Patents by Inventor Kai-Jens Matejat
Kai-Jens Matejat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220304164Abstract: The present invention refers to a method of preparing a high density interconnect printed circuit board (HDI PCB) including microvias filled with copper comprising the steps of: a1) providing a multi-layer substrate comprising (i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers, (ii) a cover layer, and (iii) a microvia extending from the peripheral surface and ending on the conductive interlayer; b1) depositing a conductive layer; or a2) providing a multi-layer substrate comprising (i) a stack assembly of an electrically conductive interlayer embedded between two insulating layers, (ii) a microvia extending from the peripheral surface and ending on the conductive interlayer; b2) depositing a conductive layer; and c) electrodepositing a copper filling in the microvia and a first copper layer on the conductive layer which form together a planar surface and the thickness of the first copper layer is from 0.1 to 3 ?m.Type: ApplicationFiled: August 19, 2020Publication date: September 22, 2022Inventors: Akif ÖZKÖK, Bert REENTS, Mustafa ÖZKÖK, Marko MIRKOVIC, Markus YOUKHANIS, Horst BRÜGGMANN, Sven LAMPRECHT, Kai-Jens MATEJAT
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Patent number: 11032914Abstract: A method of forming a solderable solder deposit on a contact pad, comprising the steps of providing an organic, non-conductive substrate which exposes said contact pad under an opening of a first non-conductive resist layer, depositing a conductive layer inside and outside the opening such that an activated surface results, thereby forming an activated opening, electrolytically depositing nickel or nickel alloy into the activated opening such that nickel/nickel alloy is deposited onto the activated surface, electrolytically depositing tin or tin alloy onto the nickel/nickel alloy, with the proviso that the electrolytic deposition of later steps results in an entirely filled activated opening, wherein the entirely filled activated opening is completely filled with said nickel/nickel alloy, or in the entirely filled activated opening the total volume of nickel/nickel alloy is higher than the total volume of tin and tin alloy, based on the total volume of the entirely filled activated opening.Type: GrantFiled: December 22, 2017Date of Patent: June 8, 2021Assignee: Atotech Deutschland GmbHInventors: Kai-Jens Matejat, Sven Lamprecht, Jan Sperling, Christian Ohde
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Publication number: 20190350088Abstract: A method of forming a solderable solder deposit on a contact pad, comprising the steps of providing an organic, non-conductive substrate which exposes said contact pad under an opening of a first non-conductive resist layer, depositing a conductive layer inside and outside the opening such that an activated surface results, thereby forming an activated opening, electrolytically depositing nickel or nickel alloy into the activated opening such that nickel/nickel alloy is deposited onto the activated surface, electrolytically depositing tin or tin alloy onto the nickel/nickel alloy, with the proviso that the electrolytic deposition of later steps results in an entirely filled activated opening, wherein the entirely filled activated opening is completely filled with said nickel/nickel alloy, or in the entirely filled activated opening the total volume of nickel/nickel alloy is higher than the total volume of tin and tin alloy, based on the total volume of the entirely filled activated opening.Type: ApplicationFiled: December 22, 2017Publication date: November 14, 2019Inventors: Kai-Jens MATEJAT, Sven LAMPRECHT, Jan SPERLING, Christian OHDE
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Publication number: 20150349152Abstract: The present invention relates to a metallization method for solar cell substrates by electroplating wherein i) a resist is deposited onto at least one surface of a solar cell substrate and patterned, ii) a conductive seed layer is deposited onto the patterned resist and into the openings formed by the resist pattern, iii) a first metal or metal alloy is electroplated onto the conductive seed layer, and iv) those portions of the first metal or metal alloy layer deposited onto the patterned resist are removed.Type: ApplicationFiled: August 15, 2013Publication date: December 3, 2015Applicant: ATOTECH DEUTSCHLAND GmbHInventors: Torsten VOSS, Kai-Jens MATEJAT, Jan SPERLING, Sven LAMPRECHT, Catherine SCHOENENBERGER
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Patent number: 8871631Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.Type: GrantFiled: June 23, 2011Date of Patent: October 28, 2014Assignee: Atotech Deutschland GmbHInventors: Sven Lamprecht, Kai-Jens Matejat, Ingo Ewert, Stephen Kenny
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Patent number: 8507376Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.Type: GrantFiled: October 7, 2009Date of Patent: August 13, 2013Assignee: Atotech Deutschland GmbHInventors: Ingo Ewert, Sven Lamprecht, Kai-Jens Matejat, Thomas Pliet
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Patent number: 8497200Abstract: Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate.Type: GrantFiled: June 23, 2011Date of Patent: July 30, 2013Assignee: Atotech Deutschland GmbHInventors: Kai-Jens Matejat, Sven Lamprecht, Ingo Ewert
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Publication number: 20130168438Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.Type: ApplicationFiled: June 23, 2011Publication date: July 4, 2013Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Sven Lamprecht, Kai-Jens Matejat, Ingo Ewert, Stephen Kenny
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Publication number: 20130105329Abstract: Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface and i) electroplate a metal or metal alloy layer onto the conductive layer.Type: ApplicationFiled: July 29, 2011Publication date: May 2, 2013Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Kai-Jens Matejat, Sven Lamprecht, Ingo Ewert, Catherine Schoenenberger, Jürgen Kress
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Publication number: 20130082091Abstract: Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate.Type: ApplicationFiled: June 23, 2011Publication date: April 4, 2013Applicant: Atotech Deutschland GmbHInventors: Kai-Jens Matejat, Sven Lamprecht, Ingo Ewert
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Publication number: 20110189848Abstract: Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.Type: ApplicationFiled: October 7, 2009Publication date: August 4, 2011Inventors: Ingo Ewert, Sven Lamprecht, Kai-Jens Matejat, Thomas Pliet
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Patent number: 7520973Abstract: A method for the regeneration of etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out the method is described. The method involves feeding the etching solution to be regenerated from the etching system into an electrolysis cell being hermetically sealed or having an anode hood (8), the electrolysis cell comprising a cathode (1), an inert anode (2), means (3) for removing the electrolytically deposited copper from the cathode and means (4) for collecting the removed copper and applying a potential to the removed copper, wherein the electrolysis cell does not have an ion exchange membrane or a diaphragm.Type: GrantFiled: June 7, 2004Date of Patent: April 21, 2009Assignee: Atotech Deutschland GmbHInventors: Kai-Jens Matejat, Sven Lamprecht
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Publication number: 20060175204Abstract: A method for the regeneration of etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out the method is described. The method involves feeding the etching solution to be regenerated from the etching system into an electrolysis cell being hermetically sealed or having an anode hood (8), the electrolysis cell comprising a cathode (1), an inert anode (2), means (3) for removing the electrolytically deposited copper from the cathode and means (4) for collecting the removed copper and applying a potential to the removed copper, wherein the electrolysis cell does not have an ion exchange membrane or a diaphragm.Type: ApplicationFiled: June 7, 2004Publication date: August 10, 2006Inventors: Kai-Jens Matejat, Sven Lamprecht
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Patent number: 6899803Abstract: In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of the electrolyte fluid through one auxiliary cell provided with one insoluble auxiliary anode and at least one auxiliary cathode, a current being conducted between them by applying a voltage. Accordingly, excess quantities of the oxidized substances of the redox system are reduced at the auxiliary cathode, the formation of ions of the metal to be deposited being reduced as a result thereof. Starting from this prior art, the present invention relates to using pieces of the metal to be deposited as an auxiliary cathode.Type: GrantFiled: February 23, 2001Date of Patent: May 31, 2005Assignee: Atotech Deutschland GmbHInventors: Kai-Jens Matejat, Sven Lamprecht
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Publication number: 20040245108Abstract: The invention relates to a method of depositing a layer of metal and to a method of regenerating a solution containing metal ions in a high oxidation state. To regenerate tin ions consumed from a tin plating solution by metal deposition, it has been known in the art to carry the plating solution over metallic tin to cause tin (II) ions to form. However, the amount of tin contained in thus regenerated baths slowly and continuously increases. The solution to this problem is to utilize an electrolytic regeneration cell that is provided with at least one auxiliary cathode and with at least one auxiliary anode. Tin serving for regeneration is electrolytically deposited from the solution onto the at least one auxiliary cathode in the electrolytic regeneration cell. The solution is carried over the tin serving for regeneration in order to reduce formed tin (IV) ions to tin (II) ions.Type: ApplicationFiled: May 3, 2004Publication date: December 9, 2004Inventors: Thomas Beck, Hans-Jurgen Schreier, Sven Lamprecht, Rolf Schoder, Kai-Jens Matejat
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Publication number: 20030000842Abstract: In order to regulate the metal ion concentration in an electrolyte fluid serving to electrolytically deposit metal and additionally containing substances of an electrochemically reversible redox system, it has been known in the art to conduct at least one portion of the electrolyte fluid through one auxiliary cell provided with one insoluble auxiliary anode and at least one auxiliary cathode, a current being conducted between them by applying a voltage. Accordingly, excess quantities of the oxidized substances of the redox system are reduced at the auxiliary cathode, the formation of ions of the metal to be deposited being reduced as a result thereof. Starting from this prior art, the present invention relates to using pieces of the metal to be deposited as an auxiliary cathode.Type: ApplicationFiled: July 8, 2002Publication date: January 2, 2003Inventors: Kai-Jens Matejat, Sven Lamprecht