Patents by Inventor KAI-JUN LIANG
KAI-JUN LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260196709Abstract: A label antenna structure suitable for the curved surfaces of liquid containers, comprising a deformed loop surrounding a first slit. The deformed loop includes a loop gap, a first electrical connection terminal, and a second electrical connection terminal, with the first electrical connection terminal and the second electrical connection terminal being separated by the loop gap. The structure also includes a single-arm radiating plate, with one end of the arm of the single-arm radiating plate being connected to the deformed loop; a second slit, which separates the unconnected portion between the deformed loop and the single-arm radiating plate, with one end of the second slit having an open circuit structure; and an RFID chip electrically connected between the first electrical connection terminal and the second electrical connection terminal.Type: ApplicationFiled: April 24, 2025Publication date: July 9, 2026Applicant: Securitag Assembly Group Co., Ltd.Inventor: Kai-Jun LIANG
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Patent number: 11995495Abstract: The present invention provides a RFID device arranged on an object surface, comprising a substrate, a first metal layer and a second metal layer. The first metal layer has a first connecting surface having a first adhering layer for adhering to the first surface of the substrate, wherein a RFID element is electrically connected to the first metal layer and a length of the first metal layer is larger than a length of the substrate such that the first metal layer has a first extending part extending outwardly from the lateral surface of the substrate. The second metal layer has a second connecting surface having a second adhering layer formed thereon for adhering the second metal layer on the second surface, wherein the first extending metal layer is attached onto but electrically insulated from the object surface or the second metal layer.Type: GrantFiled: February 28, 2023Date of Patent: May 28, 2024Assignee: Securitag Assembly Group Co., Ltd.Inventor: Kai-Jun Liang
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Publication number: 20230394274Abstract: The present invention provides a RFID device arranged on an object surface, comprising a substrate, a first metal layer and a second metal layer. The first metal layer has a first connecting surface having a first adhering layer for adhering to the first surface of the substrate, wherein a RFID element is electrically connected to the first metal layer and a length of the first metal layer is larger than a length of the substrate such that the first metal layer has a first extending part extending outwardly from the lateral surface of the substrate. The second metal layer has a second connecting surface having a second adhering layer formed thereon for adhering the second metal layer on the second surface, wherein the first extending metal layer is attached onto but electrically insulated from the object surface or the second metal layer.Type: ApplicationFiled: February 28, 2023Publication date: December 7, 2023Applicant: Securitag Assembly Group Co., Ltd.Inventor: KAI-JUN LIANG
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Patent number: 11621490Abstract: The present invention provides an antenna structure for metal environment. The antenna structure comprises a radiating conductor, a first ground conductor, and a second ground conductor. The radiating conductor comprises a first opening circuit, and a second opening circuit, in which the first opening circuit is opened at a first side of the radiating conductor, and the second opening circuit is opened at a second side of the radiating conductor. The first ground conductor is electrically coupled to a third side of the radiating conductor while the second ground conductor is electrically coupled to a fourth side of the radiating conductor. Alternatively, the present invention further provides an antenna device by folding the antenna structure having RFID chip electrically attached thereon to cover a substrate, whereby the antenna device could be accessed in a metal environment.Type: GrantFiled: June 9, 2021Date of Patent: April 4, 2023Assignee: Securitag Assembly Group Co., Ltd.Inventor: Kai-Jun Liang
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Patent number: 11501129Abstract: An antenna structure comprises an impedance matching part, a first conductive structure and a second conductive structure. The first conductive structure with a first length along a first direction is coupled to a first side of the impedance matching part and has a plurality of first polygon conductive structures, each of which is coupled to each other through a first conductive element. The second conductive structure with a second length along a first direction is coupled to a second side of the impedance matching part and has a plurality of second polygon conductive structures, each of which is coupled to each other through a second conductive element, wherein the second length is larger than the first length. The first and second polygon conductive structures are protrusion toward the second direction. In one embodiment, the antenna structure can be applied on an object having metal housing or liquid contained therein.Type: GrantFiled: October 8, 2019Date of Patent: November 15, 2022Assignee: Securitag Assembly Group Co., LtdInventor: Kai-Jun Liang
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Publication number: 20220069435Abstract: The present invention provides an antenna structure for metal environment. The antenna structure comprises a radiating conductor, a first ground conductor, and a second ground conductor. The radiating conductor comprises a first opening circuit, and a second opening circuit, in which the first opening circuit is opened at a first side of the radiating conductor, and the second opening circuit is opened at a second side of the radiating conductor. The first ground conductor is electrically coupled to a third side of the radiating conductor while the second ground conductor is electrically coupled to a fourth side of the radiating conductor. Alternatively, the present invention further provides an antenna device by folding the antenna structure having RFID chip electrically attached thereon to cover a substrate, whereby the antenna device could be accessed in a metal environment.Type: ApplicationFiled: June 9, 2021Publication date: March 3, 2022Applicant: Securitag Assembly Group Co., Ltd.Inventor: Kai-Jun LIANG
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Publication number: 20200151536Abstract: An antenna structure comprises an impedance matching part, a first conductive structure and a second conductive structure. The first conductive structure with a first length along a first direction is coupled to a first side of the impedance matching part and has a plurality of first polygon conductive structures, each of which is coupled to each other through a first conductive element. The second conductive structure with a second length along a first direction is coupled to a second side of the impedance matching part and has a plurality of second polygon conductive structures, each of which is coupled to each other through a second conductive element, wherein the second length is larger than the first length. The first and second polygon conductive structures are protrusion toward the second direction. In one embodiment, the antenna structure can be applied on an object having metal housing or liquid contained therein.Type: ApplicationFiled: October 8, 2019Publication date: May 14, 2020Applicant: Securitag Assembly Group Co., LtdInventor: KAI-JUN LIANG