Patents by Inventor KAI-WEN LEE

KAI-WEN LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961768
    Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang, Chih-Hsiang Fan, Kun-Wa Kuok
  • Patent number: 11735843
    Abstract: Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: August 22, 2023
    Assignee: PEGATRON CORPORATION
    Inventors: Yung-Tai Lee, Kai-Wen Lee, Tse-Hao Yang, Yen-Yen Chiu
  • Publication number: 20220109257
    Abstract: Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.
    Type: Application
    Filed: August 13, 2021
    Publication date: April 7, 2022
    Inventors: Yung-Tai Lee, Kai-Wen Lee, Tse-Hao Yang, Yen-Yen Chiu
  • Patent number: 9744092
    Abstract: A limb rehabilitation and training system includes a horizontal position adjuster movably mounted at a bottom side of a base, an expansion rotary member mounted at the horizontal position adjuster, a shoulder joint traction mechanism linked to the expansion rotary member through a first arm segment robotic arm and a height adjuster, and an upper-limb rehabilitation device linked to the shoulder joint traction mechanism. The upper-limb rehabilitation device is able to rapidly be adjusted to fit the left arm or right arm through the horizontal position adjuster, the expansion rotary member, the first arm segment robotic arm and a shoulder positioning-lifting rotary member and. Further, by means of the shoulder joint traction mechanism, the user's stiffened shoulder joint can be timely moved for a separation distance, achieving the function of loosening the joint and facilitating performance of successive rehabilitation treatment or training.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: August 29, 2017
    Assignee: National Taiwan University
    Inventors: Li-Chen Fu, Kai-Wen Lee, Yi-Wen Liao, Wei-Wen Wang, Jin-Shin Lai
  • Publication number: 20140336542
    Abstract: A limb rehabilitation and training system includes a horizontal position adjuster movably mounted at a bottom side of a base, an expansion rotary member mounted at the horizontal position adjuster, a shoulder joint traction mechanism linked to the expansion rotary member through a first arm segment robotic arm and a height adjuster, and an upper-limb rehabilitation device linked to the shoulder joint traction mechanism. The upper-limb rehabilitation device is able to rapidly be adjusted to fit the left arm or right arm through the horizontal position adjuster, the expansion rotary member, the first arm segment robotic arm and a shoulder positioning-lifting rotary member and. Further, by means of the shoulder joint traction mechanism, the user's stiffened shoulder joint can be timely moved for a separation distance, achieving the function of loosening the joint and facilitating performance of successive rehabilitation treatment or training.
    Type: Application
    Filed: November 18, 2013
    Publication date: November 13, 2014
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: LI-CHEN FU, KAI-WEN LEE, YI-WEN LIAO, WEI-WEN WANG, JIN-SHIN LAI