material disposed on the first dielectric layer, and a second dielectric layer disposed on the data storage material, the layered structured substantially forming the outer layer of the semiconductor device. For example, the semiconductor device may be a SONOS structure having an oxide-nitride-oxide (ONO) film that substantially surrounds the SONOS structure. The invention also provides methods for fabricating the semiconductor device and the SONOS structure of the invention.

Abstract: A connector includes an insulating housing, a signal contact set, a ground contact and a fixing pin. A containing slot is formed on the insulating housing and the insulating housing has an engaging structure located inside the containing slot. The signal contact set is installed inside the insulating housing. The ground contact is installed inside the insulating housing and opposite to the signal contact set. The fixing pin is installed inside the insulating housing and located between the signal contact set and the ground contact. The fixing pin includes a main body, a latching portion and an embedding portion. The main body is installed inside the containing slot. The latching portion protrudes from the main body and is for latching the engaging structure. The embedding portion extends from the main body and is for embedding into a mating hole on a circuit board.