Abstract: A method for finding manufactured or to-be-manufactured products for defects includes obtaining basic information on processing history of products passed by each manufacturing machine at each processing workstation, and obtaining processing factor information of same, where each product is passed by a defect detection workstation after the product is passed by at least one processing workstation. The method includes obtaining quality information detected by each defect detection workstation. The method determines one or more problem manufacturing machines at one or more problem processing workstations according to the basic information on processing history and the quality information of the products. The method further determines one or more processing factors which influence the problem manufacturing machines according to the processing factor information of each manufacturing machine and the quality information of the products.

Abstract: A method for finding manufactured or to-be-manufactured products for defects includes obtaining basic information on processing history of products passed by each manufacturing machine at each processing workstation, and obtaining processing factor information of same, where each product is passed by a defect detection workstation after the product is passed by at least one processing workstation. The method includes obtaining quality information detected by each defect detection workstation. The method determines one or more problem manufacturing machines at one or more problem processing workstations according to the basic information on processing history and the quality information of the products. The method further determines one or more processing factors which influence the problem manufacturing machines according to the processing factor information of each manufacturing machine and the quality information of the products.

Abstract: A system and a method for monitoring states of an injection molding machine includes a data collector, a controller, and an alarm apparatus. The data collector communicates with a molding equipment, a mold, and a mold temperature controller. Data of the molding equipment, data of the mold, and data of the mold temperature controller is constantly collected in real time by the data collector. The controller determines whether the data comprises a value exceeding a predetermined value range. The alarm is activated if the data is determined to comprises a value exceeding the predetermined value ranges.

Abstract: A shipment prediction method and a shipment prediction device using the shipment prediction method obtains name of at least one material or product or object, and at least one number corresponding to the material name; a pre-trained material consumption prediction model is invoked, and consumption or usage of such material corresponding to the at least one number. A correspondence relation table between material numbers and product information is queried according to the quantities of material corresponding to the at least one number, and a shipment or dispatch of materials corresponding to the at least one number. The correspondence relation table records material numbers of all materials required for producing each product and a quantity of materials for each product and overall. The shipment prediction method and device renders shipment prediction more efficient and effective.

Abstract: A method for setting parameters in design of a printed circuit board (PCB) includes obtaining multiple combinations of layout parameters of a PCB and inputting the multiple combinations of layout parameters into a predetermined PCB layout simulation software to obtain multiple interference parameter combinations. The multiple combinations of layout parameters and the multiple interference parameter combinations are defined as training samples, and a predetermined network model is trained through the training samples to obtain a first prediction model. The first prediction model is trained and tested to obtain an impedance prediction model. When the multiple combinations of layout parameters are inputted to the impedance prediction model, only an average predetermined error is allowed between impedance values predicted by the impedance prediction model and impedance values calculated by the predetermined PCB layout simulation software, to enable acceptance of that combination.