Patents by Inventor Kai-Wei Yeh

Kai-Wei Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure for mounting ultrasonic sensor
    Patent number: 10690758
    Abstract: A structure for attaching an ultrasound sensor to a side portion of a vehicle includes a bracket via which the ultrasound sensor is attached to face the ground under the floor of the vehicle and to be inclined at a predetermined angle with respect to the horizontal plane such that water drops adhering to the ultrasound sensor flow downward.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: June 23, 2020
    Inventors: Yasuhiro Tamura, Ryoichi Enoki, Shoji Yokoyama, Jun Sugimoto, Tatsuya Tachibana, Yangjian Li, Takuya Tamura, Qi Chen, Kai-Wei Yeh, Cheng-Hung Tsai, Yu-Ming Lee
  • STRUCTURE FOR MOUNTING ULTRASONIC SENSOR
    Publication number: 20190265341
    Abstract: A structure for attaching an ultrasound sensor to a side portion of a vehicle includes a bracket via which the ultrasound sensor is attached to face the ground under the floor of the vehicle and to be inclined at a predetermined angle with respect to the horizontal plane such that water drops adhering to the ultrasound sensor flow downward.
    Type: Application
    Filed: August 30, 2018
    Publication date: August 29, 2019
    Applicants: Honda Access Corp., Honda Access Taiwan Co., Ltd., Whetron Electronics Co., Ltd.
    Inventors: Yasuhiro Tamura, Ryoichi Enoki, Shoji Yokoyama, Jun Sugimoto, Tatsuya Tachibana, Yangjian Li, Takuya Tamura, Qi Chen, Kai-Wei Yeh, Cheng-Hung Tsai, Yu-Ming Lee