Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A mini-optical line termination (OLT) includes at least one management card for providing control and management functions. A plurality of network cards having a predetermined number of ports are configured to support a predetermined number of subscribers by providing a gigabit passive optical network to the subscribers. At least one network device is coupled to an upstream device and the plurality of network cards. The at least one network device is configured to control the forwarding of data between the upstream device and the subscribers.

Abstract: A mini-optical line termination (OLT) includes at least one management card for providing control and management functions. A plurality of network cards having a predetermined number of ports are configured to support a predetermined number of subscribers by providing a gigabit passive optical network to the subscribers. At least one network device is coupled to an upstream device and the plurality of network cards. The at least one network device is configured to control the forwarding of data between the upstream device and the subscribers.

Abstract: A mini-optical line termination (OLT) includes at least one management card for providing control and management functions. A plurality of network cards having a predetermined number of ports are configured to support a predetermined number of subscribers by providing a gigabit passive optical network to the subscribers. At least one network device is coupled to an upstream device and the plurality of network cards. The at least one network device is configured to control the forwarding of data between the upstream device and the subscribers.

Abstract: A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element.

Abstract: A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element.

Abstract: A mini-optical line termination (OLT) includes at least one management card for providing control and management functions. A plurality of network cards having a predetermined number of ports are configured to support a predetermined number of subscribers by providing a gigabit passive optical network to the subscribers. At least one network device is coupled to an upstream device and the plurality of network cards. The at least one network device is configured to control the forwarding of data between the upstream device and the subscribers.