Patents by Inventor Kai Jiang

Kai Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220146320
    Abstract: A method, applied to an electronic device comprising a camera and a temperature sensor, wherein the method comprises displaying a temperature measurement interface, receiving, from a user, a temperature measurement operation, measuring, in response to the temperature measurement operation and using the temperature sensor, a first temperature of a measured object, collecting, using the camera, a picture of the measured object, determining, based on the picture, a type of the measured object, matching, based on the type, a first temperature algorithm for the measured object, and determining, based on the first temperature and first algorithm, a second temperature of the measured object.
    Type: Application
    Filed: January 21, 2022
    Publication date: May 12, 2022
    Inventors: Qi Xie, Kai Qian, Liwei Huang, Hua Jiang, Landi Li, Wei Li, Jian Qin
  • Patent number: 11300876
    Abstract: Precursor solutions for radiation patternable coatings are formed with an organic solvent and monoalkyl tin trialkoxides in which the water content of the solvent is adjusted to be within 10 percent of a selected value. Generally, the water content of the solvent is adjusted through water addition, although water removal can also be used. In some embodiments, the adjusted water content of the solvent can be from about 250 ppm by weight to about 10,000 ppm by weight. With the appropriate selection of ligands, the adjusted precursor solutions can be stable for at least about 42 days, and in some cases at least 8 months.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 12, 2022
    Assignee: Inpria Corporation
    Inventors: Kai Jiang, Stephen T. Meyers, Lauren B. McQuade, Jeremy T. Anderson, Brian J. Cardineau, Benjamin L. Clark, Dominick Smiddy, Margaret Wilson-Moses
  • Publication number: 20220077769
    Abstract: The present disclosure relates to a power factor correction circuit, a control method, and an electrical appliance. The power factor correction circuit may include: a power regulation branch, including a first switching unit, a second switching unit and a branch sampling resistor connected in series sequentially; an inductive branch, connected between an AC power source and a power regulation branch; a rectifier branch, including a first rectifier unit and a second rectifier unit, the rectifier branch may include a main line sampling resistor; a capacitance branch; a control circuit sampling a branch current flowing through each of the branch sampling resistors and a main line current flowing through the main line sampling resistor respectively, and controlling the switching of each power regulation branch sequentially. With the branch sampling resistor and the main line sampling resistor, the overall cost of the power factor correction circuit may be reduced.
    Type: Application
    Filed: November 17, 2021
    Publication date: March 10, 2022
    Inventors: Li CAI, Yi LIU, Kai JIANG, Hong BIN
  • Publication number: 20220077469
    Abstract: Present invention is related to a composite modified layer attached on a current collector comprising a lithiophilic particle being covered or coated by a polymer layer. The composite modified layer further could be coated with an additional carbon layer or artificial protective film as several suitable embodiments presented in this invention. The lithiophilic particle, such as sliver nano-particle, will firstly form a lithium-silver alloys to reduce a thermodynamic instability during the growth of lithium nuclei. The sliver nano-particle is able to be attached securely on the current collector by the polymer with high adhesion ability. The fuel cell including the composite modified layer in the present invention has higher average Coulombic efficiency and higher capacity retention.
    Type: Application
    Filed: July 27, 2021
    Publication date: March 10, 2022
    Inventors: Bing-Joe Hwang, Wei-Nien Su, Shi-Kai Jiang, Chen-Jui Huang, Sheng-Chiang Yang
  • Publication number: 20220030018
    Abstract: Conventional email filtering services are not suitable for recognizing sophisticated malicious emails, and therefore may allow sophisticated malicious emails to reach inboxes by mistake. Introduced here are threat detection platforms designed to take an integrative approach to detecting security threats. For example, after receiving input indicative of an approval from an individual to access past email received by employees of an enterprise, a threat detection platform can download past emails to build a machine learning (ML) model that understands the norms of communication with internal contacts (e.g., other employees) and/or external contacts (e.g., vendors). By applying the ML model to incoming email, the threat detection platform can identify security threats in real time in a targeted manner.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 27, 2022
    Inventors: Sanjay Jeyakumar, Jeshua Alexis Bratman, Dmitry Chechik, Abhijit Bagri, Evan Reiser, Sanny Xiao Lang Liao, Yu Zhou Lee, Carlos Daniel Gasperi, Kevin Lau, Kai Jiang, Su Li Debbie Tan, Jeremy Kao, Cheng-Lin Yeh
  • Publication number: 20220028685
    Abstract: Apparatuses and methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.
    Type: Application
    Filed: October 11, 2021
    Publication date: January 27, 2022
    Inventors: Mollie Waller, Brian J. Cardineau, Kai Jiang, Alan J. Telecky, Stephen T. Meyers, Benjamin L. Clark
  • Patent number: 11187986
    Abstract: Apparatuses and methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: November 30, 2021
    Assignee: Inpria Corporation
    Inventors: Mollie Waller, Brian J. Cardineau, Kai Jiang, Alan J. Telecky, Stephen T. Meyers, Benjamin L. Clark
  • Publication number: 20210347791
    Abstract: Organotin clusters are described with the formula R3Sn3(O2CR?)5?x(OH)2+x(?3-O) with 0?x<2; R=branched or cycloalkyl with 1 to 31 carbon atoms; R??H or alkyl with 1 to 20 carbon atoms. Three carboxylato ligands are bridging, and two OH ligands are bridging. The remaining two carboxylato ligands are in non-bridging configurations, and the non-bridging carboxylato ligands are exchangeable in solution. Solutions of these clusters are suitable for forming radiation sensitive coatings that can be used to pattern nanometer scale structures. The radiation sensitive coatings are particularly suitable for EUV patterning.
    Type: Application
    Filed: July 20, 2021
    Publication date: November 11, 2021
    Inventors: Brian J. Cardineau, Stephen T. Meyers, Kai Jiang, William Earley, Jeremy T. Anderson
  • Patent number: 11098070
    Abstract: Organotin clusters are described with the formula R3Sn3(O2CR?)5-x(OH)2+x(?3-O) with 0?x<2; R=branched or cycloalkyl with 1 to 31 carbon atoms; R??H or alkyl with 1 to 20 carbon atoms. Three carboxylato ligands are bridging, and two OH ligands are bridging. The remaining two carboxylato ligands are in non-bridging configurations, and the non-bridging carboxylato ligands are exchangeable in solution. Solutions of these clusters are suitable for forming radiation sensitive coatings that can be used to pattern nanometer scale structures. The radiation sensitive coatings are particularly suitable for EUV patterning.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 24, 2021
    Assignee: Inpria Corporation
    Inventors: Brian J. Cardineau, Stephen T. Meyers, Kai Jiang, William Earley, Jeremy T Anderson
  • Publication number: 20210218373
    Abstract: Low noise amplifiers (LNAs) with low noise figure are provided. In certain embodiments, an LNA includes a single-ended LNA stage including an input for receiving a single-ended input signal from an antenna and an output for providing a single-ended amplified signal, a balun for converting the single-ended amplified signal to a differential signal, and a variable gain differential amplification stage for amplifying the differential signal from the balun. Implementing the LNA in this manner provides low noise figure, high gain, flexibility in controlling gain, and less sensitivity to ground/supply impedance.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 15, 2021
    Inventors: Sanjeev Jain, Haoran Yu, Nan Sen Lin, Gregory Edward Babcock, Kai Jiang, Hassan Sarbishaei
  • Publication number: 20210207978
    Abstract: Provided are an electronic seal label apparatus, an electric motor assembly with the electronic seal label apparatus, and an electronic seal label verification method. The electronic seal label apparatus includes: a magnet configured on a first component; and a sensing element configured on a second component and fixed opposite the magnet. When relative motion takes place between the first component and the second component, the sensing element generates a first signal according to the Wiegand effect, so that a disassembly or assembly state between the first component and the second component, which can be removed from each other, can be detected automatically.
    Type: Application
    Filed: June 28, 2018
    Publication date: July 8, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Kai JIANG, Yao SUN
  • Publication number: 20210057715
    Abstract: The disclosure provides a primary battery and an electrode assembly thereof. The electrode assembly includes a separator, a positive electrode, and a negative electrode current collector. The separator has a positive electrode side and a negative electrode side opposite to each other. The positive electrode is located at the positive electrode side of the separator, and the positive electrode includes a positive electrode current collector and a positive electrode material. The negative electrode current collector is located at the negative electrode side of the separator. The electrode assembly does not include a negative electrode material before charging or activation.
    Type: Application
    Filed: March 19, 2020
    Publication date: February 25, 2021
    Applicant: National Taiwan University of Science and Technology
    Inventors: Bing-Joe Hwang, Wei-Nien Su, Chen-Jui Huang, Shi-Kai Jiang
  • Publication number: 20210048745
    Abstract: Organometallic radiation resist compositions are described based on tin ions with alkyl ligands. Some of the compositions have branched alkyl ligands to provide for improved patterning contrast while maintaining a high degree of solution stability. Blends of compounds with distinct alkyl ligands can provide further improvement in the patterning. High resolution patterning with a half-pitch of no more than 25 nm can be achieved with a line width roughness of no more than about 4.5 nm. Synthesis techniques have been developed that allow for the formation of alkyl tin oxide hydroxide compositions with very low metal contamination.
    Type: Application
    Filed: October 30, 2020
    Publication date: February 18, 2021
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Joseph B. Edson, Kai Jiang, Douglas A. Keszler, Michael K. Kocsis, Alan J. Telecky, Brian J. Cardineau
  • Publication number: 20200371439
    Abstract: Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.
    Type: Application
    Filed: August 6, 2020
    Publication date: November 26, 2020
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Brian J. Cardineau, Joseph B. Edson, Kai Jiang, Douglas A. Keszler, Alan J. Telecky
  • Publication number: 20200326627
    Abstract: Developer compositions are described based on blends of solvents, in which the developers are particularly effective for EUV patterning using organometallic based patterning compositions. Methods for use of these developing compositions are described. The blends of solvents can be selected based on Hansen solubility parameters. Generally, one solvent has low polarity as express by the sum of ?P+?H, and a second solvent component of the developer has a higher value of ?P+?H. Corresponding solvent compositions are described.
    Type: Application
    Filed: April 10, 2020
    Publication date: October 15, 2020
    Inventors: Kai Jiang, Brian J. Cardineau, Lauren B. McQuade, Jeremy T. Anderson, Stephen T. Meyers, Michael Kocsis, Amrit K. Narasimhan
  • Patent number: 10775696
    Abstract: Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: September 15, 2020
    Assignee: Inpria Corporation
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Brian J. Cardineau, Joseph B. Edson, Kai Jiang, Douglas A. Keszler, Alan J. Telecky
  • Publication number: 20200257196
    Abstract: Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Brian J. Cardineau, Joseph B. Edson, Kai Jiang, Douglas A. Keszler, Alan J. Telecky
  • Patent number: 10732505
    Abstract: Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: August 4, 2020
    Assignee: Inpria Corporation
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Brian J. Cardineau, Joseph B. Edson, Kai Jiang, Douglas A. Keszler, Alan J. Telecky
  • Publication number: 20200209756
    Abstract: Apparatuses and methods are described for removing edge bead on a wafer associated with a resist coating comprising a metal containing resist compositions. The methods can comprise applying a first bead edge rinse solution along a wafer edge following spin coating of the wafer with the metal based resist composition, wherein the edge bead solution comprises an organic solvent and an additive comprising a carboxylic acid, an inorganic fluorinated acid, a tetraalkylammonium compound, or a mixture thereof. Alternatively or additionally, the methods can comprise applying a protective composition to the wafer prior to performing an edge bead rinse. The protective composition can be a sacrificial material or an anti-adhesion material and can be applied only to the wafer edge or across the entire wafer in the case of the protective composition. Corresponding apparatuses for processing the wafers using these methods are presented.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 2, 2020
    Inventors: Mollie Waller, Brian J. Cardineau, Kai Jiang, Alan J. Telecky, Stephen T. Meyers, Benjamin L. Clark
  • Patent number: 10642153
    Abstract: Organometallic radiation resist compositions are described based on tin ions with alkyl ligands. Some of the compositions have branched alkyl ligands to provide for improved patterning contrast while maintaining a high degree of solution stability. Blends of compounds with distinct alkyl ligands can provide further improvement in the patterning. High resolution patterning with a half-pitch of no more than 25 nm can be achieved with a line width roughness of no more than about 4.5 nm. Synthesis techniques have been developed that allow for the formation of alkyl tin oxide hydroxide compositions with very low metal contamination.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: May 5, 2020
    Assignee: Inpria Corporation
    Inventors: Stephen T. Meyers, Jeremy T. Anderson, Joseph Burton Edson, Kai Jiang, Douglas A. Keszler, Michael K. Kocsis, Alan J. Telecky, Brian J. Cardineau