Abstract: Methods for testing a special pattern and testing a probe card defect in wafer testing are provided. In the method for testing the special pattern, a wafer is divided into multiple testing partitions, in which each of the testing partitions includes multiple dies. The dies in each testing partition of the wafer are respectively tested by multiple sites of the probe card to obtain a testing map. Then, a number of the dies having defects and a number of the dies without defect within each of the testing partitions in the testing map are accumulated to construct chi-square test and calculate a maximum P-value. Finally, it is determined whether a minimum of the maximum P-values of all of the testing partitions is smaller than a certain predetermined threshold. If the minimum is smaller than the threshold, it is determined that the testing map of the wafer contains the special pattern.

Abstract: Methods for testing a special pattern and testing a probe card defect in wafer testing are provided. In the method for testing the special pattern, a wafer is divided into multiple testing partitions, in which each of the testing partitions includes multiple dies. The dies in each testing partition of the wafer are respectively tested by multiple sites of the probe card to obtain a testing map. Then, a number of the dies having defects and a number of the dies without defect within each of the testing partitions in the testing map are accumulated to construct chi-square test and calculate a maximum P-value. Finally, it is determined whether a minimum of the maximum P-values of all of the testing partitions is smaller than a certain predetermined threshold. If the minimum is smaller than the threshold, it is determined that the testing map of the wafer contains the special pattern.

Abstract: An inspecting method and an inspecting equipment including a dividing unit, a determining unit, a transferring unit and an inspecting unit for inspecting a disk are provided. The inspecting method includes the following steps. First, a plane is divided into several zones with equal area. Next, several measuring locations are determined within these zones. Next, these measuring locations are transferred into several sets of measuring locations corresponding to the disk through a coordinate transfer. Then, the disk is inspected according to these sets of measuring locations.

Abstract: An inspecting method and an inspecting equipment including a dividing unit, a determining unit, a transferring unit and an inspecting unit for inspecting a disk are provided. The inspecting method includes the following steps. First, a plane is divided into several zones with equal area. Next, several measuring locations are determined within these zones. Next, these measuring locations are transferred into several sets of measuring locations corresponding to the disk through a coordinate transfer. Then, the disk is inspected according to these sets of measuring locations.