Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.

Abstract: An electronic module, such as a VRM, has a power inductor and power wave pins disposed on a bottom surface of a circuit board so as to reduce the size and increase the heat dissipation capability of the VRM.

Abstract: The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract: An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.

Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.

Abstract: An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract: A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

Abstract: The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

Abstract: A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.