Patents by Inventor KAI-WEI TSENG

KAI-WEI TSENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11548578
    Abstract: A modular vehicle body includes a pair of outer frames. An inner board space with a fixed width is defined between the outer frames. Each outer frame includes a front side board and a door sill. The front side board includes a main board provided with a vertical board having a predetermined width. A first flange is provided on a side of the vertical board. The door sill includes an inner board provided with a horizontal board having a predetermined width. A second flange is provided on a side of the horizontal board. The inner board is fixedly coupled to the main board. The first flange and the second flange form an outer edge. A width between the outer edges of the pair of outer frames is set to correspond to a width of a vehicle body.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: January 10, 2023
    Assignee: Foxtron Vehicle Technologies Co., Ltd.
    Inventors: Chia-Hong Chen, Kai-Wei Tseng, Chih-Ming Lai
  • Publication number: 20220111917
    Abstract: A modular vehicle body includes a pair of outer frames. An inner board space with a fixed width is defined between the outer frames. Each outer frame includes a front side board and a door sill. The front side board includes a main board provided with a vertical board having a predetermined width. A first flange is provided on a side of the vertical board. The door sill includes an inner board provided with a horizontal board having a predetermined width. A second flange is provided on a side of the horizontal board. The inner board is fixedly coupled to the main board. The first flange and the second flange form an outer edge. A width between the outer edges of the pair of outer frames is set to correspond to a width of a vehicle body.
    Type: Application
    Filed: March 31, 2021
    Publication date: April 14, 2022
    Inventors: CHIA-HONG CHEN, KAI-WEI TSENG, CHIH-MING LAI