Abstract: A lead frame assembly includes a first lead frame panel having a die receiving area for receiving a semiconductor die, the die having an upper surface having one or more die bond pads located thereon. A second lead frame panel includes integral leads, each integral lead including a terminal, a connecting element extending from the terminal, and a shaped contact located at an end of the connecting element. The second lead frame panel is adapted to be stacked on the first lead frame panel to position each terminal laterally of a respective die receiving area. The positioning of the terminals locates each shaped contact for contact with a respective die bond pad to establish an electrical connection between the die bond pad and the respective terminal when the semiconductor die is mounted on the respective die receiving area.