Abstract: A built in beat diffusion lamp body for LED lamp was invented. The purpose of the invention is to solve the difficulties of poor heat conduction and diffusion caused by the small heat diffusion surface of the material of a conventional LED lamp. The lamp body is made of a set of heat diffusion vanes encircling the heat diffusion complex. The vanes and heat diffusion complex are made from Aluminum alloy in a single process of extrusion moulding. The transverse section of the heat diffusion body is volute shaped. The bottom of the heat diffusion complex is fixed to an aluminum board or an aluminum circuit: board by interference fit. The heat generated by the LED elements can be absorbed and diffused by the board, the heat diffusion complex and the surrounding diffusion element. The outward appearance of the heat diffusion lamp body may be shaped into cup, ladder, or cylinder likeness to satisfy the application requirement.

Abstract: An method for analyzing irreversible apneic coma (IAC) for determining the presence of irreversible apneic coma (IAC) by analyzing the heart rate variability of a brain traumatic patient, thereby providing a physician a reference index to determine whether brain death has occurred. This method includes, at first, recording an electrocardiogram (ECG) from a subject. Then, analyzing R-R interval in said electrocardiogram (ECG), and plotting said R-R interval into Poincaré plot, wherein the X coordinate in said Poincaré plot represents R-R interval(n), and n is a 1˜data number. Y coordinate in said Poincaré plot represents RR(n+1). And, finally, quantifying said Poincaré plot, and obtaining semi-major axis (SD1), semi-minor axis (SD2), and SD1/SD2 of said Poincaré plot, as well as Poincaré plot area.

Abstract: An outdoor lighting system comprises an outdoor light source, a luminance control device, a detection apparatus, a communication network and a main controlling system. The detection apparatus is configured for detecting a luminance of the light source and generating a corresponding detecting signal associated with the luminance of the light source. The main controlling system receives the detecting signal from the detection apparatus via the communication network, and generates a luminance control signal in responsive to the detecting signal; the luminance control device is configured for receiving the luminance control signal via the communication network and regulating the luminance of the light source according to the luminance control signal.

Abstract: An embedded metal heat sink for a semiconductor device and a method for manufacturing the same are described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: An embedded metal heat sink for a semiconductor device is described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: A flexible super capacitor including a pair of flexible electrodes and a separator film is disclosed. Each flexible electrode includes a carbon fiber layer and a collector formed on a surface of the carbon fiber layer. The pair of flexible electrodes has two outer surfaces, and the collector layers are formed on the outer surfaces of the pair of the flexible electrodes. The separator film is disposed between the flexible electrodes. The collector layer would be formed on the carbon fiber layer with surface metalizing the carbon fiber layer. A method for fabricating the flexible electrode of the flexible super capacitor is also disclosed.

Abstract: A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.

Abstract: An electronic device having a keyboard fixed through a set of suckers and most suitably applied to the host body of an electronic product is provided. The electronic device includes a casing, a keyboard module and at least a sucker. The keyboard module has at least a key and the sucker is used for attaching the keyboard module to the casing. Furthermore, the sucker includes a first coupling part and a second coupling part. The first coupling part is used for sucking up the keyboard module and the second coupling part is used for fixing the sucker to the casing so that the electronic device and the host body can be assembled together smoothly.

Abstract: A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.

Abstract: An embedded metal heat sink for a semiconductor device and a method for manufacturing the same are described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.

Abstract: The solution is useful for removing a barrier material from a semiconductor substrate. The solution comprises, by weight percent, 0.01 to 25 oxidizer, 0 to 15 inhibitor for a nonferrous metal, 0 to 15 abrasive, 0 to 20 complexing agent for the nonferrous metal, 0.01 to 12 barrier removal agent and balance water. The barrier removal agent is selected from the group comprising imine derivative compounds, hydrazine derivative compounds and mixtures thereof.

Abstract: A hinge assembly includes an inner ring and an outer ring. The outer ring has an outer ring slot penetrating the sidewall of the outer ring and connecting both ends of the outer ring. The inner ring has an inner ring slot penetrating the sidewall of the inner ring and connecting both ends of the inner ring. The inner ring is coaxially connected to the outer ring. When the inner ring slot and the outer ring slot are aligned, an electrical connecting device can pass through the inner ring slot and outer ring slot to stay in the hinge assembly.

Abstract: A wire-to-board connector for coupling electrically a circuit board to a transmission wire unit, includes a plug receptacle, a plurality of signal contacts and a mating header. The plug receptacle is mounted on the circuit board. The mating header includes an insert body that is disposed at one end of the transmission wire unit and that has a plurality of resilient metal elements. When the insert body is plugged into the plug receptacle, the resilient metal elements respectively contact with the signal contacts of the plug receptacle, thereby establishing electrical communication with the circuit board and the transmission wire unit.

Abstract: The present invention discloses a portable multimedia player which comprises a panel, a base, and an electric swiveling mechanism for two axes combining the panel and the base. The electric swiveling mechanism further comprises a first swiveling mechanism and a second swiveling mechanism for controlling yaw and pitch swiveling, respectively.

Abstract: The invention relates to a sealing device for writing tool. The sealing device comprises a sealing sleeve having an aperture at its lower end through which a marking material or lead can pass; an arc-shaped sealing port integrated with the sealing sleeve at a front end and divided into parts by divisional lines that extend in an axial direction. When the sealing port is open, it communicates with the aperture. An elastic clamping member covers a periphery of a root portion of the sealing port to clamp the sealing device tightly and to prevent damage. The clamping device can also enhance the resilient force of the sealing port. A projecting rib is formed on the root portion of the sealing port, correspondingly, a peripheral flange mating with the projecting rib is formed on the elastic clamping member. A shoulder is formed on the lower portion of the said sealing sleeve to increase the contact area and improve the sealing effect between the sealing sleeve and the writing tool.

Abstract: A light-emitting device and a process for manufacturing the same are described. The light-emitting device comprises: a thin metal layer including a first surface and a second surface on opposite sides; a metal heat sink directly formed and closely connected to the second surface of the thin metal layer; and a light-emitting chip deposed on a portion of the first surface of the thin metal layer, wherein the thin metal layer directly contacts and is closely connected with the light-emitting chip.

Abstract: A mobile phone includes a main body, a first magnetic device, a slide cover and a second magnetic device. The first magnetic device is disposed on the main body. The slide cover is slidably connected to the main body and can slide relative to the main body. The second magnetic device is disposed on the slide cover. When the slide cover moves to a distance relative to the main body, the first magnetic device attracts the second magnetic device so that the slide cover slides to a first positioning point.

Abstract: A water-soluble polymer is used to change surfaces of the magnetic metal oxide nanoparticles to hydrophilic surfaces. The hydrophilic magnetic metal s oxide nanoparticles can be stably dispersed in a water matrix. Then, the hydrophilic magnetic metal oxide nanoparticles are mixed with hydrophilic resin, and a nanometer-scale uniform size of nanoparticles is maintained.

Abstract: The present invention discloses a portable multimedia player which comprises a panel, a base, and an electric swiveling mechanism for two axes combining the panel and the base. The electric swiveling mechanism further comprises a first swiveling mechanism and a second swiveling mechanism for controlling yaw and pitch swiveling, respectively.

Abstract: An electronic device having a keyboard fixed through a set of suckers and most suitably applied to the host body of an electronic product is provided. The electronic device includes a casing, a keyboard module and at least a sucker. The keyboard module has at least a key and the sucker is used for attaching the keyboard module to the casing. Furthermore, the sucker includes a first coupling part and a second coupling part. The first coupling part is used for sucking up the keyboard module and the second coupling part is used for fixing the sucker to the casing so that the electronic device and the host body can be assembled together smoothly.