Abstract: A meniscus tear assisted determination system includes an image capturing device and a processor. The image capturing device is for capturing a target protocol of a subject, and the target protocol includes a plurality of target knee joint image sequences. The processor is signally connected to the image capturing device and includes a data preprocessing module and a meniscus tear assisted determination program. The data preprocessing module is for grouping the plurality of target knee joint image sequences and extracting a plurality of target coronal plane image sequences and a plurality of target sagittal plane image sequences. The meniscus tear assisted determination program includes a meniscus location detector and a meniscus tear predictor.

Abstract: A projection device including a casing, a light source module, an optical engine module and a projection lens is provided. A front cover, a rear cover, a first side cover, a second side cover, an upper cover and a lower cover of the casing surround an accommodating space. The light source module includes a first and a second light sources, and a first and a second light source heat dissipation modules. The lower cover has a first, a second and a third air inlets. The first and the second side covers respectively have a first and a second air outlets. The first and the second light source heat dissipation modules are correspondingly disposed above the first air inlet and correspond to the first air outlet. The second and the third air inlets are respectively disposed below two sides of the projection lens and adjacent to the front cover.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: An order management system and method for automated logistics based on-demand box supplying is disclosed. The system pre-estimates a dimension required by all of the merchandise according to an order data, and selects a sheet material according to the size to form a finished container. The dimension of the unfolded sheet material before folding into the finished container is quite small. In terms of warehouse space utilization, a space required by a single finished and folded box is able to stack dozens of sheet materials, so that the warehousing efficiency is greatly improved. By integrating with a box folding module and a sealing module, fully automated logistics can be achieved with human intervention.

Abstract: A method for promoting an electric output of a piezoelectric/conductive hybrid polymer is provided. The method includes forming a piezoelectric/conductive hybrid polymer by mixing poly(vinylidene fluoride-trifluoroethylene) (PVDF-TrFE) and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) so as to increase an output current and an output power of the piezoelectric/conductive hybrid polymer; and changing a surface structure of the piezoelectric/conductive hybrid polymer by a nano-imprint process for promoting a piezoelectricity of the piezoelectric/conductive hybrid polymer. As a result, an output voltage, the output current and the output power of the piezoelectric/conductive hybrid polymer are increased.

Abstract: A method for promoting an electric output of a piezoelectric/conductive hybrid polymer is provided. The method includes forming a piezoelectric/conductive hybrid polymer by mixing poly(vinylidene fluoride-trifluoroethylene) (PVDF-TrFE) and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) so as to increase an output current and an output power of the piezoelectric/conductive hybrid polymer; and changing a surface structure of the piezoelectric/conductive hybrid polymer by a nano-imprint process for promoting a piezoelectricity of the piezoelectric/conductive hybrid polymer. As a result, an output voltage, the output current and the output power of the piezoelectric/conductive hybrid polymer are increased.

Abstract: A method of fabricating a piezoelectric/conductive hybrid polymer thin film is provided, which is promoting an electric output of a piezoelectric polymer and includes: a mixing step including: forming a piezoelectric solution by dissolving a PVDF-TrFE in an active solvent; forming a conductive solution by dissolving a PEDOT:PSS in a water; and forming a piezoelectric/conductive hybrid polymer solution by mixing the piezoelectric solution and the conductive solution; a filming step, wherein the piezoelectric/conductive hybrid polymer solution is heated, thus the piezoelectric/conductive hybrid polymer thin film is formed; and an anneal step, wherein the piezoelectric/conductive hybrid polymer thin film is recrystallized and a nano-sized protruding structure is formed on a surface of the piezoelectric/conductive hybrid polymer thin film.

Abstract: A brushless motor may be applied to an aircraft or a drone and have a stable structure with long life. The efficiency of the brushless motor can reach 94-98% to solve the problems of power consumption during flight and to save energy. Also, the brushless motor has a light-weight body which allows the aircraft to carry more freight.

Abstract: A method of fabricating a piezoelectric/conductive hybrid polymer thin film is provided, which is promoting an electric output of a piezoelectric polymer and includes: a mixing step including: forming a piezoelectric solution by dissolving a PVDF-TrFE in an active solvent; forming a conductive solution by dissolving a PEDOT:PSS in a water; and forming a piezoelectric/conductive hybrid polymer solution by mixing the piezoelectric solution and the conductive solution; a filming step, wherein the piezoelectric/conductive hybrid polymer solution is heated, thus the piezoelectric/conductive hybrid polymer thin film is formed; and an anneal step, wherein the piezoelectric/conductive hybrid polymer thin film is recrystallized and a nano-sized protruding structure is formed on a surface of the piezoelectric/conductive hybrid polymer thin film.