Patents by Inventor Kai-Wei Yeh

Kai-Wei Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Highly symmetric integrated inductor
    Patent number: 11916098
    Abstract: An integrated inductor is provided. The integrated inductor includes a first winding and a second winding, and has a first end, a second end, and a node. The first winding utilizes the first end and the node as two ends thereof and includes a first coil and a second coil, which do not overlap. The second winding utilizes the second end and the node as two ends thereof and includes a third coil and a fourth coil, which do not overlap. The first coil and the third coil have an overlapping area, and the second coil and the fourth coil have an overlapping area. The first coil is surrounded by the third coil, and the fourth coil is surrounded by the second coil.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: February 27, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Cheng-Wei Luo, Chieh-Pin Chang, Kai-Yi Huang, Ta-Hsun Yeh
  • Structure for mounting ultrasonic sensor
    Patent number: 10690758
    Abstract: A structure for attaching an ultrasound sensor to a side portion of a vehicle includes a bracket via which the ultrasound sensor is attached to face the ground under the floor of the vehicle and to be inclined at a predetermined angle with respect to the horizontal plane such that water drops adhering to the ultrasound sensor flow downward.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: June 23, 2020
    Inventors: Yasuhiro Tamura, Ryoichi Enoki, Shoji Yokoyama, Jun Sugimoto, Tatsuya Tachibana, Yangjian Li, Takuya Tamura, Qi Chen, Kai-Wei Yeh, Cheng-Hung Tsai, Yu-Ming Lee
  • STRUCTURE FOR MOUNTING ULTRASONIC SENSOR
    Publication number: 20190265341
    Abstract: A structure for attaching an ultrasound sensor to a side portion of a vehicle includes a bracket via which the ultrasound sensor is attached to face the ground under the floor of the vehicle and to be inclined at a predetermined angle with respect to the horizontal plane such that water drops adhering to the ultrasound sensor flow downward.
    Type: Application
    Filed: August 30, 2018
    Publication date: August 29, 2019
    Applicants: Honda Access Corp., Honda Access Taiwan Co., Ltd., Whetron Electronics Co., Ltd.
    Inventors: Yasuhiro Tamura, Ryoichi Enoki, Shoji Yokoyama, Jun Sugimoto, Tatsuya Tachibana, Yangjian Li, Takuya Tamura, Qi Chen, Kai-Wei Yeh, Cheng-Hung Tsai, Yu-Ming Lee