Patents by Inventor KAI HSIUNG TSAI

KAI HSIUNG TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • White light emitting diode, manufacturing method and packaging material thereof
    Patent number: 9365768
    Abstract: A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: June 14, 2016
    Inventors: Guan-Jie Luo, Kai Hsiung Tsai
  • WHITE LIGHT EMITTING DIODE, MANUFACTURING METHOD AND PACKAGING MATERIAL THEREOF
    Publication number: 20160005934
    Abstract: A white light emitting diode comprising a substrate layer, two conductive frames, a light emitting unit, two conductive wires, and a packaging element is provided. The substrate layer is made from a curing reaction of first mixture, and the first mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The packaging element is made from a curing reaction of second mixture, and the second mixture includes a curable resin, a curing agent, a phosphor material, and a modified thermal conductive nano-material, wherein the modified thermal conductive nano-material is made from a thermal conductive nano-material and a silane compound. The chip-type white light emitting diode has a good heat-dissipating effect and a good luminous efficiency without additional heat dissipation fins.
    Type: Application
    Filed: May 5, 2015
    Publication date: January 7, 2016
    Inventors: GUAN-JIE LUO, KAI HSIUNG TSAI