Abstract: We describe electromechanical systems for IV control. Based on dripping speed measurement by video processing technique, we adjust the position of the presser to press the dripping tube to the appropriate position to control the dripping speed. To do this mechanically, the processing unit issues commands to a stepper motor to control its rotation, and either a leadscrew or its variants, or a cam, is used to translate motor's rotation into presser's linear motion. When the processing unit detects that the dripping is finished, the device will also cut the dripping off immediately with the presser.

Abstract: We describe a method and apparatus for monitoring the dripping speed in IV process, as well as detecting the its end. The apparatus includes a camera and a processing unit to analyze the information from the acquired video. Features from the image sequence are extracted and the dripping speed is computed accordingly by discrete Fourier transform. The apparatus is also capable of detecting the end of the dripping process by finding the location of liquid surface in the drip chamber. We also describe the use of barcode to provide information to the monitoring device and program.

Abstract: We describe an apparatus using an image capturing device to obtain image of the IV container, and uses digital image processing technique to analyze information in the image. We also describe the use of barcode which can read by the apparatus so that relevant information of the drug, container, and the patient can be made use of.

Abstract: A, method, apparatus, system, computer readable medium, and article of manufacture provide the ability to deliver a media content deliverable. Media content is selected. One or more clients that will receive the selected media content are selected. Independently from additional user input, one or more files are automatically and dynamically selected based on the selected media content and one or more selected clients. The selected files are scheduled for delivery to the clients. Delivery of the one or more files to the selected one or more clients is then confirmed.

Abstract: The present invention relates to a method for manufacturing a semiconductor chip package structure including the following steps. A substrate is provided. A plurality of chips are assembled onto the substrate and are electrically connected with the substrate. A stiffener is assembled onto the substrate and the stiffener has a top surface and a bottom surface facing the substrate. A molding compound is formed to cover the semiconductor chip, the substrate, the top surface and the bottom surface of the stiffener. Afterwards, a singulation step is performed to cut the molding compound, the substrate and the stiffener.

Abstract: The present invention relates to a method for manufacturing a semiconductor chip package structure including the following steps. A substrate is provided. A plurality of chips are assembled onto the substrate and are electrically connected with the substrate. A stiffener is assembled onto the substrate and the stiffener has a top surface and a bottom surface facing the substrate. A molding compound is formed to cover the semiconductor chip, the substrate, the top surface and the bottom surface of the stiffener. Afterwards, a singulation step is performed to cut the molding compound, the substrate and the stiffener.