Abstract: To address the issue of more efficient utilization of computing resources across different time zones, this invention provides a global cross-time-zone computing power scheduling method. The computing platform performs the following steps: receive computing power demand information from at least one time zone and store it in a storage module; according to objective function and constraints, use the machine learning module, based on the machine learning algorithm, the heuristic algorithm, or deep learning algorithm module to calculate a computing power scheduling plan that maximizes the profitability and utilization rate of the computing platform; and, allocate GPU resources in at least one time zone according to the computing power scheduling plan.

Abstract: A sliding rail device includes an exterior frame, an outer rail, an intermediate rail, and a blocking mechanism that has a positioning member, a blocking member having a blocking protrusion and a blocking groove, a linking piece sleeved on the positioning member, and a resilient member. When the intermediate rail is moved relative to the outer rail in a longitudinal direction, the positioning member is pushed by the blocking member to move downwardly along an inclined portion of the blocking groove, and is consequently adapted to move a linking member downwardly. When the intermediate rail is moved in a direction opposite to the longitudinal direction relative to the outer rail, the positioning member is driven by a resilient force of the resilient member, via the linking piece, to move upwardly along the inclined portion.

Abstract: A support frame for a server cabinet includes a first rod member, a second rod member, a third rod member and a connection unit. The first rod member extends in a first direction. The second rod member and the third rod member are respectively disposed on opposite ends of the first rod member that are spaced apart from each other in the first direction. The second rod member is slidable relative to the first rod member in the first direction between a usage position and a storage position. The third rod member is pivotable relative to the first rod member between an unfolded position and a folded position. The connection unit is disposed on the first rod member, the second rod member and the third rod member for being connected to the server cabinet.

Abstract: A sliding rail device includes an exterior frame, an outer rail, an intermediate rail, and a blocking mechanism that has a positioning member, and a blocking member having a blocking protrusion and a blocking groove. When the intermediate rail is moved relative to the outer rail, the positioning member is pushed by the blocking member to move downwardly along an inclined portion of the blocking groove, and is consequently adapted to move a linking member downwardly and adapted to drive another sliding rail device that is connected to the linking member to move synchronously in a manner where a positioning member of the another sliding rail device is moved along a blocking portion of a blocking groove to be adjacent to a blocking protrusion so as to prevent movement of the intermediate rail of the another sliding rail device relative to the outer rail of the another sliding rail device.

Abstract: A sliding rail device includes an exterior frame, an outer rail, an intermediate rail, and a blocking mechanism that has a positioning member, a blocking member having a blocking protrusion and a blocking groove, a linking piece sleeved on the positioning member, and a resilient member. When the intermediate rail is moved relative to the outer rail in a longitudinal direction, the positioning member is pushed by the blocking member to move downwardly along an inclined portion of the blocking groove, and is consequently adapted to move a linking member downwardly. When the intermediate rail is moved in a direction opposite to the longitudinal direction relative to the outer rail, the positioning member is driven by a resilient force of the resilient member, via the linking piece, to move upwardly along the inclined portion.

Abstract: The present application provides a storage capacitor with multiple dielectrics. The storage capacitor includes a lower electrode, an upper electrode, a first dielectric layer, a second dielectric layer and a third dielectric layer. The first dielectric layer covers the lower electrode, the second dielectric layer is disposed on the first dielectric layer, and the third dielectric layer is disposed on the second dielectric layer. The upper electrode is disposed on the third dielectric layer.

Abstract: A memory device includes a semiconductor substrate having an active region, and a word line extending across the active region. The memory device also includes a first source/drain region and a second source/drain region disposed in the active region and at opposite sides of the word line, a bit line disposed over and electrically connected to the first source/drain region, and a capacitor disposed over and electrically connected to the second source/drain region. The capacitor includes a bottom electrode, a top electrode, and a capacitor dielectric structure disposed between them. The capacitor dielectric structure includes a first metal oxide layer, a second metal oxide layer disposed over the first metal oxide layer, and a third metal oxide layer disposed over the second metal oxide layer. The first, the second and the third metal oxide layer include materials that are different from each other.

Abstract: The present disclosure provides a method for preparing a memory device. The method includes forming a doped region in a semiconductor substrate, and forming a word line across the doped region such that a first source/drain region and a second source/drain region are formed in the doped region and at opposite sides of the word line. The method also includes forming a bit line over and electrically connected to the first source/drain region, and forming a capacitor over and electrically connected to the second source/drain region. The formation of the capacitor includes forming a bottom electrode, forming a capacitor dielectric structure over the bottom electrode, and forming a top electrode over the capacitor dielectric structure.

Abstract: The present application provides a method of fabricating a storage capacitor. The method includes steps of forming a lower electrode; depositing a first dielectric layer covering the lower electrode; depositing a second dielectric layer on the first dielectric layer; depositing a third dielectric layer on the second dielectric layer; and forming an upper electrode on the third dielectric layer.

Abstract: The present application provides a storage capacitor with multiple dielectrics. The storage capacitor includes a lower electrode, an upper electrode, a first dielectric layer, a second dielectric layer and a third dielectric layer. The first dielectric layer covers the lower electrode, the second dielectric layer is disposed on the first dielectric layer, and the third dielectric layer is disposed on the second dielectric layer. The upper electrode is disposed on the third dielectric layer.

Abstract: An identification method of an integrated circuit chip of the present invention includes identifying a surface structure or an internal structure of an integrated circuit chip, generating a structural information set according to the surface structure or internal structure, converting the structural information set into an identification information set. The identification information set generated by the above-mentioned identification method can be stored in a digital file, and a chip manufacturer requires no visible information printed on an outer surface of the integrated circuit chip such that factory information of the integrated circuit chip can be concealed.

Abstract: An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally managed.

Abstract: An energy saving air conditioning system is disclosed which provides different air conditioning modes, including a closed-loop mode, an open-loop mode, and a partial-loop mode, for controlling the environment in a high-density apparatus room. The energy saving air conditioning system uses a cloud operating center to monitor the temperature and the moisture inside and outside the high-density apparatus room. The cloud operating system dynamically selects the air conditioning mode in such a manner that energy can be saved and the environment in the high-density apparatus room can be optimally to managed.

Abstract: A cooling apparatus for server rack is disclosed, which is disposed above at least one server rack. The cooling apparatus for server rack includes a fan module disposed at a back end above the least one server rack, a heat exchanger module disposed at a front end above the least one server rack, and an air guide connecting the fan module and the heat exchanger module. A hot air exhausted from the back end of the least one server rack is extracted by the fan module and is sent to the heat exchanger module through the air guide, and the hot air is cooled by the heat exchanger module, and a cool air is exhausted from the front end of the least one server rack.

Abstract: A cooling apparatus for server rack is disclosed, which is disposed above at least one server rack. The cooling apparatus for server rack includes a fan module disposed at a back end above the least one server rack, a heat exchanger module disposed at a front end above the least one server rack, and an air guide connecting the fan module and the heat exchanger module. A hot air exhausted from the back end of the least one server rack is extracted by the fan module and is sent to the heat exchanger module through the air guide, and the hot air is cooled by the heat exchanger module, and a cool air is exhausted from the front end of the least one server rack.

Abstract: A commutate silencer of a computer system is described. The commutate silencer of the computer system is installed at the back end of the computer system, and comprises a shield device, a commutate device and at least one partition. The shield device comprises a first shield and a second shield, in which the first shield comprises an opening, the first shield and the second shield construct a first cavity, and the first cavity includes a plurality of outlets. The commutate device comprises a frame and a plurality of commutate diversion plates, in which the frame construct a second cavity, the diversion plates traverse the second cavity, the second cavity has an inlet and a ventilated opening, and the ventilated opening is connected to the opening of the first shield.

Abstract: A commutate silencer of a computer system is described. The commutate silencer of the computer system is installed at the back end of the computer system, and comprises a shield device, a commutate device and at least one partition. The shield device comprises a first shield and a second shield, in which the first shield comprises an opening, the first shield and the second shield construct a first cavity, and the first cavity includes a plurality of outlets. The commutate device comprises a frame and a plurality of commutate diversion plates, in which the frame construct a second cavity, the diversion plates traverse the second cavity, the second cavity has an inlet and a ventilated opening, and the ventilated opening is connected to the opening of the first shield.

Abstract: A heat dissipation device with heat pipes is described. The heat dissipation device includes at least one U-shaped heat pipe, a plurality of heat fins, and a heat sink base. A middle portion of the U-shaped heat pipe is coupled to the heat sink base to receive thermal energy and transmit the same to two arm portions of the U-shaped heat pipe so as to improve the heat dissipation efficiency. A fixing plate is further utilized to fix the U-shaped heat pipe onto the heat sink base. The fixing plate further absorbs the thermal energy and the thermal energy is transmitted from the middle portion of the U-shaped heat pipe to the two arm portions of the U-shaped heat pipe and then to the heat fins. Therefore, the heat dissipation device can increase the heat dissipation efficiency while reducing the space it occupies in an electrical device.