Patents by Inventor Kai Y. Chia

Kai Y. Chia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrically conductive high strength dense ceramic
    Patent number: 5322824
    Abstract: A low cost pressureless sintered silicon carbide ceramic composite having relatively high electrical conductivity, relatively high density and relatively great mechanical strength, in comparison to those known to persons skilled in the art, and a process for making such composites.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: June 21, 1994
    Inventor: Kai Y. Chia
  • Silicon carbide bodies having high toughness and fracture resistance and method of making same
    Patent number: 5298470
    Abstract: A sintered silicon carbide ceramic body preferably produced from a uniform mixture comprising from about 82 percent to about 99.4 percent by weight silicon carbide, from about 0.5 percent to about 10 percent by weight of a nitrogen containing aluminum compound and from about 0.1 to about 8 percent of a rare earth oxide, both reacted with oxygen, wherein said sintered ceramic body has a density greater than 90% percent of theoretical and a fracture toughness, as measured by a single edge notched beam test, of more than 7 MPam.sup.1/2 and method of making the same.
    Type: Grant
    Filed: October 9, 1992
    Date of Patent: March 29, 1994
    Assignee: The Carborundum Company
    Inventors: Kai Y. Chia, Wolfgang D. G. Boecker, Roger S. Storm