Abstract: A low-cost and high-strength Bi-based superconducting wire/tape and a preparation method thereof, the preparation method includes: 1. subjecting a first Bi-based superconducting wire/tape to electrochemical silver reduction to remove a Ag alloy layer to obtain a second Bi-based superconducting wire/tape; and 2. subjecting the second Bi-based superconducting wire/tape to surface enhancement, such that a Cu layer is formed to obtain the low-cost and high-strength Bi-based superconducting wire/tape. An electrochemical silver reduction technology combines with an electrochemical additive method to remove a Ag alloy layer on a surface of a Bi-based superconducting wire/tape and coat a high-strength Cu layer, such that a low-cost and high-strength Bi-based superconducting wire/tape can be prepared, which reduces a preparation cost and improves a strength of a Bi-based superconducting wire/tape to meet the application requirements of large super-strong magnets.

Abstract: This application provides a switched capacitor circuit SC and an electronic device. In the SC, when the SC circuit works in different voltage step-down modes, voltage step-down is separately performed in a ratio of 4:1, 2:1, and 1:1 on a voltage at an input end and then a voltage is output at the two ends of the fourth capacitor Co to implement switching of a plurality of voltage step-down ratios.

Abstract: A low-cost and high-strength Bi-based superconducting wire/tape and a preparation method thereof, the preparation method includes: 1. subjecting a first Bi-based superconducting wire/tape to electrochemical silver reduction to remove a Ag alloy layer to obtain a second Bi-based superconducting wire/tape; and 2. subjecting the second Bi-based superconducting wire/tape to surface enhancement, such that a Cu layer is formed to obtain the low-cost and high-strength Bi-based superconducting wire/tape. An electrochemical silver reduction technology combines with an electrochemical additive method to remove a Ag alloy layer on a surface of a Bi-based superconducting wire/tape and coat a high-strength Cu layer, such that a low-cost and high-strength Bi-based superconducting wire/tape can be prepared, which reduces a preparation cost and improves a strength of a Bi-based superconducting wire/tape to meet the application requirements of large super-strong magnets.

Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.

Abstract: A semiconductor process for solving contact piping defect is provided in the present invention, including forming gates on a substrate, forming SiN spacers on sidewalls of the gates and the substrate is exposed from the SiN spacers between adjacent gates, performing an epitaxy process to form Si-based sacrificial layers on the gates and the exposed doped areas, and performing a first etchback process using phosphoric acid to pull back the SiN spacers, and the first etchback process removes the Si-based sacrificial layers.

Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.

Abstract: An aerosol generating device includes an aerosol generator and a plug. The aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber, an aerosol chamber, and an insertion slot defining an insertion direction. The liquid chamber and the aerosol chamber are respectively arranged at two opposite sides of the atomizing module, and are in spatial communication with each other through the atomizing module. The atomizing module includes two electrode regions having the same polarity and being electrically connected to each other. The plug is detachably inserted into the insertion slot of the container along the insertion direction, and a conductive terminal of the plug contacts the two electrode regions.

Abstract: A method of manufacturing a memory structure including the following steps is provided. A first pad layer is formed on a substrate. Isolation structures are formed in the first pad layer and the substrate. At least one shape modification treatment is performed on the isolation structures. Each shape modification treatment includes the following steps. A first etching process is performed on the first pad layer to reduce a height of the first pad layer and to form first openings exposing sidewalls of the isolation structures. After the first etching process is performed, a second etching process is performed on the isolation structures to modify shapes of the sidewalls of the isolation structures exposed by the first openings. The first pad layer is removed to form a second opening between two adjacent isolation structures.

Abstract: An aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber and an aerosol chamber respectively arranged at two opposite sides of the atomizing module. The atomizing module includes an annular vibration plate, a microporous member, and a circuit board. The vibration plate has a first hole, and the microporous member is disposed on the vibration plate and covers the first hole. The circuit board is electrically coupled to an electrical contact of the vibration plate. The circuit board is arranged at one side of at least part of the vibration plate, and the circuit board and the at least part of the vibration plate have a gap there-between. A projected region defined by orthogonally projecting the circuit board onto a plane overlapping with the electrical contact partially covers the least part of the vibration plate.

Abstract: A portable electronic device adapted for connecting to a base is provided. The base has a first connector and an RFID tag. The portable electronic device includes a casing, a second connector, a cover, a control module and an RFID sensor. The second connector is disposed on a lateral surface of the casing and is adapted for connecting to the first connector. The cover is movably disposed on the lateral surface of the casing and corresponds to the second connector, so as to cover or expose the second connector. The RFID sensor is disposed in the casing and is adjacent to the lateral surface. The RFID sensor detects the RFID tag to generate a signal. The control module is disposed in the casing and coupled to the RFID sensor and the cover. The control module controls the cover to move to expose the second connector according to the signal.

Abstract: A method of manufacturing a memory structure including the following steps is provided. A first pad layer is formed on a substrate. Isolation structures are formed in the first pad layer and the substrate. At least one shape modification treatment is performed on the isolation structures. Each shape modification treatment includes the following steps. A first etching process is performed on the first pad layer to reduce a height of the first pad layer and to form first openings exposing sidewalls of the isolation structures. After the first etching process is performed, a second etching process is performed on the isolation structures to modify shapes of the sidewalls of the isolation structures exposed by the first openings. The first pad layer is removed to form a second opening between two adjacent isolation structures.

Abstract: In various embodiments, a computer-implemented method includes identifying data files in external storage, where the data files correspond to a computer software application (application) on a mobile device. The method may also include sorting the one or more data files into different access levels. The method may also include predicting the sorted one or more data files that will be accessed on the mobile device using a prediction engine. The method may also include locating the predicted one or more data files in the external storage using a migration map. The method may also include determining whether the predicted one or more data files were previously migrated to the external storage from the mobile device. The method may also include migrating the predicted one or more data files from the external storage to the mobile device.

Abstract: Disclosed is an adjustable transmission device for measuring transverse parameters of beams, including: a CCD transmission support assembly, an external transmission rod, the CCD transmission support assembly is connected with a support block, and the support block is provided with the slotted set screw with flat point, and is connected with a limit block via a first fastener; a snap ring is arranged in the rear of the external transmission and is matched with a base; the base is connected with the CCD fixed plate via a second fastener. The external transmission rod is provided with a second groove for mounting the first retaining ring, and a side of the first retaining ring is sequentially provided with a vacuum observation window, a second retaining ring, a head assembly, a retaining sleeve and a screwing mechanism.

Abstract: Disclosed is an adjustable transmission device for measuring transverse parameters of beams, including: a CCD transmission support assembly, an external transmission rod, the CCD transmission support assembly is connected with a support block, and the support block is provided with the slotted set screw with flat point, and is connected with a limit block via a first fastener; a snap ring is arranged in the rear of the external transmission and is matched with a base; the base is connected with the CCD fixed plate via a second fastener. The external transmission rod is provided with a second groove for mounting the first retaining ring, and a side of the first retaining ring is sequentially provided with a vacuum observation window, a second retaining ring, a head assembly, a retaining sleeve and a screwing mechanism.

Abstract: An aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber and an aerosol chamber respectively arranged at two opposite sides of the atomizing module. The atomizing module includes an annular vibration plate, a microporous member, and a circuit board. The vibration plate has a first hole, and the microporous member is disposed on the vibration plate and covers the first hole. The circuit board is electrically coupled to an electrical contact of the vibration plate. The circuit board is arranged at one side of at least part of the vibration plate, and the circuit board and the at least part of the vibration plate have a gap there-between. A projected region defined by orthogonally projecting the circuit board onto a plane overlapping with the electrical contact partially covers the least part of the vibration plate.

Abstract: An aerosol generating device includes an aerosol generator and a plug. The aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber, an aerosol chamber, and an insertion slot defining an insertion direction. The liquid chamber and the aerosol chamber are respectively arranged at two opposite sides of the atomizing module, and are in spatial communication with each other through the atomizing module. The atomizing module includes two electrode regions having the same polarity and being electrically connected to each other. The plug is detachably inserted into the insertion slot of the container along the insertion direction, and a conductive terminal of the plug contacts the two electrode regions.

Abstract: In various embodiments, a computer-implemented method includes identifying data files in external storage, where the data files correspond to a computer software application (application) on a mobile device. The method may also include sorting the one or more data files into different access levels. The method may also include predicting the sorted one or more data files that will be accessed on the mobile device using a prediction engine. The method may also include locating the predicted one or more data files in the external storage using a migration map. The method may also include determining whether the predicted one or more data files were previously migrated to the external storage from the mobile device. The method may also include migrating the predicted one or more data files from the external storage to the mobile device.

Abstract: In various embodiments, a computer-implemented method includes identifying data files in external storage, where the data files correspond to a computer software application (application) on a mobile device and where the data files were previously stored on the mobile device. The method may also include sorting the data files into different access levels, where the access levels designate a hierarchy for the data files. The method may also include predicting the sorted data files that will be accessed on the mobile device using a prediction engine. The method may also include locating, in response to the predicting, the predicted data files in the external storage. The method may also include migrating the predicted data files from the external storage to the mobile device, where the migrating is done in order of the access levels.