Patents by Inventor Kai-Wei LIAO

Kai-Wei LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WATER-BASED COATING MATERIAL AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210198522
    Abstract: A method for manufacturing a water-based coating material is provided, including: (a) reacting tetraalkoxysilane, acidic aqueous solution of vanadium salt, and trialkoxyalkylsilane to form an oligomer; (b) reacting the oligomer with colloidal silica particles to form a modified oligomer; and (c) reacting the modified oligomer with trialkoxyepoxysilane to obtain a water-based coating material.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 1, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Wei LIAO, Wei-Cheng TANG, Ya-Tin YU, Yun-Shan HUANG, Yeu-Kuen WEI, Cheng-Yang TSAI, Yi-Che SU
  • Polymer and coating material
    Patent number: 10787590
    Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 29, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Wei Liao, Wei-Cheng Tang, Yi-Tzu Peng, Ya-Tin Yu, Yi-Che Su
  • POLYMER AND COATING MATERIAL
    Publication number: 20200208006
    Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
    Type: Application
    Filed: December 26, 2018
    Publication date: July 2, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kai-Wei LIAO, Wei-Cheng TANG, Yi-Tzu PENG, Ya-Tin YU, Yi-Che SU