Patents by Inventor Kai-Po Chang
Kai-Po Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240137431Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.Type: ApplicationFiled: January 16, 2023Publication date: April 25, 2024Applicants: Chung Yuan Christian University, KGI Securities Co. Ltd.Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
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Patent number: 11863412Abstract: A packet information analysis method and a network traffic monitoring device are disclosed. The method includes the following. Network flow data including a plurality of network packets is obtained. An index parameter is generated according to packet information (e.g., header information) of the first network packet among the network flow. A target mapping model is determined from a plurality of candidate mapping models according to the index parameter. The index parameter is between a first sampling point and a second sampling point of the target mapping model. An interpolation mapping value is obtained according to the index parameter, the first sampling point, the second sampling point, and the target mapping model. An evaluation value is obtained according to the interpolation mapping value. The evaluation value reflects a distribution status of a monitoring item in the network traffic flows.Type: GrantFiled: May 20, 2022Date of Patent: January 2, 2024Assignee: Chung Yuan Christian UniversityInventors: Yu-Kuen Lai, Cheng-Lin Tsai, Kai-Po Chang
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Publication number: 20230300046Abstract: A packet information analysis method and a network traffic monitoring device are disclosed. The method includes the following. Network flow data including a plurality of network packets is obtained. An index parameter is generated according to packet information (e.g., header information) of the first network packet among the network flow. A target mapping model is determined from a plurality of candidate mapping models according to the index parameter. The index parameter is between a first sampling point and a second sampling point of the target mapping model. An interpolation mapping value is obtained according to the index parameter, the first sampling point, the second sampling point, and the target mapping model. An evaluation value is obtained according to the interpolation mapping value. The evaluation value reflects a distribution status of a monitoring item in the network traffic flows.Type: ApplicationFiled: May 20, 2022Publication date: September 21, 2023Applicant: Chung Yuan Christian UniversityInventors: Yu-Kuen Lai, Cheng-Lin Tsai, Kai-Po Chang
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Patent number: 10602639Abstract: Examples herein disclose a heatsink including an extension portion and a base portion. The extension portion extends above a processing component to a fan, such that the extension prevents a heated air produced by the processing component to combine with cool air from the fan. The base portion, coupled to the extension portion, receives cool air from the fan via the extension portion and transfers heat from a different processing component in a posterior location to the processing component.Type: GrantFiled: April 15, 2016Date of Patent: March 24, 2020Assignee: Hewlett Packard Enterprise Development LPInventors: Kai Po Chang, Guo Sheng Mo, Chi Wei Cheng, Ting Shih Chang
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Publication number: 20190053401Abstract: Examples herein disclose a heatsink including an extension portion and a base portion. The extension portion extends above a processing component to a fan, such that the extension prevents a heated air produced by the processing component to combine with cool air from the fan. The base portion, coupled to the extension portion, receives cool air from the fan via the extension portion and transfers heat from a different processing component in a posterior location to the processing component.Type: ApplicationFiled: April 15, 2016Publication date: February 14, 2019Inventors: Kai Po Chang, Guo Sheng Mo, Chi Wei Cheng, Ting Shih Chang
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Patent number: 7554809Abstract: A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one spring plate. The heat conducting plate includes a pressing surface and an abutment surface. The spring plate includes at least one fixing section and a plurality of pressing sections extending from the fixing section. When the fixing section of the spring plate is fixed to the circuit board, each of the pressing sections applies a force to press the heat conducting plate towards the heat-generating element, so as to attach the abutment surface on the heat-generating element, and conduct heat generated by the heat-generating element to the heat conducting plate. Thus, a plurality of forces pressing the heat conducting plate downward is provided with a simple structure.Type: GrantFiled: February 9, 2007Date of Patent: June 30, 2009Assignee: Inventec CorporationInventor: Kai-Po Chang
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Patent number: 7468888Abstract: A heatsink assembly structure is provided. The heatsink assembly structure includes a heat conducting board attached to a heat-generating element, pressing members fixed to the heat conducting board, and spring plates penetrating through the heat conducting board. A plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs. Two ends of the spring plates penetrate through the through holes, and are fixed to the pressing members between the through holes. When the spring plates are fixed to the circuit board, the spring plates apply forces that pull the heat conducting board towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element to conduct heat to the heat conducting board. Thus, a plurality of forces pressing the heat conducting board downward is provided with a simple structure.Type: GrantFiled: February 9, 2007Date of Patent: December 23, 2008Assignee: Inventec CorporationInventor: Kai-Po Chang
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Publication number: 20080192439Abstract: A heatsink assembly structure combined with a heat-generating element disposed on a circuit board is provided. The heatsink assembly structure includes a heat conducting plate and at least one spring plate. The heat conducting plate includes a pressing surface and an abutment surface. The spring plate includes at least one fixing section and a plurality of pressing sections extending from the fixing section. When the fixing section of the spring plate is fixed to the circuit board, each of the pressing sections applies a force to press the heat conducting plate towards the heat-generating element, so as to attach the abutment surface on the heat-generating element, and conduct heat generated by the heat-generating element to the heat conducting plate. Thus, a plurality of forces pressing the heat conducting plate downward is provided with a simple structure.Type: ApplicationFiled: February 9, 2007Publication date: August 14, 2008Applicant: INVENTEC CORPORATIONInventor: Kai-Po Chang
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Publication number: 20080192438Abstract: A heatsink assembly structure is provided. The heatsink assembly structure includes a heat conducting board attached to a heat-generating element, pressing members fixed to the heat conducting board, and spring plates penetrating through the heat conducting board. A plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs. Two ends of the spring plates penetrate through the through holes, and are fixed to the pressing members between the through holes. When the spring plates are fixed to the circuit board, the spring plates apply forces that pull the heat conducting board towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element to conduct heat to the heat conducting board. Thus, a plurality of forces pressing the heat conducting board downward is provided with a simple structure.Type: ApplicationFiled: February 9, 2007Publication date: August 14, 2008Applicant: INVENTEC CORPORATIONInventor: Kai-Po Chang