Patents by Inventor Kai Jung

Kai Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990440
    Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and an interconnection structure over the semiconductor substrate. The semiconductor device structure also includes a first conductive pillar over the interconnection structure. The first conductive pillar has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive pillar. The semiconductor device structure further includes a second conductive pillar over the interconnection structure. The second conductive pillar has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive pillar. The first conductive pillar is closer to a center point of the semiconductor substrate than the second conductive pillar. A bottom of the second protruding portion is wider than a bottom of the first protruding portion.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai-Jun Zhan, Yung-Sheng Lin
  • Publication number: 20240128219
    Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
  • Patent number: 11961817
    Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
  • Patent number: 11955484
    Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
  • Patent number: 11951571
    Abstract: A method of forming a package structure includes an etching step, a laser step, a plating step and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. In the laser step, a plastic package material covering on each of the cutting streets is removed via a laser beam. In the plating step, a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material. In the singulation step, the cutting streets of the leadframe are cut to form the package structure.
    Type: Grant
    Filed: February 2, 2023
    Date of Patent: April 9, 2024
    Assignee: INTEGRATED SILICON SOLUTION INC.
    Inventors: Cheng-Fu Yu, Kai-Jih Shih, Yi-Jung Liu
  • Patent number: 11937932
    Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: March 26, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
  • Publication number: 20240096857
    Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 21, 2024
    Applicant: Innolux Corporation
    Inventors: Jian-Jung Shih, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng
  • Publication number: 20240070824
    Abstract: The present disclosure discloses an image processing circuit having output timing adjustment mechanism. An image enhancement circuit performs image enhancement on an input image to generate an enhanced image. A first image processing path and a second image processing path respectively perform processing on the enhanced image having a first timing and the enhanced image having a second timing to generate a first output image and a second output image. A timing control circuit adjusts the timing of the enhanced image according to requirements of the first image processing path and the second image processing path to generate the enhanced image having the first timing and the enhanced image having the second timing. A first image output interface outputs the first output image. A second image output interface outputs the second output image.
    Type: Application
    Filed: July 20, 2023
    Publication date: February 29, 2024
    Inventors: TZU-MIN YEH, KAI-CHO CHANG, PO-HSIEN WU, HSU-JUNG TUNG
  • Patent number: 11791678
    Abstract: A motor and a rotor structure thereof are disclosed. The rotor structure includes a rotor core. The rotor core has a plurality of magnetic member units arranged around a periphery of the rotor core. Each magnetic member unit includes two first magnetic members and a second magnetic member. The two first magnetic members are obliquely arranged in a V shape relative to a center of the rotor core. The second magnetic member extends transversely between the two first magnetic members. Each first magnetic member has at least two permanent magnets that are arranged obliquely. The motor further includes a stator core covering the rotor core. The stator core has a plurality of stator windings arranged annularly. The stator windings correspond to the magnetic member units. The rotor structure has high structural strength, and the phenomenon of stress concentration is less obvious when the motor is running.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: October 17, 2023
    Assignee: National Cheng Kung University
    Inventors: Min-Fu Hsieh, Mi-Ching Tsai, Kai-Jung Shih, Lucio Jose Fernando Caceres Vera, Guan-Ming Chen
  • Publication number: 20230248545
    Abstract: A below-elbow prosthetic arm assembly includes a hand; an arm connected to the hand; a cylinder connected to the arm; and a string connected to the rear end of the cylinder. To start using the prosthetic arm, the user's amputated upper limb is enclosed by the cylinder and tied thereto with a string. The below-elbow prosthetic arm assembly further includes an expansion kit adapted to meet the user's needs in daily lives, learning and sports. The expansion kit is directly fitted to the hand. Function expansion is achieved without removing the hand. Therefore, the below-elbow prosthetic arm exhibits enhanced ease of use and minimizes the user's financial burdens which might otherwise arise from ordering customized prosthetic arms for use in different activities.
    Type: Application
    Filed: August 22, 2022
    Publication date: August 10, 2023
    Inventors: YANG-KUN OU, CHIA-HSUAN LIAO, HSUAN-YEN LEE, KAI-JUNG PENG, FENG-JIA ZHENG, WEI MING KOK, YU-KUAN MO
  • Patent number: 11695310
    Abstract: A motor, a cooling device, and a cooling method are disclosed. The cooling device is mounted on a stator of the motor. The cooling device includes a sleeve and a spiral duct. A wall of the sleeve has a spiral groove extending along the sleeve. The sleeve is sleeved onto the stator. The spiral duct is mounted in the spiral groove. The spiral duct has a first spiral form corresponding to the spiral groove, so that the spiral duct is correspondingly installed in the spiral groove. The spiral duct has a second spiral form extending along the spiral duct. A twisted spiral cooling channel is formed along the spiral pathway. A cooling fluid flowing through the twisted spiral cooling channel is subjected to the continuously changing cross-section of the twisted spiral cooling channel to enhance the swirl intensity, thereby improving the convection heat transfer effectiveness.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 4, 2023
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Shyy-Woei Chang, Min-Fu Hsieh, Kai-Jung Shih, Wei-Ling Cai, Jen-Hsiang Liu
  • Patent number: 11677303
    Abstract: A motor and a coreless stator coil winding unit thereof are disclosed. The coreless stator coil winding unit includes an overlapping coil winding assembly and a non-overlapping coil winding assembly. The overlapping coil winding assembly includes a plurality of first coils arranged annularly and a plurality of second coils arranged annularly. The first coils and the second coils overlap with a phase difference. The non-overlapping coil winding assembly includes a plurality of third coils arranged annularly. The third coils are each located between an adjacent one of the first coils and an adjacent one of the second coils. Thus, the back electromotive force constant and torque constant of the motor have a better performance.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: June 13, 2023
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Min-Fu Hsieh, Kai-Jung Shih, Po-Wei Huang, Lucio Jose Fernando Caceres Vera, Shang-Hui Shen, Jung-Kun Chiu, Hsin-Yu Chiu
  • Publication number: 20230130551
    Abstract: A motor and a coreless stator coil winding unit thereof are disclosed. The coreless stator coil winding unit includes an overlapping coil winding assembly and a non-overlapping coil winding assembly. The overlapping coil winding assembly includes a plurality of first coils arranged annularly and a plurality of second coils arranged annularly. The first coils and the second coils overlap with a phase difference. The non-overlapping coil winding assembly includes a plurality of third coils arranged annularly. The third coils are each located between an adjacent one of the first coils and an adjacent one of the second coils. Thus, the back electromotive force constant and torque constant of the motor have a better performance.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 27, 2023
    Inventors: MI-CHING TSAI, MIN-FU HSIEH, KAI-JUNG SHIH, PO-WEI HUANG, LUCIO JOSE FERNANDO CACERES VERA, SHANG-HUI SHEN, JUNG-KUN CHIU, HSIN-YU CHIU
  • Patent number: 11581778
    Abstract: A motor and a rotating shaft cooling device thereof are disclosed. A rotating shaft of the motor is formed with an annular space. A shaft has a front end and a rear end. The shaft is a blind tube formed with a channel communicating with the annular space through a plurality of nozzles. The distance between the nozzles and the rear end is less than one-half of the length of the shaft. A cooling fluid flows through the nozzles to form a jet array to impinge on the inner wall of the rotating shaft to cool the rotating shaft, and flows back in the annular space to enhance the cooling effect, increase the heat exchange area, and improve the cooling effectiveness of the rotating shaft.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: February 14, 2023
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Shyy-Woei Chang, Min-Fu Hsieh, Kai-Jung Shih, Wei-Ling Cai, Bi-Sheng Wei
  • Patent number: 11575286
    Abstract: A motor and a spoke-type rotor structure thereof are disclosed. The rotor structure comprises a rotor core which has a plurality of spoke-type first magnetic members. Two oblique second magnetic members arranged in a V shape are provided between every adjacent two of the first magnetic members. A radius of the rotor core is R. A length of the first magnetic member is ls. A length of the second magnetic member is lv. A length component of the second magnetic member on the radius of the rotor core is x. An included angle between the first magnetic member and the second magnetic member is ?. An included angle between every adjacent two of the first magnetic members is ?. The parameters satisfy: ls+x<R, wherein x=lv·cos(180°??); 90°+?/2<?<180°.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: February 7, 2023
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Min-Fu Hsieh, Kai-Jung Shih, Lucio Jose Fernando Caceres Vera
  • Patent number: 11469703
    Abstract: A circuit system and a circuit control method applied to a motor drive are disclosed. The circuit control method includes the steps of providing a phase-locked circuit unit and providing a PWM control unit. The phase-locked circuit unit enables a first carrier signal and a second carrier signal to have identical amplitudes and starting points. The PWM control unit compares the first carrier signal with a reference signal for controlling a switch. When a load current is independently supplied by at least one DC capacitor, a SVPWM control unit controls an inverter unit for the load current to be zero, thereby reducing DC voltage ripple, operation loss and transient voltage surge.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: October 11, 2022
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Fu-Sheng Pai, Min-Fu Hsieh, Kai-Jung Shih, Zheng-Xuan Wu
  • Publication number: 20220271581
    Abstract: A motor and a rotor structure thereof are disclosed. The rotor structure includes a rotor core. The rotor core has a plurality of magnetic member units arranged around a periphery of the rotor core. Each magnetic member unit includes two first magnetic members and a second magnetic member. The two first magnetic members are obliquely arranged in a V shape relative to a center of the rotor core. The second magnetic member extends transversely between the two first magnetic members. Each first magnetic member has at least two permanent magnets that are arranged obliquely. The motor further includes a stator core covering the rotor core. The stator core has a plurality of stator windings arranged annularly. The stator windings correspond to the magnetic member units. The rotor structure has high structural strength, and the phenomenon of stress concentration is less obvious when the motor is running.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Inventors: MIN-FU HSIEH, MI-CHING TSAI, KAI-JUNG SHIH, LUCIO JOSE FERNANDO CACERES VERA, GUAN-MING CHEN
  • Publication number: 20220224188
    Abstract: A motor and a rotating shaft cooling device thereof are disclosed. A rotating shaft of the motor is formed with an annular space. A shaft has a front end and a rear end. The shaft is a blind tube formed with a channel communicating with the annular space through a plurality of nozzles. The distance between the nozzles and the rear end is less than one-half of the length of the shaft. A cooling fluid flows through the nozzles to form a jet array to impinge on the inner wall of the rotating shaft to cool the rotating shaft, and flows back in the annular space to enhance the cooling effect, increase the heat exchange area, and improve the cooling effectiveness of the rotating shaft.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 14, 2022
    Inventors: MI-CHING TSAI, SHYY-WOEI CHANG, MIN-FU HSIEH, KAI-JUNG SHIH, WEI-LING CAI, BI-SHENG WEI
  • Patent number: D1024051
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Hui-Jung Huang, Hong-Kuan Li, I-Lun Li, Ling-Mei Kuo, Kuan-Ju Chen, Fang-Ying Huang, Kai-Hung Huang, Szu-Wei Yang, Kai-Teng Cheng
  • Patent number: D1027976
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: May 21, 2024
    Assignee: VIVOTEK INC.
    Inventors: Kuan-Hung Chen, Kai-Sheng Chuang, Chia-Chi Chang, Yu-Fang Huang, Kai-Ting Yu, Wen-Chun Chen, Shu-Jung Hsu, Tsao-Wei Hung