Patents by Inventor Kai Ning

Kai Ning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170031102
    Abstract: An optical component optically coupled to an optical fiber includes a substrate and an edge-emitting laser. The substrate includes an accommodating cavity, a plurality of openings, a waveguide, an optical coupler and a plurality of pads. The waveguide and the optical coupler are distributed outside the accommodating cavity. The openings are distributed at the bottom surface of the accommodating cavity and the pads are located at the bottom of the openings. The optical coupler is optically coupled to an end of the waveguide and includes a light-incident surface. The edge-emitting laser is embedded in the accommodating cavity and includes a light-emitting layer and a plurality of bumps located in the openings and electrically connected to the pads. The ratio of the level height difference between the light-emitting layer and the optical coupler to the thickness of the optical coupler ranges from 0 to 0.5.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Kai-Ning Ku, Chih-Lin Wang, Shang-Chun Chen
  • Patent number: 8447152
    Abstract: The present invention relates to a waveguide coupling device with properties of forward coupling and backward coupling as well as a manufacturing method thereof, the waveguide coupling device comprises: a substrate, at least one inverted taper coupling structure, an intermediate layer, and at least one three-dimensional taper coupling structure. Wherein one end of the three-dimensional taper coupling structure is adopted for connecting to an external optical fiber, so as to couple the optical wave propagating in the optical fiber; Moreover, by way of the specific coupling sequence of (three-dimensional taper coupling structure)-(intermediate layer)-(inverted taper coupling structure), the optical wave may be efficiently coupled into, be confined in, and ultimately propagates in the inverted taper coupling structure connecting to waveguide devices.
    Type: Grant
    Filed: August 10, 2011
    Date of Patent: May 21, 2013
    Assignee: National Tsing Hua University
    Inventors: Ming-Chang Lee, Kai-Ning Ku
  • Patent number: 8410982
    Abstract: A unidirectional wireless antenna with a front-to-back ratio of 20 dB comprises a loop antenna and a dipole antenna interconnected by a metallic element and printed on a printed circuit board. The antenna is small in size but provides good unidirectional transmission.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: April 2, 2013
    Assignee: City University of Hong Kong
    Inventors: Edward Kai Ning Yung, Pak Wai Chan, Hang Wong
  • Publication number: 20120154251
    Abstract: An integrated wire elliptical helical antenna with novel cuboids dielectric resonator loading for circularly polarized wave transmission and reception is presented. The antenna is designed to operate in the centre frequency of 915 MHz and it is utilized in RFID systems as a base station antenna. The elliptical structure is formed by steel wire and supporting acrylic plastic. The cuboids dielectric resonator is loaded at the inner surface of the proposed antenna.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 21, 2012
    Inventors: Kai Ning Yung, Pak Wai Chan, Hang Wong, Wenquan Che
  • Publication number: 20120141069
    Abstract: The present invention relates to a waveguide coupling device with properties of forward coupling and backward coupling as well as a manufacturing method thereof, the waveguide coupling device comprises: a substrate, at least one inverted taper coupling structure, an intermediate layer, and at least one three-dimensional taper coupling structure. Wherein one end of the three-dimensional taper coupling structure is adopted for connecting to an external optical fiber, so as to couple the optical wave propagating in the optical fiber; Moreover, by way of the specific coupling sequence of (three-dimensional taper coupling structure)-(intermediate layer)-(inverted taper coupling structure), the optical wave may be efficiently coupled into, be confined in, and ultimately propagates in the inverted taper coupling structure connecting to waveguide devices.
    Type: Application
    Filed: August 10, 2011
    Publication date: June 7, 2012
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Lee Ming-Chang, Ku Kai-Ning
  • Publication number: 20120008896
    Abstract: The present invention relates to an integrate optics for multiplexer transceiver module, comprising: a substrate, a multiplexer, a first waveguide coupling device, a second waveguide coupling device and a third waveguide coupling device. In the present invention, the semiconductor materials and the semiconductor process are used to integrate variety of optical devices on a single semiconductor substrate (chip) by way of modular design and miniaturization, so as to carry out an integrated optics communication framework with high efficiency and low cost. Moreover, in the present invention, a plurality of optical receivers are integrated on the substrate by means of flip-chip bonding, so that, not only the objective of integrating the optical devices is accomplished but also the intensity of laser optical signal is increased.
    Type: Application
    Filed: June 10, 2011
    Publication date: January 12, 2012
    Applicant: NATIONAL TSING-HUA UNIVERSITY
    Inventors: Ming-Chang Lee, Kai-Ning Ku, Chung-Yung Wang, Kuo-Chung Huang, Tsung-Chi Hsu, Chung-Hsin Fu, Lin-Yu Tai
  • Publication number: 20100103061
    Abstract: A unidirectional wireless antenna with a front-to-back ratio of 20 dB comprises a loop antenna and a dipole antenna interconnected by a metallic element and printed on a printed circuit board. The antenna is small in size but provides good unidirectional transmission.
    Type: Application
    Filed: October 23, 2008
    Publication date: April 29, 2010
    Applicant: CITY UNIVERSITY OF HONG KONG
    Inventors: Edward Kai Ning YUNG, Pak Wai CHAN, Hang WONG
  • Publication number: 20090033626
    Abstract: A pad-free radio-frequency mouse includes an ergonomic design such that the mouse is contoured to a user's hand, a Radio-Frequency mouse transmitter, and a USB Radio-Frequency receiver. With the usual mouse pad removed, the cursor on a monitor can be subtly maneuvered by moving one's thumb or fingers over an optical sensor in the mouse. Practically all functions found in existing mice and new functions can be implemented via five or more buttons provided adjacent the optical sensor.
    Type: Application
    Filed: July 31, 2007
    Publication date: February 5, 2009
    Applicant: CITY UNIVERSITY OF HONG KONG
    Inventors: Edward Kai-Ning YUNG, Lee Ming CHENG, Kam Man SHUM, Yin FUNG
  • Patent number: 5888894
    Abstract: A method for reducing stray conductive material near vertical surfaces in semiconductor manufacturing processes comprising the following steps. Deposit the gate oxide, polysilicon and cap oxide layers. Apply a Poly1A mask. The Poly1A mask pattern comprises the Poly1 areas that are part of the final circuit layout as well as additional Poly1 areas that are included to provide planar surfaces to prevent stringer formation. Etch the cap, polysilicon and gate oxide layers to partially form the transistor gate structures. Form oxide spacers on the sides of the transistor gate structures. Apply a source/drain mask. Deposit source/drain dopants to form diffusions. Deposit an interlayer dielectric. Mask and pattern contacts to the diffusions and the Poly1 layer. Deposit blanket TiN/Ti layer(s). Pattern the TiN/Ti layer(s) using a TiN/Ti mask and a dry anisotropic etch. Patterning the TiN/Ti layer(s) may create TiN/Ti stringers along vertical surfaces of the interconnect layer.
    Type: Grant
    Filed: November 7, 1997
    Date of Patent: March 30, 1999
    Assignee: Integrated Silicon Solution, Inc.
    Inventors: Weiran Kong, Kai-Ning Chang