Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A charging module for electric vehicle includes a power conversion unit, a heat dissipation unit, and a thermoelectric module. The power conversion unit includes a power conversion module disposed inside a cabinet, and the power conversion unit provides output power. The heat dissipation unit cools the power conversion unit through liquid cooling or air cooling. The thermoelectric module generates electrical energy based on a temperature difference between the power conversion unit and the heat dissipation unit during operation. The electrical energy is supplied to the power conversion unit and/or the heat dissipation unit.

Abstract: A liquid-cooled charging equipment with multiple charging connector assemblies includes a recirculating cooling apparatus, a plurality of charging connector assemblies, a plurality of coolant supply pipes, a plurality of coolant return pipes, a plurality of valves, and a control unit. The recirculating cooling apparatus has an outlet side and an inlet side. Each charging connector assembly includes a charging connector and a charging cable having an inlet end and an outlet end. Each valve is correspondingly disposed in each coolant supply pipe. The control unit is coupled to the valves and the charging connector assemblies. When the charging connector assemblies are in operation of charging, the control unit opens the valves corresponding to the charging connector assemblies to allow the low-temperature coolant provided by the recirculating cooling apparatus to flow through the coolant supply pipes to cool the charging connectors.

Abstract: A charging module for electric vehicle includes a power conversion unit, a heat dissipation unit, and a thermoelectric module. The power conversion unit includes a power conversion module disposed inside a cabinet, and the power conversion unit provides output power. The heat dissipation unit cools the power conversion unit through liquid cooling or air cooling. The thermoelectric module generates electrical energy based on a temperature difference between the power conversion unit and the heat dissipation unit during operation. The electrical energy is supplied to the power conversion unit and/or the heat dissipation unit.

Abstract: A charging column includes an equipment box having a control equipment and a delivery pipelines, an isolated docking box disposed outside the equipment box, a power device and a cooling pipeline. An interior of the isolated docking box is isolated from an interior of the equipment box. A first pair of joints are connected to the delivery pipelines and electrodes are electrically connected to the control equipment inside the isolated docking box. The power device is connected to the isolated docking box and the electrodes therein. The cooling pipeline connected to the isolated docking box includes a second pair of joints for engaging with the first pair of joints. Any coolant leakage and falling off objects can be retained inside the isolated docking box, thereby protecting the control equipment from damages.

Abstract: A charging column includes an equipment box having a control equipment and a delivery pipelines, an isolated docking box disposed outside the equipment box, a power device and a cooling pipeline. An interior of the isolated docking box is isolated from an interior of the equipment box. First pair of joints are connected to the delivery pipelines and electrodes are electrically connected to the control equipment inside the isolated docking box. The power device is connected to the isolated docking box and the electrodes therein. The cooling pipeline connected to the isolated docking box includes second pair of joints for engaging with the first joints. Any coolant leakage and falling off objects can be retained inside the isolated docking box, thereby protecting the control equipment from damages.

Abstract: A collapsible electronic equipment includes a first part, a shaft, a second part, a retaining element, and a blocking element. The first part pivots on the second part via the shaft. The retaining element is disposed on the shaft, and the blocking element is movably disposed on the second part. When the blocking element is abutted against the retaining element, a relative position between the first part and the second part is maintained.

Abstract: A heat-dissipation structure is disclosed. The heat-dissipation structure is used on an electronic apparatus including a heating element and a vent structure. The heat-dissipation structure includes a heat pipe, a fin group, a fan, a heat-dissipation gate and a shape memory element. One end of the shape memory element is connected with the heat pipe and another end is connected with the heat-dissipation gate. Heat deformation of the shape memory element causes the heat-dissipation gate to move so as to open or close the vent structure.

Abstract: A collapsible electronic equipment includes a first part, a shaft, a second part, a retaining element, and a blocking element. The first part pivots on the second part via the shaft. The retaining element is disposed on the shaft, and the blocking element is movably disposed on the second part. When the blocking element is abutted against the retaining element, a relative position between the first part and the second part is maintained.

Abstract: A collapsible electronic equipment includes a first part, a hinge device, and a second part. The first part pivots on the second part via the hinge device. When the second part is inclined at an inclined angle relative to the first part, a shaft of the hinge device is moved from a first position to a second position.

Abstract: A transflective liquid crystal display panel includes a substrate, a gate electrode, a reflective electrode, a first insulating layer, a patterned semiconductor layer, a source electrode, a drain electrode, a patterned reflective layer, a second insulating layer, and at least a transmissive pixel electrode. The gate electrode and the reflective electrode are both formed by a first patterned conductive layer, and the source electrode, the drain electrode, and the patterned reflective layer are both formed by a second patterned conductive layer. Furthermore, a plurality of contact holes are formed in the first insulating layer and the second insulating layer. Moreover, the transmissive pixel electrode is filled into the contact holes to be electrically connected with the drain electrode, the reflective electrode, and the patterned reflective layer, respectively.

Abstract: An electronic device and a method for operating application programs are provided. In the method, an application program listing frame is displayed on a touch screen of the electronic device, wherein the application program listing frame comprises a first icon corresponding to a first application program. When a first touch operation applied to the first icon is detected by the touch screen, the first application program is launched. However, when a second touch operation applied to the first icon is detected by the touch screen, a first simple frame related to the first application program is popped out from the application program listing frame while the first application program is not running. A size of the first simple frame is smaller than the application program listing frame, and the first touch operation is different from the second touch operation.

Abstract: A method of manufacturing a transflective liquid crystal display panel includes the following steps. A substrate is provided. A first patterned conductive layer is formed on the substrate to form a gate electrode and a reflective electrode. A first insulating layer is formed on the first patterned conductive layer and the substrate. A patterned semiconductor layer is formed on the first insulating layer. A second patterned conductive layer is formed on the first insulating layer and the patterned semiconductor layer to form a source/drain electrode and a patterned reflective layer. A second insulating layer is formed on the second patterned conductive layer and the first insulating layer. Contact holes are formed in the first and the second insulating layer. A transmissive pixel electrode is formed and filled into the contact holes to be electrically connected respectively to the drain electrode, the reflective electrode, and the patterned reflective layer.

Abstract: A method of fabricating a pixel array substrate is disclosed. The reflective pixel array substrate can be made by utilizing five photo masks only. The reflective pixel array substrate includes a substrate, a thin film transistor, a reflective electrode, an insulating layer and numerous protruding bumps. The step between the protrusion bump and the substrate cause the reflective electrode thereon to have a corrugated structure. The gate electrode of the thin film transistor and the protruding bumps are made of a same conductive layer. The drain electrode connects the reflective electrode, and the drain electrode and the reflective electrode are made of a same conductive layer.

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.

Abstract: A method of manufacturing a transflective liquid crystal display panel includes the following steps. A substrate is provided. A first patterned conductive layer is formed on the substrate to form a gate electrode and a reflective electrode. A first insulating layer is formed on the first patterned conductive layer and the substrate. A patterned semiconductor layer is formed on the first insulating layer. A second patterned conductive layer is formed on the first insulating layer and the patterned semiconductor layer to form a source/drain electrode and a patterned reflective layer. A second insulating layer is formed on the second patterned conductive layer and the first insulating layer. Contact holes are formed in the first and the second insulating layer. A transmissive pixel electrode is formed and filled into the contact holes to be electrically connected respectively to the drain electrode, the reflective electrode, and the patterned reflective layer.