Patents by Inventor KAI-JUN LIANG

KAI-JUN LIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995495
    Abstract: The present invention provides a RFID device arranged on an object surface, comprising a substrate, a first metal layer and a second metal layer. The first metal layer has a first connecting surface having a first adhering layer for adhering to the first surface of the substrate, wherein a RFID element is electrically connected to the first metal layer and a length of the first metal layer is larger than a length of the substrate such that the first metal layer has a first extending part extending outwardly from the lateral surface of the substrate. The second metal layer has a second connecting surface having a second adhering layer formed thereon for adhering the second metal layer on the second surface, wherein the first extending metal layer is attached onto but electrically insulated from the object surface or the second metal layer.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: May 28, 2024
    Assignee: Securitag Assembly Group Co., Ltd.
    Inventor: Kai-Jun Liang
  • Publication number: 20230394274
    Abstract: The present invention provides a RFID device arranged on an object surface, comprising a substrate, a first metal layer and a second metal layer. The first metal layer has a first connecting surface having a first adhering layer for adhering to the first surface of the substrate, wherein a RFID element is electrically connected to the first metal layer and a length of the first metal layer is larger than a length of the substrate such that the first metal layer has a first extending part extending outwardly from the lateral surface of the substrate. The second metal layer has a second connecting surface having a second adhering layer formed thereon for adhering the second metal layer on the second surface, wherein the first extending metal layer is attached onto but electrically insulated from the object surface or the second metal layer.
    Type: Application
    Filed: February 28, 2023
    Publication date: December 7, 2023
    Applicant: Securitag Assembly Group Co., Ltd.
    Inventor: KAI-JUN LIANG
  • Patent number: 11621490
    Abstract: The present invention provides an antenna structure for metal environment. The antenna structure comprises a radiating conductor, a first ground conductor, and a second ground conductor. The radiating conductor comprises a first opening circuit, and a second opening circuit, in which the first opening circuit is opened at a first side of the radiating conductor, and the second opening circuit is opened at a second side of the radiating conductor. The first ground conductor is electrically coupled to a third side of the radiating conductor while the second ground conductor is electrically coupled to a fourth side of the radiating conductor. Alternatively, the present invention further provides an antenna device by folding the antenna structure having RFID chip electrically attached thereon to cover a substrate, whereby the antenna device could be accessed in a metal environment.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: April 4, 2023
    Assignee: Securitag Assembly Group Co., Ltd.
    Inventor: Kai-Jun Liang
  • Patent number: 11501129
    Abstract: An antenna structure comprises an impedance matching part, a first conductive structure and a second conductive structure. The first conductive structure with a first length along a first direction is coupled to a first side of the impedance matching part and has a plurality of first polygon conductive structures, each of which is coupled to each other through a first conductive element. The second conductive structure with a second length along a first direction is coupled to a second side of the impedance matching part and has a plurality of second polygon conductive structures, each of which is coupled to each other through a second conductive element, wherein the second length is larger than the first length. The first and second polygon conductive structures are protrusion toward the second direction. In one embodiment, the antenna structure can be applied on an object having metal housing or liquid contained therein.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: November 15, 2022
    Assignee: Securitag Assembly Group Co., Ltd
    Inventor: Kai-Jun Liang
  • Publication number: 20220069435
    Abstract: The present invention provides an antenna structure for metal environment. The antenna structure comprises a radiating conductor, a first ground conductor, and a second ground conductor. The radiating conductor comprises a first opening circuit, and a second opening circuit, in which the first opening circuit is opened at a first side of the radiating conductor, and the second opening circuit is opened at a second side of the radiating conductor. The first ground conductor is electrically coupled to a third side of the radiating conductor while the second ground conductor is electrically coupled to a fourth side of the radiating conductor. Alternatively, the present invention further provides an antenna device by folding the antenna structure having RFID chip electrically attached thereon to cover a substrate, whereby the antenna device could be accessed in a metal environment.
    Type: Application
    Filed: June 9, 2021
    Publication date: March 3, 2022
    Applicant: Securitag Assembly Group Co., Ltd.
    Inventor: Kai-Jun LIANG
  • Publication number: 20200151536
    Abstract: An antenna structure comprises an impedance matching part, a first conductive structure and a second conductive structure. The first conductive structure with a first length along a first direction is coupled to a first side of the impedance matching part and has a plurality of first polygon conductive structures, each of which is coupled to each other through a first conductive element. The second conductive structure with a second length along a first direction is coupled to a second side of the impedance matching part and has a plurality of second polygon conductive structures, each of which is coupled to each other through a second conductive element, wherein the second length is larger than the first length. The first and second polygon conductive structures are protrusion toward the second direction. In one embodiment, the antenna structure can be applied on an object having metal housing or liquid contained therein.
    Type: Application
    Filed: October 8, 2019
    Publication date: May 14, 2020
    Applicant: Securitag Assembly Group Co., Ltd
    Inventor: KAI-JUN LIANG