Patents by Inventor Kai L. Tong

Kai L. Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate to substrate standoff assembly
    Patent number: 5345366
    Abstract: A substrate to substrate interconnect and standoff assembly (10) comprises an electronic coupling (39) between the bottom of a first substrate (14) and the bottom of a second substrate (12), an electronic coupling (24) of the top of the first substrate to the bottom of the second substrate, a stand-off (20) between the first substrate and the second substrate, and a mechanical coupling (16) between the first substrate to the second substrate.
    Type: Grant
    Filed: May 21, 1993
    Date of Patent: September 6, 1994
    Assignee: Motorola, Inc.
    Inventors: Chee F. Cheng, Chiou C. You, Kai L. Tong