Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.

Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element has a feeding point, and is coupled to a first grounding point on the ground element. A slot region is surrounded by the first radiation element and the ground element. The second radiation element is coupled to a second grounding point on the ground element. The third radiation element is coupled to the second grounding point. The third radiation element and the second radiation element substantially extend in opposite directions. The fourth radiation element and the fifth radiation element are disposed inside the slot region. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, and the fifth radiation element.

Abstract: An optical tracking device includes an optical detection module and a target component. The optical detection module includes an optical receiver. The target component includes a light penetrating body with at least one mark and movably disposed adjacent to the optical detection module. The target component allows an illumination beam penetrating into the light penetrating body, so that the optical detection module acquires a detection image containing a pattern of the mark for tracking a relative movement between the target component and the optical detection module.

Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.

Abstract: A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through the wiring area. The protection stacked layer extends from a side of the wiring area adjacent to the device area towards a side of the bonding area and is located on the wirings.

Abstract: A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through the wiring area. The protection stacked layer extends from a side of the wiring area adjacent to the device area towards a side of the bonding area and is located on the wirings.