Patents by Inventor Kai Schiemenz

Kai Schiemenz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230328875
    Abstract: An electronic component for high-frequency applications, in which an integrated circuit with a chip for processing high-frequency signals are arranged together with at least one signal coupling element or launcher for coupling and/or decoupling high-frequency signals in a common housing substrate. A land grid array (LGA) structure is provided on an outside of the housing substrate. An electrically conductive border is provided around the respective launcher on the surface of the housing substrate.
    Type: Application
    Filed: March 13, 2023
    Publication date: October 12, 2023
    Inventors: Kevin Stella, Christian Hollaender, Juergen Seiz, Kai Schiemenz, Klaus Baur, Marcel Mueller, Soeren Mjoernell