Patents by Inventor Kai-Hua Li

Kai-Hua Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Patent number: 11172738
    Abstract: A connection structure and a wearing device are provided. The connecting structure includes a connecting member, a latching member, an engaging member, and an elastic member; one of two ends of the latching member is rotatably connected with the connecting member, and the other end of the latching member is provided with a latching portion; the engaging member is provided with an engaging portion corresponding to the latching portion, and the elastic member can engage the latching portion with the engaging portion. The wearing device includes the connection structure. The latching member is rotatably connected with the connecting member so as to enable the latching member to be quickly separated from the engaging member, and two mechanisms could be connected and separated from each other quickly with the connection structure.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: November 16, 2021
    Assignee: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Kai-Hua Li, Jia-Le Cai, Tong Yu
  • Publication number: 20200000184
    Abstract: A connection structure and a wearing device are provided. The connecting structure includes a connecting member, a latching member, an engaging member, and an elastic member; one of two ends of the latching member is rotatably connected with the connecting member, and the other end of the latching member is provided with a latching portion; the engaging member is provided with an engaging portion corresponding to the latching portion, and the elastic member can engage the latching portion with the engaging portion. The wearing device includes the connection structure. The latching member is rotatably connected with the connecting member so as to enable the latching member to be quickly separated from the engaging member, and two mechanisms could be connected and separated from each other quickly with the connection structure.
    Type: Application
    Filed: June 14, 2019
    Publication date: January 2, 2020
    Applicant: LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
    Inventors: Kai-Hua Li, Jia-Le Cai, Tong Yu