Patents by Inventor Kai Tao

Kai Tao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140340512
    Abstract: When analyzing video frames captured for monitoring the IV dripping process, dew droplets could exist in the image. We discussed image processing methods to remove the dew droplets from the background, including computing the difference between frames and averaging to get a proper background image. We also discussed various methods to keep the temperature of some areas of the inner surface of the drip chamber to be above the dew points in order to prevent dew droplets' formation or to remove them. In the end we showed how video of the dripping process could be shown on external display(s) for devices enclosing the drip chamber inside.
    Type: Application
    Filed: May 20, 2013
    Publication date: November 20, 2014
    Inventor: Kai Tao
  • Publication number: 20140327759
    Abstract: This invention covers all aspects of an automatic IV monitoring and controlling system. It expands and completes the inventor's three earlier applications: U.S. application Ser. Nos. 12/825,368, 12/804,163 and 13/019,698. The monitoring is done by video/image processing. We give details on enhancing and processing the image. Frequency estimation can be done by a variety of techniques and we covered each class by giving at least one example. Then we discussed the mechanical system for speed control in detail covering topics such as actuator, motion guide and tube presser/supporter. In the last we discussed ways of illumination so that clear image can be obtained. A variety of techniques are given but most can be subsumed into the two principles discussed in ยง4.2.
    Type: Application
    Filed: January 23, 2012
    Publication date: November 6, 2014
    Inventor: Kai Tao
  • Patent number: 8531517
    Abstract: We describe a method and apparatus for monitoring the dripping speed in IV process, as well as detecting the its end. The apparatus includes a camera and a processing unit to analyze the information from the acquired video. Features from the image sequence are extracted and the dripping speed is computed accordingly by discrete Fourier transform. The apparatus is also capable of detecting the end of the dripping process by finding the location of liquid surface in the drip chamber. We also describe the use of barcode to provide information to the monitoring device and program.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: September 10, 2013
    Inventor: Kai Tao
  • Publication number: 20120197185
    Abstract: We describe electromechanical systems for IV control. Based on dripping speed measurement by video processing technique, we adjust the position of the presser to press the dripping tube to the appropriate position to control the dripping speed. To do this mechanically, the processing unit issues commands to a stepper motor to control its rotation, and either a leadscrew or its variants, or a cam, is used to translate motor's rotation into presser's linear motion. When the processing unit detects that the dripping is finished, the device will also cut the dripping off immediately with the presser.
    Type: Application
    Filed: February 2, 2011
    Publication date: August 2, 2012
    Inventor: Kai Tao
  • Publication number: 20120013735
    Abstract: We describe a method and apparatus for monitoring the dripping speed in IV process, as well as detecting the its end. The apparatus includes a camera and a processing unit to analyze the information from the acquired video. Features from the image sequence are extracted and the dripping speed is computed accordingly by discrete Fourier transform. The apparatus is also capable of detecting the end of the dripping process by finding the location of liquid surface in the drip chamber. We also describe the use of barcode to provide information to the monitoring device and program.
    Type: Application
    Filed: July 15, 2010
    Publication date: January 19, 2012
    Inventor: Kai Tao
  • Publication number: 20110317004
    Abstract: We describe an apparatus using an image capturing device to obtain image of the IV container, and uses digital image processing technique to analyze information in the image. We also describe the use of barcode which can read by the apparatus so that relevant information of the drug, container, and the patient can be made use of.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 29, 2011
    Inventor: Kai Tao
  • Publication number: 20110219322
    Abstract: A, method, apparatus, system, computer readable medium, and article of manufacture provide the ability to deliver a media content deliverable. Media content is selected. One or more clients that will receive the selected media content are selected. Independently from additional user input, one or more files are automatically and dynamically selected based on the selected media content and one or more selected clients. The selected files are scheduled for delivery to the clients. Delivery of the one or more files to the selected one or more clients is then confirmed.
    Type: Application
    Filed: March 2, 2010
    Publication date: September 8, 2011
    Applicant: TWENTIETH CENTURY FOX FILM CORPORATION
    Inventors: Arjun Ramamurthy, Kai Tao Huang
  • Publication number: 20070087480
    Abstract: The present invention relates to a method for manufacturing a semiconductor chip package structure including the following steps. A substrate is provided. A plurality of chips are assembled onto the substrate and are electrically connected with the substrate. A stiffener is assembled onto the substrate and the stiffener has a top surface and a bottom surface facing the substrate. A molding compound is formed to cover the semiconductor chip, the substrate, the top surface and the bottom surface of the stiffener. Afterwards, a singulation step is performed to cut the molding compound, the substrate and the stiffener.
    Type: Application
    Filed: December 20, 2006
    Publication date: April 19, 2007
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Su TAO, Kuang-Lin Lo, Tsung-Sheng Lee, Yaw-Yuh Yang, Yuan-Kai Tao
  • Publication number: 20040124515
    Abstract: The present invention relates to a method for manufacturing a semiconductor chip package structure including the following steps. A substrate is provided. A plurality of chips are assembled onto the substrate and are electrically connected with the substrate. A stiffener is assembled onto the substrate and the stiffener has a top surface and a bottom surface facing the substrate. A molding compound is formed to cover the semiconductor chip, the substrate, the top surface and the bottom surface of the stiffener. Afterwards, a singulation step is performed to cut the molding compound, the substrate and the stiffener.
    Type: Application
    Filed: September 3, 2003
    Publication date: July 1, 2004
    Inventors: SU TAO, KUANG-LIN LO, TSUNG-SHENG LEE, YAW-YUH YANG, YUAN-KAI TAO