Patents by Inventor Kai-Ming Chin

Kai-Ming Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluxless bumping process using ions
    Patent number: 6805279
    Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: October 19, 2004
    Assignee: Taiwan SEmiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Yeng-Ming Chen, Kai-Ming Chin, Li-Chi Chen, Hao-Chih Tien