Abstract: The present application provides an organic light emitting diode (OLED) display panel and a method of manufacturing the same, and a display terminal. The OLED display panel includes an array substrate, a protective layer and a cathode. The array substrate includes a first auxiliary electrode, a second auxiliary electrode, and a third auxiliary electrode. The third auxiliary electrode is connected to the first auxiliary electrode and the second auxiliary electrode. The protective layer is provided with an undercut opening exposing a portion of the third auxiliary electrode. The cathode extends into the undercut opening and is connected to the third auxiliary electrode.

Abstract: A power device includes a mainboard and a power conversion module. The mainboard includes a first side and a third side opposite each other along a first direction, a second side and a fourth side opposite each other along a second direction, the first direction is perpendicular to the second direction. The power conversion module includes a primary-side circuit board and a secondary-side module. The secondary-side module includes a secondary-side circuit board, and the primary-side circuit board, the mainboard and the secondary-side circuit board being electrically connected, the primary-side circuit board and the secondary-side circuit board are spatially separated. The secondary-side module further includes secondary-side element and a first magnetic core element, wherein the secondary-side element and the first magnetic core element are disposed on the secondary-side circuit board along a third direction perpendicular to the first direction and the second direction.

Abstract: A touch sensing apparatus includes a panel with touch detection function and a touch detection circuitry. The touch detection circuitry is coupled to the panel, and is configured to detect a touch operation on the panel, record an error event of the touch sensing apparatus, and write the error event into an external storage medium via a data transmission interface thereof.

Abstract: A resetting system includes a driver that controls a touchscreen, the driver including a driver communication interface that defines a bus for transferring a transfer signal; and an on-screen display (OSD) device that generates an OSD signal representing a predetermined reset image in response to a predetermined event, the OSD signal superimposing over pixels and graphics data to be rendered on the touchscreen; and a host that transfers the transfer signal to or from the driver, the host including a host communication interface that defines the bus for transferring the transfer signal to or from the driver.

Abstract: Conventional email filtering services are not suitable for recognizing sophisticated malicious emails, and therefore may allow sophisticated malicious emails to reach inboxes by mistake. Introduced here are threat detection platforms designed to take an integrative approach to detecting security threats. For example, after receiving input indicative of an approval from an individual to access past email received by employees of an enterprise, a threat detection platform can download past emails to build a machine learning (ML) model that understands the norms of communication with internal contacts (e.g., other employees) and/or external contacts (e.g., vendors). By applying the ML model to incoming email, the threat detection platform can identify security threats in real time in a targeted manner.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: Pole mounts, pole mount kits, and poly mount assemblies are disclosed. Each kit and assembly includes a pole mount with a mounting bracket including a pair of coupling plates and at least one retaining plate. The pair of coupling plates is coupled to opposite ends of the at least one retaining plate. The at least one retaining plate defines a mounting area between the pair of coupling plates. The pole mount further includes at least two retaining brackets coupled to the at least one retaining plate. Each of the retaining brackets includes a base, opposing side walls extending from the base, and a front wall extending from the base and located between the opposing side walls. The base, the opposing side walls, and the front wall define a retaining area. The front wall defines a cutout region contiguous with the retaining area.

Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.

Abstract: Provided are a vibration object monitoring method and apparatus, a computer device, and a storage medium. The method includes: in response to detecting that a vibration object exists in a monitoring video picture for a target monitoring region, a vibration object region in the monitoring video picture is determined, where the vibration object region is a region where the vibration object is located in the monitoring video picture; displacement information of a key point of the vibration object in the vibration object region is recorded; vibration information of the vibration object in the monitoring video picture is determined based on the displacement information; and a vibration object monitoring result for the target monitoring region is generated according to the vibration information. The abnormal vibration monitoring can be performed on the vibration object in the target monitoring region in time according to this method.

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

Abstract: Improved inner spacers for semiconductor devices and methods of forming the same are disclosed.

Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.

Abstract: A method of processing video data. The method includes applying different super resolution (SR) processes to different sub-regions of a video unit, and performing a conversion between a video including the different regions of the video unit and a bitstream of the video based on the different SR processes as applied. A corresponding video coding apparatus and non-transitory computer-readable recording medium are also disclosed.

Abstract: A method of processing video data. The method includes using coded information during application of a super resolution (SR) process to a video unit; and performing a conversion between a video including the video unit and a bitstream of the video based on the SR process as applied using the coded information. A corresponding video coding apparatus and non-transitory computer-readable recording medium are also disclosed.

Abstract: A method of processing video data. The method includes applying a super resolution (SR) process to a video unit at a level of an SR unit, where the SR unit includes more than one pixel of the video unit, and performing a conversion between a video comprising the video unit and a bitstream of the video based on the SR process as applied. A corresponding video coding apparatus and non-transitory computer-readable recording medium are also disclosed.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: A method of processing video data. The method includes down-sampling a video unit of a video prior to application of a super resolution (SR) process and performing a conversion between the video including the video unit and a bitstream of the video based on the video unit as down-sampled. A corresponding video coding apparatus and non-transitory computer-readable recording medium are also disclosed.

Abstract: A method of processing video data. The method includes applying a super resolution (SR) process to a video unit at a specific position relative to one or more in-loop filters when the one or more in-loop filters are applied to the video unit, and performing a conversion between a video comprising the video unit and a bitstream of the video based on the SR process and the one or more in-loop filters as applied. A corresponding video coding apparatus and non-transitory computer-readable recording medium are also disclosed.

Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.