Patents by Inventor Kai-Wei Lin

Kai-Wei Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145733
    Abstract: Provided a catalyst for OER/ORR, including: an alloy oxide core having a particle size of 30 to 40 nm; and a carbon layer having a thickness of 1 to 7 nm, which is coated on a surface of the alloy oxide core, wherein the alloy oxide is a ternary to quinary alloy oxide, and the metal element contained in the alloy oxide is a transition metal element. Also provided is a method for preparing catalysts for OER/ORR by an electrospinning process. Accordingly, the prepared catalyst has excellent OER and ORR characteristics.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 2, 2024
    Inventors: Jyh-Ming TING, Kai-Wei LIN
  • Publication number: 20240107414
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
  • Patent number: 11940828
    Abstract: A voltage tracking circuit is provided. The voltage tracking circuit includes first and second P-type transistors and a control circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The gate and the drain of the second P-type transistor are respectively coupled to the first voltage terminal and a second voltage terminal. The control circuit is coupled to the first and second voltage terminals and generates a control voltage according to the first voltage and the second voltage. The sources of the first and second P-type transistors are coupled to an output terminal of the voltage tracking circuit, and the output voltage is generated at the output terminal. In response to the second voltage being higher than the first voltage, the control circuit generates the control signal to turn off the first P-type transistor.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: March 26, 2024
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Shao-Chang Huang, Yeh-Ning Jou, Ching-Ho Li, Kai-Chieh Hsu, Chun-Chih Chen, Chien-Wei Wang, Gong-Kai Lin, Li-Fan Chen
  • Patent number: 11942445
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Chin-Wei Kang, Kai-Jun Zhan, Wen-Hsiung Lu, Cheng-Jen Lin, Ming-Da Cheng, Mirng-Ji Lii
  • Publication number: 20240097011
    Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY LIMITED
    Inventors: Han-Yu LIN, Fang-Wei LEE, Kai-Tak LAM, Raghunath PUTIKAM, Tzer-Min SHEN, Li-Te LIN, Pinyen LIN, Cheng-Tzu YANG, Tzu-Li LEE, Tze-Chung LIN
  • Publication number: 20240083742
    Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Kai-Di WU, Ming-Da CHENG, Wen-Hsiung LU, Cheng Jen LIN, Chin Wei KANG
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240034979
    Abstract: Provided is a bioreactor apparatus including: a liquid storage chamber for storing a culture medium; a pump for providing pressure to drive the flow of the culture medium; a plurality of culture chambers providing an accommodating space to accommodate the culture medium and a cell to be cultured; and a pipeline connecting the liquid storage chamber, the pump, and the culture chamber to form a closed loop. Also provided is a bioreactor system including the bioreactor apparatus of the present disclosure, the culture medium, and a cell. Further provided is a method for culturing a cell or an organoid by the bioreactor apparatus of the present disclosure. The bioreactor apparatus, bioreactor system, and method of the present disclosure can form a biomimetic circulatory system, which is beneficial for simulating and evaluating the complex microenvironment and physiological mechanism in the living body.
    Type: Application
    Filed: July 26, 2023
    Publication date: February 1, 2024
    Applicant: NATIONAL CENTRAL UNIVERSITY
    Inventors: Ching-Yun CHEN, Feng-Huei LIN, Jui-Sheng SUN, Cherng-Jyh KE, Fu-Chiang YEH, Chun-Yi PENG, Jia-Ci JHANG, Kai-Wei LIN, Qi-Hong HONG, Yu-Syuan DING
  • Publication number: 20180008045
    Abstract: The present patent discloses a backboard fastener, comprising a male buckle and a female buckle; the male buckle and the female buckle are fitted to each other; a plurality of barbs are provided at one end of the male buckle, while a pressing face is provided at the other end thereof; and, a plurality of externally circular barbs are provided on the female buckle, an enlarged opening is provided at one end of the female buckle, and bumps corresponding to the barbs are provided inside the female buckle. The present patent has a simple structure, solves the problem of nail or screw rusting, does not need any mounting tool, and has a plurality of barbs so that falling-off is prevented. The present patent is suitable for components of various thicknesses and various occasions.
    Type: Application
    Filed: November 7, 2016
    Publication date: January 11, 2018
    Inventor: Kai-Wei LIN
  • Publication number: 20180010626
    Abstract: The present patent discloses an expansive fastener, comprising a male buckle and a female buckle, wherein the male buckle comprises a main body, round-head bumps and a front opening, the front opening being located at a front end of the body and being conical, the circular head bumps being located in front of the main body and behind the front opening, a rear end of the main body being connected to a pressing face; and, the female buckle comprises a main body, grooves, an enlarged opening, externally circular barbs and a cone, the enlarged opening being located at the rearmost end of the main body, both the grooves and the cone being located inside the main body, the externally circular barbs being sheathed outside the main body. With the round-head bumps, the detachability is excellent and it is convenient for mounting and replacement.
    Type: Application
    Filed: November 7, 2016
    Publication date: January 11, 2018
    Inventor: Kai-Wei LIN
  • Publication number: 20170343036
    Abstract: The present patent discloses a device for preventing components from loosening caused by reverse travel, comprising a shell and a cylindrical pin, wherein the cylindrical pin is clamped inside the shell, is in sliding connection with the shell and is capable of retracting into or extending out of the shell. Because of the presence of track positioning, the device disclosed by the present patent can ensure the positioning of the installed components just by performing positioning while fasteners are installed, can avoid the situation of reverse rotation or slip of the components and can be assembled without using any tool or spare parts kit. The device disclosed by the present patent is a hidden device which is automatically telescopic following actions, thereby being convenient to operate and not affecting the appearance.
    Type: Application
    Filed: November 1, 2016
    Publication date: November 30, 2017
    Inventor: Kai-Wei LIN
  • Patent number: 8787807
    Abstract: A printer having a body and a fixing mechanism is provided. The body has a first transporting track. The fixing mechanism has a heating mechanism and a pressurized mechanism, and the first transporting track is disposed between the heating mechanism and the pressurized mechanism. During a printing procedure, the heating mechanism provides a toner fixed temperature, and the pressurized mechanism provides a toner fixed pressure. During laminating procedure, the heating mechanism provides a laminating temperature, and the pressurized mechanism provides a laminating pressure. There is no additional laminating mechanism disposed inside the printer. The printer can execute a toner fixed function or a laminating function by adjusting the temperature and the pressure of the fixing mechanism originally disposed in the printer.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: July 22, 2014
    Assignees: Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc.
    Inventor: Kai-Wei Lin
  • Patent number: 8686178
    Abstract: The present invention is correlated with a derivative of 18?-glycyrrhetinic acid apt to suppressing cancer cells, which is selected from a group comprising of structure I and structure II: wherein residue R1 is selected from one of CH3 and CH2C6H5, residue R2 is selected from one of COOCH3, COOCH2CH3, COOCH(CH3)2, CONHCH2CH3, CONHCH2CH2CH3, and CONHCH2(CH3)2, and residue R3 is selected from one of COOCH2CH3, COOCH(CH3)2, CONHCH2CH3, CONHCH2CH2CH3, and CONHCH2(CH3)2.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: April 1, 2014
    Assignee: Kaohsiung Medical University
    Inventors: Chun-Nan Lin, Kai-Wei Lin, A-Mei Huang, Tzyh-Chyuan Hour, Shyh-Chyun Yang, Yeong-Shiau Pu, Jan-Gowth Chang
  • Publication number: 20130109752
    Abstract: The present invention is correlated with a derivative of 18?-glycyrrhetinic acid apt to suppressing cancer cells, which is selected from a group comprising of structure I and structure II: wherein residue R1 is selected from one of CH3 and CH2C6H5, residue R2 is selected from one of COOCH3, COOCH2CH3, COOCH(CH3)2, CONHCH2CH3, CONHCH2CH2CH3, and CONHCH2(CH3)2, and residue R3 is selected from one of COOCH2CH3, COOCH(CH3)2, CONHCH2CH3, CONHCH2CH2CH3, and CONHCH2(CH3)2.
    Type: Application
    Filed: March 14, 2012
    Publication date: May 2, 2013
    Inventors: Chun-Nan Lin, Kai-Wei Lin, A-Mei Huang, Tzyh-Chyuan Hour, Shyh-Chyun Yang, Yeong-Shiau Pu, Jan-Gowth Chang
  • Publication number: 20130089348
    Abstract: A printer having a body and a fixing mechanism is provided. The body has a first transporting track. The fixing mechanism has a heating mechanism and a pressurized mechanism, and the first transporting track is disposed between the heating mechanism and the pressurized mechanism. During a printing procedure, the heating mechanism provides a toner fixed temperature, and the pressurized mechanism provides a toner fixed pressure. During laminating procedure, the heating mechanism provides a laminating temperature, and the pressurized mechanism provides a laminating pressure. There is no additional laminating mechanism disposed inside the printer. The printer can execute a toner fixed function or a laminating function by adjusting the temperature and the pressure of the fixing mechanism originally disposed in the printer.
    Type: Application
    Filed: August 3, 2012
    Publication date: April 11, 2013
    Applicants: Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventor: Kai-Wei Lin
  • Publication number: 20090148328
    Abstract: A lubricant backflow structure of a compressor includes a casing, a scrolling set, and a transmission mechanism. An oil tank is arranged under the casing, an internally longitudinal wall of which is formed as an oil backflow passage, an inlet of which is corresponded to one side of the scrolling set for receiving a lubricant, and an outlet of which is formed above the oil tank. Thereby, when a working fluid (e.g. refrigerant) enters into the casing, it won't mix with the lubricant therein, capable of reducing oil consumption and enhancing thermally exchanging efficiency of the system.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 11, 2009
    Inventors: Chung-Hung YEH, Kai-Wei Lin, Wei-Ting Hsu, Hsun-An Li