Patents by Inventor Kai-Ping Huang
Kai-Ping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240112323Abstract: A method for detecting defects on a wafer including the steps of obtaining a reference image of a chip pattern formed on a reference wafer, using a computer algorithm to analyze the reference image to produce a division map for the chip pattern; setting respective thresholds for divisions of the division map, obtaining a comparison data between a test image of the chip pattern formed on a test wafer and the reference image, using the division map and the thresholds to examine the comparison data to identify a defect in the test image.Type: ApplicationFiled: November 17, 2022Publication date: April 4, 2024Applicant: United Semiconductor (Xiamen) Co., Ltd.Inventors: Yu Peng Hong, QINGRONG CHEN, Kai Ping Huang, Chin-Chun Huang, WEN YI TAN
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Patent number: 11676959Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.Type: GrantFiled: June 9, 2022Date of Patent: June 13, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Fu Tsai, Tzu-Heng Chang, Yu-Ti Su, Kai-Ping Huang
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Publication number: 20220302105Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Inventors: Ming-Fu Tsai, Tzu-Heng Chang, Yu-Ti Su, Kai-Ping Huang
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Patent number: 11404409Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.Type: GrantFiled: November 16, 2020Date of Patent: August 2, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Fu Tsai, Tzu-Heng Chang, Yu-Ti Su, Kai-Ping Huang
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Patent number: 11387150Abstract: A method of decreasing height differences of STIs includes providing a substrate comprising a peripheral circuit region. The peripheral circuit region includes a P-type transistor region and an N-type transistor region. A first STI and a third STI are respectively disposed within the N-type transistor region and the P-type transistor region. Later, a first mask is formed to cover the N-type transistor region. Then, an N-type well is formed in the P-type transistor region and part of the third STI is removed by taking the first mask as a mask. Next, the first mask is removed. After that, a second mask is formed to cover the P-type transistor region. Subsequently, a P-type well is formed in the N-type transistor region and part of the first STI is removed by taking the second mask as a mask. Finally, the second mask is removed.Type: GrantFiled: December 21, 2020Date of Patent: July 12, 2022Assignee: United Semiconductor (Xiamen) Co., Ltd.Inventors: Hui Min Chen, Song Gu, Kai Ping Huang, Wen Yi Tan
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Publication number: 20220139785Abstract: A method of decreasing height differences of STIs includes providing a substrate comprising a peripheral circuit region. The peripheral circuit region includes a P-type transistor region and an N-type transistor region. A first STI and a third STI are respectively disposed within the N-type transistor region and the P-type transistor region. Later, a first mask is formed to cover the N-type transistor region. Then, an N-type well is formed in the P-type transistor region and part of the third STI is removed by taking the first mask as a mask. Next, the first mask is removed. After that, a second mask is formed to cover the P-type transistor region. Subsequently, a P-type well is formed in the N-type transistor region and part of the first STI is removed by taking the second mask as a mask. Finally, the second mask is removed.Type: ApplicationFiled: December 21, 2020Publication date: May 5, 2022Inventors: Hui Min Chen, SONG GU, Kai Ping Huang, WEN YI TAN
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Publication number: 20210066287Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.Type: ApplicationFiled: November 16, 2020Publication date: March 4, 2021Inventors: Ming-Fu TSAI, Tzu-Heng CHANG, Yu-Ti SU, Kai-Ping HUANG
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Patent number: 10840237Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.Type: GrantFiled: February 9, 2018Date of Patent: November 17, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ming-Fu Tsai, Tzu-Heng Chang, Yu-Ti Su, Kai-Ping Huang
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Publication number: 20180374839Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.Type: ApplicationFiled: February 9, 2018Publication date: December 27, 2018Inventors: Ming-Fu TSAI, Tzu-Heng CHANG, Yu-Ti SU, Kai-Ping HUANG
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Patent number: 8666140Abstract: A defect inspection method for a wafer is provided. The wafer comprises a component pattern. The method comprises the following steps: providing a defect inspection apparatus for inspecting the defects on the wafer to obtain a defect distribution map; providing a photo mask, wherein the photo mask comprises a exposure pattern corresponding to the component pattern; and comparing the defect distribution map with the exposure pattern and dividing the defects in the defect distribution map into a first killer defect group and a first non-killer defect group according to their corresponding locations in the exposure pattern. In addition, a wafer defect inspection system applying the same method is also provided.Type: GrantFiled: January 18, 2012Date of Patent: March 4, 2014Assignee: United Microelectronics Corp.Inventor: Kai-Ping Huang
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Publication number: 20130182938Abstract: A defect inspection method for a wafer is provided. The wafer comprises a component pattern. The method comprises the following steps: providing a defect inspection apparatus for inspecting the defects on the wafer to obtain a defect distribution map; providing a photo mask, wherein the photo mask comprises a exposure pattern corresponding to the component pattern; and comparing the defect distribution map with the exposure pattern and dividing the defects in the defect distribution map into a first killer defect group and a first non-killer defect group according to their corresponding locations in the exposure pattern. In addition, a wafer defect inspection system applying the same method is also provided.Type: ApplicationFiled: January 18, 2012Publication date: July 18, 2013Applicant: UNITED MICROELECRONICS CORPORATIONInventor: Kai-Ping HUANG
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Patent number: 7899635Abstract: A sampling inspection method is provided. The sampling inspection method is adapted for a multi-product production line including a plurality of tools. The sampling inspection method includes the steps of: providing a tool record, which records a sampling data of each of the tools; then checking each sampling data recorded in the tool record, and finding out at least one unsampled tool from the tools; then defining a plurality of product lots as being performed with process operations by at least one of the at least one unsampled tool; and determining at least one of the product lots for performing a sampling inspection.Type: GrantFiled: September 19, 2008Date of Patent: March 1, 2011Assignee: United Microelectronics Corp.Inventors: Kai-Ping Huang, Sung-Lin Tsai, Michael Kian Ann Wee, Boon-Wah Chong
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Publication number: 20100076584Abstract: A sampling inspection method is provided. The sampling inspection method is adapted for a multi-product production line including a plurality of tools. The sampling inspection method includes the steps of: providing a tool record, which records a sampling data of each of the tools; then checking each sampling data recorded in the tool record, and finding out at least one unsampled tool from the tools; then defining a plurality of product lots as being performed with process operations by at least one of the at least one unsampled tool; and determining at least one of the product lots for performing a sampling inspection.Type: ApplicationFiled: September 19, 2008Publication date: March 25, 2010Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kai-Ping Huang, Sung-Lin Tsai, Michael Kian Ann Wee, Boon-Wah Chong
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Publication number: 20080261384Abstract: A method of removing a photoresist layer is provided. An ion implantation process has been performed on the photoresist layer to transform a surface of the photoresist layer to a crust and a soft photoresist layer remains within the crust. The method includes performing a first removing step to remove the crust, such that the soft photoresist layer is exposed. Thereafter, a second removing step is performed to remove the soft photoresist layer. The first and the second removing steps are performed in difference chambers, and a temperature for performing the first removing step is lower than that for performing the second removing step and lower than a gasification temperature of a solvent in the soft photoresist layer.Type: ApplicationFiled: April 18, 2007Publication date: October 23, 2008Applicant: UNITED MICROELECTRONICS CORP.Inventors: Zhi-Qiang Sun, Xi PEI, Tien-Cheng Lan, Yu-Jou Chen, Guo-Fu Zhou, Kai-Ping Huang, Hong-Siek Gan, Jian-Peng Yan, Kai YANG, Sheng ZHANG