Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a station (STA). In certain configurations, the STA transmits a request-to-send (RTS) frame in an enhanced long range (ELR) format for obtaining a transmission opportunity (TXOP). The STA receives a first clear-to-send (CTS) frame in the ELR format or a non-ELR format responding to the RTS frame. In response to receiving the first CTS frame, the STA transmits data in the ELR format in the TXOP. In certain configurations, the STA further receives an acknowledgement in the same format as the first CTS frame for responding to the data being transmitted. In certain configurations, prior to transmitting the RTS frame, the STA transmits a CTS-to-Self frame in the non-ELR format.

Abstract: A lighting device includes a driver, a first light string, a second light string, a constant current controller and a pulse width modulation controller. The driver is configured to provide a DC driving current to a shunt node. The first light string is electrically coupled between the shunt node and a ground terminal, and the first light string is driven by a first pulsating direct current. The second light string and the constant current controller are electrically coupled in series between the shunt node and the ground terminal. The pulse width modulation controller is configured to provide a pulse signal to the constant current controller, and the constant current controller controls a pulse frequency of a second pulsating direct current supplied for the second light string according to the pulse signal.

Abstract: Some implementations described herein include systems and techniques for fabricating a stacked die product. The systems and techniques include using a supporting fill mixture that includes a combination of types of composite particulates in a lateral gap region of a stack of semiconductor substrates and along a perimeter region of the stack of semiconductor substrates. One type of composite particulate included in the combination may be a relatively smaller size and include a smooth surface, allowing the composite particulate to ingress deep into the lateral gap region. Properties of the supporting fill mixture including the combination of types of composite particulates may control thermally induced stresses during downstream manufacturing to reduce a likelihood of defects in the supporting fill mixture and/or the stack of semiconductor substrates.

Abstract: An optical detector module can be used to implement proximity sensing function by detecting ambient light outside of the optical detector module in accordance with a first detection threshold. An optical detector module can be further used to implement other active functions such as material detection (e.g., skin) or depth-sensing by emitting one or more optical signals (e.g., light pulses at a specific wavelength) and detecting the reflected optical signals relative to a second and/or third detection threshold. The disclosure provides technical solutions for actively monitoring detection threshold(s) of an optical detector module to achieve better power management. In some embodiments, such solutions are useful for photodetectors having a wide sensing bandwidth, such as a photodetector formed in germanium or a photodetector comprising an absorption region comprising germanium.

Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.

Abstract: Techniques pertaining to efficient and flexible frequency domain (FD) aggregated physical-layer protocol data unit (FD-A-PPDU) with the same and/or mixed WiFi generations transmission are described. An apparatus (e.g., a station (STA)) performs a wireless communication by: (i) transmitting a FD-A-PPDU or (ii) receiving the FD-A-PPDU. The wireless communication is performed in a 160 MHz, 240 MHz, 320 MHz, 480 MHz or 640 MHz bandwidth with 80 MHz being a minimum size of each of multiple PPDUs of the FD-A-PPDU. The FD-A-PPDU may be a 160 MHz, 240 MHz, 320 MHz, 480 MHz or 640 MHz FD-A-PPDU. The FD-A-PPDU may include PPDUs having a same PPDU format or different PPDU formats of different WiFi generations and utilizing a minimum size of 80 MHz non-overlapping frequency subblocks as a base building block.

Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.

Abstract: A test interface circuit includes N switches and N resistors, wherein N is a positive integer. A first end of each of the N switches is coupled to each of N test connection ends, a second end of each of the N switches receives a reference voltage. Each of the N first resistors is coupled to each of the N switches in series between each of the N test connection ends and the reference voltage. Wherein, each of the N switches is controlled by each of N control signals to be turned on or cut off.

Abstract: A light source assembly includes a first annular reflector, a second annular reflector and a plurality of first light source modules. The first annular reflector has a first reflective surface. The second annular reflector is coaxial with the first annular reflector. A radius of the first annular reflector is greater than that of the second annular reflector. The second annular reflector has a second reflective surface facing the first reflective surface. The first light source modules take a central axis of the first annular reflector as a center and annularly arranged around the center. The first light source modules provide first beams to the first reflective surface, which reflects the first beams to the second reflective surface. The second reflective surface reflects the first beams and makes the first beams emit along a direction parallel to a central axis of the second annular reflector. A projection device is also provided.

Abstract: A voltage tracking circuit is provided. The voltage tracking circuit includes first and second P-type transistors and a control circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The gate and the drain of the second P-type transistor are respectively coupled to the first voltage terminal and a second voltage terminal. The control circuit is coupled to the first and second voltage terminals and generates a control voltage according to the first voltage and the second voltage. The sources of the first and second P-type transistors are coupled to an output terminal of the voltage tracking circuit, and the output voltage is generated at the output terminal. In response to the second voltage being higher than the first voltage, the control circuit generates the control signal to turn off the first P-type transistor.

Abstract: An optical system may include a light source to provide a beam of light. The optical system may include a reflector to receive and redirect the beam of light. The optical system may include a light gate having an opening to permit the beam of light, from the reflector, to travel through the opening. The optical system may include a light sensor to receive a portion of the beam of light after the beam of light travels through the opening, and convert the portion of the beam of light to a signal. The optical system may include a processing device to determine whether a notch of a wafer is in an allowable position based on the signal.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: An image resolution processing method includes: obtaining motion information of a display apparatus; determining a motion direction and rate information of the display apparatus according to the motion information; determining, according to the motion direction, a target object that is at least one of a horizontal resolution and a vertical resolution; determining a target value according to the rate information and a standard resolution of the display apparatus; and generating a to-be-displayed image, a value of the target object in an image resolution of the to-be-displayed image being equal to the target value.

Abstract: An image resolution processing method includes: obtaining motion information of a display apparatus; determining a motion direction and rate information of the display apparatus according to the motion information; determining, according to the motion direction, a target object that is at least one of a horizontal resolution and a vertical resolution; determining a target value according to the rate information and a standard resolution of the display apparatus; and generating a to-be-displayed image, a value of the target object in an image resolution of the to-be-displayed image being equal to the target value.

Abstract: A method for providing demonstration information in a simulation environment and associated simulation system are provided. The method includes: controlling a head mounted display (HMD) device of the simulation system to present the simulation environment and allow a user of the simulation system to see the simulation environment when wearing the HMD device on the user's head; controlling the HMD device to display a first controller in the simulation environment, to allow the user to interact with the simulation environment; controlling the HMD device to display a menu including a plurality of items, to allow the user to select an item of the plurality of items with aid of the first controller; and controlling the HMD device to display a predetermined space associated to a product corresponding to the item, wherein the predetermined space is different from default space of the simulation environment, and includes demonstration information of the product.

Abstract: A method for providing demonstration information in a simulation environment and associated simulation system are provided. The method includes: controlling a head mounted display (HMD) device of the simulation system to present the simulation environment and allow a user of the simulation system to see the simulation environment when wearing the HMD device on the user's head; controlling the HMD device to display a first controller in the simulation environment, to allow the user to interact with the simulation environment; controlling the HMD device to display a menu including a plurality of items, to allow the user to select an item of the plurality of items with aid of the first controller; and controlling the HMD device to display a predetermined space associated to a product corresponding to the item, wherein the predetermined space is different from default space of the simulation environment, and includes demonstration information of the product.