Patents by Inventor Kai-Ting Yeh

Kai-Ting Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding aluminum oxide to stainless steel
    Patent number: 8220695
    Abstract: Disclosed is a method for bonding stainless steel to aluminum oxide. The method includes the steps of providing a first substrate of the stainless steel, filling solder in the first substrate, providing a second substrate of the aluminum oxide, filling solder in the second substrate, providing a net, pressing the net, locating the net between the first and second substrates to form a laminate and clamping the laminate, locating the laminate in a vacuum oven, increasing the temperature in the vacuum oven, retaining the temperature in the vacuum oven, and decreasing the temperature in the vacuum oven.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: July 17, 2012
    Assignee: Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of National Defense
    Inventors: Ming-Hsiung Wei, Dong-Hau Kuo, Ren-Kae Shiue, Kai-Ting Yeh