Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A gear module includes a rotating cylinder, a first planetary gear set, a second planetary gear set, a concave-convex structure, and a limit bearing set. The first planetary gear set is accommodated in the rotating cylinder and includes a driven gear; the second planetary gear set includes a positioning frame, second planetary gears pivoted to a positioning frame, a driven gear engaged with the second planetary gears, and the positioning frame has a through hole; the concave-convex structure includes a convex column extended from the rotating cylinder and a concave hole formed on the positioning frame, the convex column is plugged into the concave hole; the limit bearing set includes a first ball bearing sheathing the driven gear and mounted between the driven gear and the through hole, and a second ball bearing sheathing the convex column and mounted between the convex column and the concave hole.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A low rotational speed gear module includes a fixed tube member, a rotational sleeve, a first planetary gear set, a sun gear, and a second planetary gear set. The fixed tube member includes a first inner gear. The rotational sleeve includes a second inner gear. The first planetary gear set includes a fixing plate, first planetary gears fixed to one side of the fixing plate, and a driven gear fixed to the other side of the fixing plate. The first planetary gear is engaged at one side with the sun gear and engaged at another side with the first inner gear. The second planetary gear set includes second planetary gears. The second planetary gears is engaged at one side with the driven gear and engaged at another side with the first inner gear and the second inner gear.

Abstract: A low rotational speed gear module includes a fixed tube member, a rotational sleeve, a first planetary gear set, a sun gear, and a second planetary gear set. The fixed tube member includes a first inner gear. The rotational sleeve includes a second inner gear. The first planetary gear set includes a fixing plate, first planetary gears fixed to one side of the fixing plate, and a driven gear fixed to the other side of the fixing plate. The first planetary gear is engaged at one side with the sun gear and engaged at another side with the first inner gear. The second planetary gear set includes second planetary gears. The second planetary gears is engaged at one side with the driven gear and engaged at another side with the first inner gear and the second inner gear.

Abstract: An example device in accordance with an aspect of the present disclosure includes a converter to convert an input voltage to an output voltage. The converter includes an input connector that occupies greater than one third of a frontal area of the converter.

Abstract: An example device in accordance with an aspect of the present disclosure includes a converter to convert an input voltage to an output voltage. The converter includes an input connector that occupies greater than one third of a frontal area of the converter.