Patents by Inventor Kai-Ting Huang

Kai-Ting Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Patent number: 11894437
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: February 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin Liang, Chih-Chien Chi, Chien-Shun Liao, Keng-Chu Lin, Kai-Ting Huang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang, Cheng-Wei Chang
  • Publication number: 20220367660
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: May 14, 2021
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin Liang, Chih-Chien Chi, Chien-Shun Liao, Keng-Chu Lin, Kai-Ting Huang, Sung-Li Wang, Yi-Ying Liu, Chia-Hung Chu, Hsu-Kai Chang, Cheng-Wei Chang
  • Publication number: 20140049139
    Abstract: A winding method for pole changeable stator is provided by determining a plurality of classification conditions according to plural types of pole, a plural phases, and current characteristic of the winding coupled to each slot of the stator before and after the pole change, coupling the winding of each slot meeting each classification condition thereby obtaining a plurality of winding groups respectively corresponding to the plurality of classification conditions, and, finally, coupling the plurality of winding groups by a plurality of switching elements so as to form a pole changeable stator.
    Type: Application
    Filed: November 5, 2012
    Publication date: February 20, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Tsan Peng, Tzong-Shi Liu, Kai-Ting Huang