Abstract: A wafer is probed using a probe card including a plurality of probing sites following a first probing map in which touchdowns of the probe card involve the plurality of probing sites to identify faulty locations. Whether at least one faulty site exists is determined based on the faulty locations. When the at least one faulty site exists, a second probing map in which each touchdown is free of at least one disabled probing site including the at least one faulty site is obtained. The second probing map is selected when a first criterion formed using a first touchdown count (TDC) in the first probing map, a second TDC in the second probing map, a third TDC based on re-probing the faulty locations and a fourth TDC based on re-probing a portion of the faulty locations not induced by the at least one faulty site is met.

Abstract: A wafer is probed using a probe card including a plurality of probing sites following a first probing map in which touchdowns of the probe card involve the plurality of probing sites to identify faulty locations. Whether at least one faulty site exists is determined based on the faulty locations. When the at least one faulty site exists, a second probing map in which each touchdown is free of at least one disabled probing site including the at least one faulty site is obtained. The second probing map is selected when a first criterion formed using a first touchdown count (TDC) in the first probing map, a second TDC in the second probing map, a third TDC based on re-probing the faulty locations and a fourth TDC based on re-probing a portion of the faulty locations not induced by the at least one faulty site is met.

Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.

Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.

Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.

Abstract: A photovoltaic panel includes a photovoltaic array, an electrically conductive busbar, a plurality of electrically conductive fingers and an electrically conductive ribbon. The electrically conductive busbar is disposed on the photovoltaic array and having a plurality of connection ribs. The electrically conductive fingers are disposed on the photovoltaic array and connected with the connection ribs respectively. The electrically conductive ribbon is soldered on the electrically conductive busbar, wherein a gap is formed between each electrically conductive finger and the electrically conductive ribbon.

Abstract: An electrically conductive ribbon, which is soldered on an electrically conductive busbar of a photovoltaic panel, includes a cooper core and a tin based solder. The tin based solder fully wraps an outer surface of the cooper core, and has a convex solder surface, which has a first curvature to be fitted with a second curvature of a concave solder surface of the electrically conductive busbar.

Abstract: A manufacturing method of electrode of solar cell panel of the present invention comprises steps of providing a semiconductor substrate with an antireflection layer/a dielectric layer and a first metal layer in sequence, forming a first metal layer on the antireflection layer, projecting a pattern on the first metal layer by a laser beam to form a metal silicide on the semiconductor substrate in accordance with the outline of the pattern, removing the first metal layer by a chosen solution, forming a first electrode connecting to the metal silicide and exposed to a surface of the antireflection layer; and forming a second electrode on a surface of the semiconductor substrate opposite to the antireflection layer.

Abstract: A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.

Abstract: A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application.

Abstract: A structure of an optical switch makes the optical switch capable of receiving broadband signals. And the manufacturing procedure is simplified.

Abstract: A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping.

Abstract: A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.

Abstract: A structure of an optical switch makes the optical switch capable of receiving broadband signals. And the manufacturing procedure is simplified.